On simplified fast modal analysis for through silicon vias in layered media based upon full-wave solutions

IEEE Transactions on Advanced Packaging

Volumn 33, Issue 2, 2010, Pages 517-523

  Guo, Zhonghai ^a   Pan, Guangwen ^a  

^a Arizona State University   (United States)

Author keywords

Addition theorem; Bessel's functions; Printed circuit board; Signal integrity; Through silicon via; Wave equation

Indexed keywords

ADDITION THEOREM; BESSEL'S FUNCTION; BESSEL'S FUNCTIONS; SIGNAL INTEGRITY; THROUGH-SILICON-VIA;

APPLICATION SPECIFIC INTEGRATED CIRCUITS; DIRECTIONAL PATTERNS (ANTENNA); HELMHOLTZ EQUATION; MATHEMATICAL MODELS; MODAL ANALYSIS; PRINTED CIRCUIT MANUFACTURE; PROGRAMMABLE LOGIC CONTROLLERS; QUALITY ASSURANCE; THREE DIMENSIONAL; THREE DIMENSIONAL COMPUTER GRAPHICS; WAVE EQUATIONS;

PRINTED CIRCUIT BOARDS;

EID: 77952010592     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2033034     Document Type: Article

References (15)

1. T. Wang, R. F. Harrington, and J. R. Mautz, "Quasistatic analysis of a microstrip via through a hole in a ground plane," IEEE Trans. Microwave Theory Tech., vol.36, no.6, pp. 1008-1013, Jun. 1988.
2. G. Pan, X. Zhu, and K. Gilbert, "Analysis of transient behavior of vertical interconnects in stacked circuit board layers using quasi-static techniques," IEEE Trans. Compon., Packag. Manufact. Technol.-Part B, vol.18, no.3, pp. 521-531, Aug. 1995.
3. S. W. Ho, W. Yoon, Q. Zhou, K. Pasad, V. Kripesh, and J. H. Lau, "High RF performance TSV silicon carrier for high frequency application," in Electron. Compon. Technol. Conf., Orlando, FL, 2008, pp. 1946-1952.
4. Z. Guo, G. Pan, S. Hall, and C. Pan, "Broadband characterization of complex permittivity for low loss dielectrics: Circular PC board disk approach," IEEE Trans. Antennas Propag., vol.57, no.10, pp. 3126-3135, Oct. 2009.
5. Q. Gu, Y. Yang, and M. Tassoudji, "Modeling and analysis of vias in multilayered integrated circuits," IEEE Trans. Microwave Theory Tech., vol.41, no.2, pp. 206-214, Feb. 1993.
6. X. Gu, A. E. Ruehli, and M. B. Ritter, "Impedance design for multi-layered vias," Electrical Performance Electron. Packag. Syst., pp. 317-320, 2008.
7. L. Tsang, H. Chen, C. Huang, and V. Jandhyala, "Modeling of multiple scattering among vias in planar waveguides using Foldy-Lax equations," Microwave Opt. Technol. Lett., vol.31, no.3, pp. 201-208, Nov. 2001.
8. C. Ong, B. Wu, L. Tsang, and X. Gu, "Full-wave solver for microstrip trace and through-hole via in layered media," IEEE Trans. Adv. Packag., vol.31, no.2, pp. 292-302, May 2008.
9. B. Wu and L. Tsang, "Modeling multiple vias with arbitrary shape of antipads and pads in high speed interconnect circuits," IEEE Microwave Wireless Compon. Lett., vol.19, no.1, pp. 12-14, Jan. 2009.
10. M. I. Mishchenko, L. D. Travis, and A. A. Lacis, Multiple Scattering of Light by Particles. Cambridge, U.K.: Cambridge Univ. Press, pp. 18-18
11. H. Gan, Q. He, and D. Jiao, "Hierarchical and adaptive finite-element reduction-recovery method for large-scale power and signal integrity analysis of high-speed IC and packaging structures," Electrical Performance Electron. Packag. Syst., pp. 127-130, Oct. 2008.
12. R. Chen, H.Wang, and R. Abhari, "Suppression of power/ground noise using differential vias," Electrical Performance Electron. Packag. Syst., pp. 325-328, Oct. 2008.
13. S. G. Hsu and R. B. Wu, "Full wave characterization of a through hole via using the matrix-penciled moment method," IEEE Trans. Microwave Theory Tech., vol.42, no.8, pp. 1540-1547, Aug. 1994.
14. R. F. Harrington, Field Computation by Moment Methods. Piscataway, NJ: IEEE Press, 1992.
15. G. N.Watson, A Treatise on the Theory of Bessel Functions, 2nd ed. Cambridge: Cambridge Univ. Press, 1948.