Closed-form expressions for the series impedance parameters of on-chip interconnects on multilayer silicon substrates

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 1, 2004, Pages 126-134

  Weisshaar, Andreas ^a   Luoh, Amy ^a  

^a OREGON STATE UNIVERSITY   (United States)

Author keywords

BiCMOS; Closed form expressions; CMOS; Coplanar waveguide; Eddy currents; Line parameters; Microstrip; MMS; On chip interconnects; Silicon substrate

Indexed keywords

EDDY CURRENTS; ELECTRIC IMPEDANCE; MULTILAYERS; SILICON; SUBSTRATES;

ON CHIP INTERCONNECTS; SERIES IMPEDANCE PARAMETERS;

ELECTRONICS PACKAGING;

EID: 2442602403     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.825479     Document Type: Article

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