Modeling of crosstalk in through silicon vias

IEEE Transactions on Electromagnetic Compatibility

Volumn 55, Issue 1, 2013, Pages 149-158

  Engin, A Ege ^a   Narasimhan, Srinidhi Raghavan ^b  

^a AGC Paul S Roel Chair in Construction Engineering and Management   (United States)

^b XILINX INC   (United States)

Author keywords

3D IC; crosstalk; metal insular semiconductor (MIS) transmission line; through silicon via (TSV)

Indexed keywords

3-D INTEGRATED CIRCUIT; ANALYTICAL FORMULAS; CIRCUIT SIMULATORS; EQUIVALENT CIRCUIT MODEL; FULL-WAVE ELECTROMAGNETIC SIMULATION; INTEGRATED SYSTEMS; METAL OXIDE SEMICONDUCTOR; METAL-INSULATOR-SEMICONDUCTORS; MULTI-CONDUCTOR TRANSMISSION LINES; QUASI-STATIC; QUASI-TEM; SLOW WAVE; THROUGH SILICON VIAS; THROUGH-SILICON-VIA (TSV);

CROSSTALK; ELECTRIC LINES; MIS DEVICES; THREE DIMENSIONAL COMPUTER GRAPHICS; TRANSMISSION LINE THEORY;

THREE DIMENSIONAL;

EID: 84873897342     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEMC.2012.2206816     Document Type: Article

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