Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects

Microwave and Optical Technology Letters

Volumn 53, Issue 6, 2011, Pages 1204-1206

  Wu, Boping ^a   Gu, Xiaoxiong ^b   Tsang, Leung ^a   Ritter, Mark B ^b  

^a University of Washington   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

3D interconnects; Foldy Lax equation; multiple scattering technique; signal integrity; through silicon via

Indexed keywords

3-D INTERCONNECTS; LAX EQUATION; MULTIPLE SCATTERING TECHNIQUE; SIGNAL INTEGRITY; THROUGH-SILICON-VIA;

COATINGS; CYLINDERS (SHAPES); ELECTROMAGNETISM; MULTIPLE SCATTERING; SILICON COMPOUNDS; THREE DIMENSIONAL;

SILICON OXIDES;

EID: 79953166095     PISSN: 08952477     EISSN: 10982760     Source Type: Journal    
DOI: 10.1002/mop.26021     Document Type: Article

References (12)

1. M. Koyanagi, T. Fukushima, and, T. Tanaka, High-density through silicon vias for 3-D LSIs, Proc IEEE 97 (2009), 49-59.
2. B. Wu, and, L. Tsang, Modeling multiple vias with arbitrary shape of antipads and pads in high speed interconnect circuits, IEEE Microwave Wireless Comp Lett 19 (2009), 12-14.
3. B. Wu, and, L. Tsang, Full-wave modeling of multiple vias using differential signaling and shared antipad in multilayered high speed vertical interconnects, Prog Electromagn Res 97 (2009), 129-139.
4. B. Wu, and, L. Tsang, Signal integrity analysis of package and printed circuit board with multiple vias in substrate of layered dielectrics, IEEE Trans Adv Packag 33 (2010), 510-516.
5. 2 System, IEEE Trans Microwave Theory Tech 19 (1971), 869-881.
6. K. J. Han, Electromagnetic modeling of interconnections in three-dimensional integration, Ph.D. Dissertation, Georgia Institution of Technology, 2009.
7. J. Cho, J. Shim, E. Song, J. S. Pak, J. Lee, H. Lee, K. Park, and, J. Kim, Active circuit to through silicon via (TSV) noise coupling, In Proceedings of the IEEE Electrical Performance of Electronic Packaging and Systems Conference, 2009, 97-100.
8. T. Bandyopadhyay, R. Chatterjee, D. Chung, M. Swaminathan, and, R. Tummala, Modeling of through silicon and package vias, In Proceedings of the IEEE 3D System Integration Conference, 2009, 1-8.
9. C.-C. Huang, L. Tsang, and, C. H. Chan, Multiple scattering among vias in lossy planar waveguides using SMCG method, IEEE Trans Adv Packag 25 (2002), 181-188. (Pubitemid 35428449)
10. Ansoft Corporation. HFSS™ version 12.0, Ansoft Corporation, Pittsburgh, PA, 2009.
11. L. Tsang, J.A. Kong, and, K.H. Ding, Scattering of electromagnetic waves: theory and applications, Chapter 2, Wiley Interscience, New York, NY, 2000, 102-104.
12. L. Tsang, H. Chen, C.-C. Huang, and, V. Jandhyala, Methods for modeling interactions between massively coupled multiple vias in multilayered electronic packaging structures, US Pat. 7,149,666, 2006.