A new TDDB degradation model based on Cu ION drift in Cu interconnect dielectrics

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2006, Pages 484-489

  Suzumura, N ^a   Yamamoto, S ^a   Kodama, D ^a   Makabe, K ^a   Komori, J ^a   Murakami, E ^a   Maegawa, S ^a   Kubota, K ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

Cu interconnect; Cu ion; Field acceleration model; Inter level dielectrics; Poole Frenkel effect; Schottky effect; Time dependent dielectric breakdown

Indexed keywords

FIELD ACCELERATION MODELS; INTER LEVEL DIELECTRICS; POOLE FRENKEL EFFECTS; SCHOTTKY EFFECTS; TIME DEPENDENT DIELECTRIC BREAKDOWN;

ACTIVATION ENERGY; COPPER; ELECTRIC BREAKDOWN; ELECTRIC FIELD EFFECTS; LEAKAGE CURRENTS; MATHEMATICAL MODELS;

DIELECTRIC MATERIALS;

EID: 34250751267     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2006.251266     Document Type: Conference Paper

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