Design and modeling methodology of vertical interconnects for 3DI applications

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 2, 2011, Pages 163-167

  Gordin, Rachel ^a   Goren, David ^a   Shlafman, Shlomo ^a   Elad, Danny ^a   Scheuermann, Michael ^b   Young, Albert ^b   Liu, Fei ^b   Gu, Xiaoxiong ^b   Tyberg, Christy ^b  

^a IBM HAIFA RESEARCH LAB   (Israel)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Compact models; dispersion effect; frequency dependence; interconnect; three dimensional integration (3DI); through silicon via (TSV)

Indexed keywords

COMPACT MODEL; DISPERSION EFFECT; FREQUENCY DEPENDENCE; INTERCONNECT; THREE DIMENSIONAL INTEGRATION; THROUGH-SILICON VIA;

EID: 84857587945     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2010.2101751     Document Type: Article

References (12)

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