Time dependent dielectric breakdown in copper low-k interconnects: Mechanisms and reliability models

Materials

Volumn 5, Issue 9, 2012, Pages 1602-1625

  Wong, Terence K S ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Interconnect dielectric breakdown; Low k dielectric; Reliability; Soft breakdown

Indexed keywords

BREAKDOWN MECHANISM; COPPER MIGRATION; DAMASCENE INTERCONNECTS; DIELECTRIC LEAKAGE; DIELECTRIC RELIABILITY; E-MODEL; HARD BREAKDOWN; INTERCONNECT DIELECTRICS; INTRINSIC BREAKDOWN; LOW FIELD; LOW K DIELECTRICS; LOW-K INTERCONNECTS; LOW-K MATERIALS; PHYSICAL ASSUMPTIONS; POOLE-FRENKEL; POROUS ULTRA LOW-K; RELIABILITY MODEL; SCHOTTKY EMISSIONS; SOFT BREAKDOWN; TIME DEPENDENT DIELECTRIC BREAKDOWN;

COPPER; RELIABILITY;

DIELECTRIC MATERIALS;

EID: 84869990893     PISSN: None     EISSN: 19961944     Source Type: Journal    
DOI: 10.3390/ma5091602     Document Type: Review

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