-
1
-
-
0000509119
-
Coating, mechanical constraints, and pressure effects on electromigration
-
Ainslie N.G., d'Heurle F.M., Wells O.C. Coating, mechanical constraints, and pressure effects on electromigration. Appl. Phys. Lett. 1972, 20:173-174.
-
(1972)
Appl. Phys. Lett.
, vol.20
, pp. 173-174
-
-
Ainslie, N.G.1
d'Heurle, F.M.2
Wells, O.C.3
-
2
-
-
0028741076
-
A simple test chip to assess chip and package design in the case of plastic assembling
-
(correction in 1995, 18, 862-863)
-
Alpern P., Wicher V., Tilgner R. A simple test chip to assess chip and package design in the case of plastic assembling. IEEE Trans. Compon. Pack. Manuf. Technol. A 1994, 17:583-589. (correction in 1995, 18, 862-863).
-
(1994)
IEEE Trans. Compon. Pack. Manuf. Technol. A
, vol.17
, pp. 583-589
-
-
Alpern, P.1
Wicher, V.2
Tilgner, R.3
-
3
-
-
0036849829
-
The role of initial flaw size and plasticity in adjacent layers in channeling crack growth in thin films
-
Ambrico J.M., Begley M.R. The role of initial flaw size and plasticity in adjacent layers in channeling crack growth in thin films. Thin Solid Films 2002, 419:144-153.
-
(2002)
Thin Solid Films
, vol.419
, pp. 144-153
-
-
Ambrico, J.M.1
Begley, M.R.2
-
4
-
-
0037066171
-
Cracking in thin multi-layers with finite width and periodic architectures
-
Ambrico J.M., Jones E.E., Begley M.R. Cracking in thin multi-layers with finite width and periodic architectures. Int. J. Solids Struct. 2002, 39:1443-1462.
-
(2002)
Int. J. Solids Struct.
, vol.39
, pp. 1443-1462
-
-
Ambrico, J.M.1
Jones, E.E.2
Begley, M.R.3
-
5
-
-
0014820722
-
Reduction of electromigration in aluminum films by copper doping
-
Ames I., d'Heurle F., Horstmann R. Reduction of electromigration in aluminum films by copper doping. IBM J. Res. Develop. 1970, 14:461-463.
-
(1970)
IBM J. Res. Develop.
, vol.14
, pp. 461-463
-
-
Ames, I.1
d'Heurle, F.2
Horstmann, R.3
-
6
-
-
0000916994
-
Mechanism maps for electromigration-induced failure of metal and alloy interconnects
-
Andleigh V.K., Srikar V.T., Park Y.J., Thompson C.V. Mechanism maps for electromigration-induced failure of metal and alloy interconnects. J. Appl. Phys. 1999, 86:6737-6745.
-
(1999)
J. Appl. Phys.
, vol.86
, pp. 6737-6745
-
-
Andleigh, V.K.1
Srikar, V.T.2
Park, Y.J.3
Thompson, C.V.4
-
7
-
-
0028491015
-
Electromigration failure by shape change of voids in bamboo lines
-
Arzt E., Kraft O., Nix W.D., Sanchez J.E. Electromigration failure by shape change of voids in bamboo lines. J. Appl. Phys. 1994, 76:1563-1571.
-
(1994)
J. Appl. Phys.
, vol.76
, pp. 1563-1571
-
-
Arzt, E.1
Kraft, O.2
Nix, W.D.3
Sanchez, J.E.4
-
8
-
-
0028468445
-
A new procedure for measuring the decohesion energy for thin ductile films on substrate
-
Bagchi A., Lucus G.E., Suo Z., Evans A.G. A new procedure for measuring the decohesion energy for thin ductile films on substrate. J. Mater. Res. 1994, 9:1734-1741.
-
(1994)
J. Mater. Res.
, vol.9
, pp. 1734-1741
-
-
Bagchi, A.1
Lucus, G.E.2
Suo, Z.3
Evans, A.G.4
-
9
-
-
0035902690
-
Thermomechanical behavior of different texture components in Cu thin films
-
Baker S.P., Kretschmann A., Arzt E. Thermomechanical behavior of different texture components in Cu thin films. Acta Mater. 2001, 49:2145-2160.
-
(2001)
Acta Mater.
, vol.49
, pp. 2145-2160
-
-
Baker, S.P.1
Kretschmann, A.2
Arzt, E.3
-
10
-
-
0000769923
-
Progressive cracking of a multilayer system upon thermal cycling
-
Begley M.R., Evans A.G. Progressive cracking of a multilayer system upon thermal cycling. J. Appl. Mech. 2001, 68:513-520.
-
(2001)
J. Appl. Mech.
, vol.68
, pp. 513-520
-
-
Begley, M.R.1
Evans, A.G.2
-
11
-
-
0026692234
-
Cracking of thin bonded films in residual tension
-
Beuth J.L. Cracking of thin bonded films in residual tension. Int. J. Solids Struct. 1992, 29:1657-1675.
-
(1992)
Int. J. Solids Struct.
, vol.29
, pp. 1657-1675
-
-
Beuth, J.L.1
-
12
-
-
0030244071
-
Cracking of thin films bonded to elastic-plastic substrates
-
Beuth J.L., Klingbeil N.W. Cracking of thin films bonded to elastic-plastic substrates. J. Mech. Phys. Solids 1996, 44:1411-1428.
-
(1996)
J. Mech. Phys. Solids
, vol.44
, pp. 1411-1428
-
-
Beuth, J.L.1
Klingbeil, N.W.2
-
13
-
-
84937650904
-
Electromigration-a brief survey and some recent results
-
Black J.R. Electromigration-a brief survey and some recent results. IEEE Trans. Electron Devices 1969, ED-16:338-347.
-
(1969)
IEEE Trans. Electron Devices
, vol.ED16
, pp. 338-347
-
-
Black, J.R.1
-
14
-
-
0016940795
-
Electromigration in thin aluminum films on titanium nitride
-
Blech I.A. Electromigration in thin aluminum films on titanium nitride. J. Appl. Phys. 1976, 47:1203-1208.
-
(1976)
J. Appl. Phys.
, vol.47
, pp. 1203-1208
-
-
Blech, I.A.1
-
15
-
-
0016473653
-
Electromigration in thin gold films on molybdenum surfaces
-
Blech I.A., Kinsbron E. Electromigration in thin gold films on molybdenum surfaces. Thin Solid Films 1975, 25:327-334.
-
(1975)
Thin Solid Films
, vol.25
, pp. 327-334
-
-
Blech, I.A.1
Kinsbron, E.2
-
16
-
-
36849109026
-
Direct transmission electron microscope observation of electrotransport in aluminum thin films
-
Blech I.A., Meieran E.S. Direct transmission electron microscope observation of electrotransport in aluminum thin films. Appl. Phys. Lett. 1967, 11:263-265.
-
(1967)
Appl. Phys. Lett.
, vol.11
, pp. 263-265
-
-
Blech, I.A.1
Meieran, E.S.2
-
17
-
-
0001709094
-
Elastic-plastic behaviour of thin tubes subjected to internal pressure and intermittent high-heat fluxes with application to fast-nuclear-reactor fuel elements
-
Bree J. Elastic-plastic behaviour of thin tubes subjected to internal pressure and intermittent high-heat fluxes with application to fast-nuclear-reactor fuel elements. J. Strain Analysis 1967, 2:226-238.
-
(1967)
J. Strain Analysis
, vol.2
, pp. 226-238
-
-
Bree, J.1
-
18
-
-
0001781682
-
Void growth and collapse in viscous solids
-
Pergamon, Oxford, H.G. Hopkins, J. Sewell (Eds.)
-
Budiansky B., Hutchinson J.W., Slutsky S. Void growth and collapse in viscous solids. Mechanics of Solids, The Rodney Hill 60th Anniversary Volume 1982, 13-45. Pergamon, Oxford. H.G. Hopkins, J. Sewell (Eds.).
-
(1982)
Mechanics of Solids, The Rodney Hill 60th Anniversary Volume
, pp. 13-45
-
-
Budiansky, B.1
Hutchinson, J.W.2
Slutsky, S.3
-
19
-
-
0024683924
-
An experimental study of the fracture resistance of bimaterial interface
-
Cao H.C., Evans A.G. An experimental study of the fracture resistance of bimaterial interface. Mech. Mater. 1989, 7:295-305.
-
(1989)
Mech. Mater.
, vol.7
, pp. 295-305
-
-
Cao, H.C.1
Evans, A.G.2
-
20
-
-
0024621114
-
A test specimen for determining the fracture resistance of bimaterial interfaces
-
Charalambides P.G., Lund J., Evans A.G., McMeeking R.M. A test specimen for determining the fracture resistance of bimaterial interfaces. J. Appl. Mech. 1989, 56:77-82.
-
(1989)
J. Appl. Mech.
, vol.56
, pp. 77-82
-
-
Charalambides, P.G.1
Lund, J.2
Evans, A.G.3
McMeeking, R.M.4
-
21
-
-
0001613321
-
Dielectric cracking produced by electromigration in microelectronic interconnects
-
Chiras S., Clarke D.R. Dielectric cracking produced by electromigration in microelectronic interconnects. J. Appl. Phys. 2000, 88:6302-6312.
-
(2000)
J. Appl. Phys.
, vol.88
, pp. 6302-6312
-
-
Chiras, S.1
Clarke, D.R.2
-
22
-
-
0018440402
-
Non-equilibrium models for diffusive cavitation of grain interfaces
-
Chuang T.-J., Kagawa K.I., Rice J.R., Sills L.B. Non-equilibrium models for diffusive cavitation of grain interfaces. Acta Metall. 1979, 27:265-284.
-
(1979)
Acta Metall.
, vol.27
, pp. 265-284
-
-
Chuang, T.-J.1
Kagawa, K.I.2
Rice, J.R.3
Sills, L.B.4
-
23
-
-
0000434759
-
Stress-corrosion cracking of low-dielectric-constant spin-on-glass thin films
-
Cook R.F., Liniger E.G. Stress-corrosion cracking of low-dielectric-constant spin-on-glass thin films. J. Electochem. Soc. 1999, 146:4439-4448.
-
(1999)
J. Electochem. Soc.
, vol.146
, pp. 4439-4448
-
-
Cook, R.F.1
Liniger, E.G.2
-
24
-
-
0021312453
-
New failure mechanisms in sputtered aluminum-silicon films
-
IEEE
-
Curry J., Fitzgibbon G., Guan Y., Muollo R., Nelson G., Thomas A. New failure mechanisms in sputtered aluminum-silicon films. 22nd Ann. Proc. IEEE Int. Reliability Phys. Symp. 1984, 6-8. IEEE.
-
(1984)
22nd Ann. Proc. IEEE Int. Reliability Phys. Symp.
, pp. 6-8
-
-
Curry, J.1
Fitzgibbon, G.2
Guan, Y.3
Muollo, R.4
Nelson, G.5
Thomas, A.6
-
25
-
-
0032148208
-
Adhesion and debonding of multi-layer thin film structures
-
Dauskardt R.H., Lane M., Ma Q., Krishna N. Adhesion and debonding of multi-layer thin film structures. Eng. Fract. Mech. 1998, 61:141-162.
-
(1998)
Eng. Fract. Mech.
, vol.61
, pp. 141-162
-
-
Dauskardt, R.H.1
Lane, M.2
Ma, Q.3
Krishna, N.4
-
26
-
-
0002626228
-
Electromigration in thin films
-
Wiley, New York, J. Poate, K.N. Tu, J. Mayer (Eds.)
-
d'Heurle F.M., Ho P.S. Electromigration in thin films. Thin Films: Interdiffusion and Reactions 1978, 243-303. Wiley, New York. J. Poate, K.N. Tu, J. Mayer (Eds.).
-
(1978)
Thin Films: Interdiffusion and Reactions
, pp. 243-303
-
-
d'Heurle, F.M.1
Ho, P.S.2
-
27
-
-
0001714232
-
Electromigration in thin films
-
Academic Press, New York, G. Hass, M. Francombe, R. Hoffman (Eds.)
-
d'Heurle F.M., Rosenberg R. Electromigration in thin films. Physics of Thin Films 1973, vol. 7:257-310. Academic Press, New York. G. Hass, M. Francombe, R. Hoffman (Eds.).
-
(1973)
Physics of Thin Films
, vol.7
, pp. 257-310
-
-
d'Heurle, F.M.1
Rosenberg, R.2
-
28
-
-
0023560389
-
Shear-stress evaluation of plastic packages
-
Edwards D.R., Heinen K.G., Groothuis S.K., Martinez J.E. Shear-stress evaluation of plastic packages. IEEE Trans. Compon. Hybrids Manuf. Technol. 1987, 12:618-627.
-
(1987)
IEEE Trans. Compon. Hybrids Manuf. Technol.
, vol.12
, pp. 618-627
-
-
Edwards, D.R.1
Heinen, K.G.2
Groothuis, S.K.3
Martinez, J.E.4
-
29
-
-
85007836717
-
On the crack extension in plates under plane loading and transverse shear
-
Erdogan F., Sih G.C. On the crack extension in plates under plane loading and transverse shear. J. Basic Eng., Trans. ASME 1963, 85:519-527.
-
(1963)
J. Basic Eng., Trans. ASME
, vol.85
, pp. 519-527
-
-
Erdogan, F.1
Sih, G.C.2
-
30
-
-
0024069796
-
The cracking and decohesion of thin films
-
Evans A.G., Drory M.D., Hu M.S. The cracking and decohesion of thin films. J. Mater. Res. 1988, 3:1043-1049.
-
(1988)
J. Mater. Res.
, vol.3
, pp. 1043-1049
-
-
Evans, A.G.1
Drory, M.D.2
Hu, M.S.3
-
31
-
-
0029346335
-
The thermomechanical integrity of thin films and multilayers
-
Evans A.G., Hutchinson J.W. The thermomechanical integrity of thin films and multilayers. Acta Metall. Mater. 1995, 43:2507-2530.
-
(1995)
Acta Metall. Mater.
, vol.43
, pp. 2507-2530
-
-
Evans, A.G.1
Hutchinson, J.W.2
-
32
-
-
0001065090
-
The electromigration short-length effect in Ti-AlCu-Ti metallization with tungsten studs
-
Filippi R.G., Biery G.A., Wachnik R.A. The electromigration short-length effect in Ti-AlCu-Ti metallization with tungsten studs. J. Appl. Phys. 1995, 78:3756-3768.
-
(1995)
J. Appl. Phys.
, vol.78
, pp. 3756-3768
-
-
Filippi, R.G.1
Biery, G.A.2
Wachnik, R.A.3
-
33
-
-
0036572509
-
The effect of current density, stripe length, stripe width, and temperature on resistance saturation during electromigration testing
-
Filippi R.G., Wachnik R.A., Eng C.-P., Chidambarrao D., Wang P.-C., White J.F., Korhonen M.A., Shaw T.M., Rosenberg R., Sullivan T.D. The effect of current density, stripe length, stripe width, and temperature on resistance saturation during electromigration testing. J. Appl. Phys. 2002, 91:5787-5795.
-
(2002)
J. Appl. Phys.
, vol.91
, pp. 5787-5795
-
-
Filippi, R.G.1
Wachnik, R.A.2
Eng, C.-P.3
Chidambarrao, D.4
Wang, P.-C.5
White, J.F.6
Korhonen, M.A.7
Shaw, T.M.8
Rosenberg, R.9
Sullivan, T.D.10
-
35
-
-
0035878955
-
Statistical analysis of early failures in electromigration
-
Gall M., Capasso C., Jawaranl D., Hemandez R., Kawasaki H., Ho P.S. Statistical analysis of early failures in electromigration. J. Appl. Phys. 2001, 90:732-740.
-
(2001)
J. Appl. Phys.
, vol.90
, pp. 732-740
-
-
Gall, M.1
Capasso, C.2
Jawaranl, D.3
Hemandez, R.4
Kawasaki, H.5
Ho, P.S.6
-
36
-
-
0032684355
-
Crack-like grain-boundary diffusion wedges in thin metal films
-
Gao H., Zhang L., Nix W.D., Thompson C.V., Arzt E. Crack-like grain-boundary diffusion wedges in thin metal films. Acta Mater. 1999, 47:2865-2878.
-
(1999)
Acta Mater.
, vol.47
, pp. 2865-2878
-
-
Gao, H.1
Zhang, L.2
Nix, W.D.3
Thompson, C.V.4
Arzt, E.5
-
38
-
-
0032124054
-
Evolution of stresses in passivated and unpassivated metal interconnects
-
Gouldstone A., Shen Y.L., Suresh S., Thompson C.V. Evolution of stresses in passivated and unpassivated metal interconnects. J. Mater. Res. 1998, 13:1956-1966.
-
(1998)
J. Mater. Res.
, vol.13
, pp. 1956-1966
-
-
Gouldstone, A.1
Shen, Y.L.2
Suresh, S.3
Thompson, C.V.4
-
39
-
-
0000881016
-
Stress in metal lines under passivation-comparison of experiment with finite-element calculations
-
Greenebaum B., Sauter A.I., Flinn P.A., Nix W.D. Stress in metal lines under passivation-comparison of experiment with finite-element calculations. Appl. Phys. Lett. 1991, 58:1845-1847.
-
(1991)
Appl. Phys. Lett.
, vol.58
, pp. 1845-1847
-
-
Greenebaum, B.1
Sauter, A.I.2
Flinn, P.A.3
Nix, W.D.4
-
40
-
-
0032294955
-
A thermo-mechanical approach for fatigue testing of polymer bimaterial interfaces
-
Gurumurthy C.K., Jiao J., Norris L.G., Hui C.-Y., Kramer E.J. A thermo-mechanical approach for fatigue testing of polymer bimaterial interfaces. ASME Trans. J. Electron. Packag. 1998, 120:372-378.
-
(1998)
ASME Trans. J. Electron. Packag.
, vol.120
, pp. 372-378
-
-
Gurumurthy, C.K.1
Jiao, J.2
Norris, L.G.3
Hui, C.-Y.4
Kramer, E.J.5
-
41
-
-
0040621790
-
Flip-chip BGA design to avert die cracking
-
Han J.B. Flip-chip BGA design to avert die cracking. J. Electron. Packag. 2001, 123:58-63.
-
(2001)
J. Electron. Packag.
, vol.123
, pp. 58-63
-
-
Han, J.B.1
-
42
-
-
84903399479
-
Immortality of Cu damascene interconnects
-
Am. Inst. Phys, Melville, NY, S.P. Baker, M.A. Korhonen, E. Arzt, P.S. Ho (Eds.)
-
Hau-Riege S.P. Immortality of Cu damascene interconnects. 6th International Workshop on Stress-induced Phenomena in Metallization 2001, 21-32. Am. Inst. Phys, Melville, NY. S.P. Baker, M.A. Korhonen, E. Arzt, P.S. Ho (Eds.).
-
(2001)
6th International Workshop on Stress-induced Phenomena in Metallization
, pp. 21-32
-
-
Hau-Riege, S.P.1
-
43
-
-
0034256167
-
The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects
-
Hau-Riege S.P., Thompson C.V. The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects. J. Mater. Res. 2000, 15:1797-1802.
-
(2000)
J. Mater. Res.
, vol.15
, pp. 1797-1802
-
-
Hau-Riege, S.P.1
Thompson, C.V.2
-
44
-
-
0033737954
-
The ratcheting of compressed thermally grown thin films on ductile substrates
-
He M.Y., Evans A.G., Hutchinson J.W. The ratcheting of compressed thermally grown thin films on ductile substrates. Acta Mater. 2000, 48:2593-2601.
-
(2000)
Acta Mater.
, vol.48
, pp. 2593-2601
-
-
He, M.Y.1
Evans, A.G.2
Hutchinson, J.W.3
-
46
-
-
0000972637
-
A study on stress-induced migration in aluminum metallization based on direct stress measurements
-
Hinode K., Asano I., Ishiba T., Homma Y. A study on stress-induced migration in aluminum metallization based on direct stress measurements. J. Vac. Sci. Technol. 1990, B8:495-498.
-
(1990)
J. Vac. Sci. Technol.
, vol.B8
, pp. 495-498
-
-
Hinode, K.1
Asano, I.2
Ishiba, T.3
Homma, Y.4
-
47
-
-
1842617942
-
Electromigration in metals
-
Ho P.S., Kwok T. Electromigration in metals. Rep. Progr. Phys. 1989, 52:301-347.
-
(1989)
Rep. Progr. Phys.
, vol.52
, pp. 301-347
-
-
Ho, P.S.1
Kwok, T.2
-
48
-
-
21244467030
-
Stress-induced voiding in aluminum and copper interconnects
-
Am. Inst. Phys, Melville, NY, S.P. Baker, M.A. Korhonen, E. Arzt, P.S. Ho (Eds.)
-
Hommel M., Fischer A.H., Glasow A.v., Zitzelsberger A.E. Stress-induced voiding in aluminum and copper interconnects. 6th International Workshop on Stress-induced Phenomena in Metallization 2001, 157-168. Am. Inst. Phys, Melville, NY. S.P. Baker, M.A. Korhonen, E. Arzt, P.S. Ho (Eds.).
-
(2001)
6th International Workshop on Stress-induced Phenomena in Metallization
, pp. 157-168
-
-
Hommel, M.1
Fischer, A.H.2
Glasow, A.3
Zitzelsberger, A.E.4
-
49
-
-
0017997008
-
Intermetallic compounds of Al and transitions metals: effect of electromigration in 1-2μm-wide lines
-
Howard J.K., White J.F., Ho P.S. Intermetallic compounds of Al and transitions metals: effect of electromigration in 1-2μm-wide lines. J. Appl. Phys. 1978, 49:4083-4093.
-
(1978)
J. Appl. Phys.
, vol.49
, pp. 4083-4093
-
-
Howard, J.K.1
White, J.F.2
Ho, P.S.3
-
50
-
-
0028444123
-
Cleavage due to dislocation confinement in layered materials
-
Hsia K.J., Suo Z., Yang W. Cleavage due to dislocation confinement in layered materials. J. Mech. Phys. Solids 1994, 42:877-896.
-
(1994)
J. Mech. Phys. Solids
, vol.42
, pp. 877-896
-
-
Hsia, K.J.1
Suo, Z.2
Yang, W.3
-
51
-
-
0000555230
-
Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
-
Hu C.-K., Gignac L., Malhotra S.G., Rosenberg R. Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections. Appl. Phys. Lett. 2001, 78:904-906.
-
(2001)
Appl. Phys. Lett.
, vol.78
, pp. 904-906
-
-
Hu, C.-K.1
Gignac, L.2
Malhotra, S.G.3
Rosenberg, R.4
-
52
-
-
0029333576
-
Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines
-
Hu C.-K., Rodbell K.P., Sullivan T.D., Lee K.Y., Bouldin D.P. Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. IBM J. Res. Develop. 1995, 39:465-497.
-
(1995)
IBM J. Res. Develop.
, vol.39
, pp. 465-497
-
-
Hu, C.-K.1
Rodbell, K.P.2
Sullivan, T.D.3
Lee, K.Y.4
Bouldin, D.P.5
-
53
-
-
0000034975
-
Electromigration path in Cu thin-film lines
-
Hu C.-K., Rosenberg R., Lee K.Y. Electromigration path in Cu thin-film lines. Appl. Phys. Lett. 1999, 74:2945-2947.
-
(1999)
Appl. Phys. Lett.
, vol.74
, pp. 2945-2947
-
-
Hu, C.-K.1
Rosenberg, R.2
Lee, K.Y.3
-
54
-
-
36449002166
-
Electromigration in Al(Cu) two-level structures: effect of Cu and kinetics of damage formation
-
Hu C.-K., Small M.B., Ho P.S. Electromigration in Al(Cu) two-level structures: effect of Cu and kinetics of damage formation. J. Appl. Phys. 1993, 74:969-978.
-
(1993)
J. Appl. Phys.
, vol.74
, pp. 969-978
-
-
Hu, C.-K.1
Small, M.B.2
Ho, P.S.3
-
55
-
-
0024626558
-
The cracking and decohesion of thin films on ductile substrates
-
Hu M.S., Evans A.G. The cracking and decohesion of thin films on ductile substrates. Acta Metall. 1989, 37:917-925.
-
(1989)
Acta Metall.
, vol.37
, pp. 917-925
-
-
Hu, M.S.1
Evans, A.G.2
-
56
-
-
0035801936
-
Metal film crawling in interconnect structures caused by cyclic temperatures
-
Huang M., Suo Z., Ma Q. Metal film crawling in interconnect structures caused by cyclic temperatures. Acta Mater. 2001, 49:3039-3049.
-
(2001)
Acta Mater.
, vol.49
, pp. 3039-3049
-
-
Huang, M.1
Suo, Z.2
Ma, Q.3
-
57
-
-
0036567892
-
Ratcheting induced cracks in thin film structures
-
Huang M., Suo Z., Ma Q. Ratcheting induced cracks in thin film structures. J. Mech. Phys. Solids 2002, 50:1079-1098.
-
(2002)
J. Mech. Phys. Solids
, vol.50
, pp. 1079-1098
-
-
Huang, M.1
Suo, Z.2
Ma, Q.3
-
58
-
-
0034211118
-
Thin film cracking and ratcheting caused by temperature cycling
-
Huang M., Suo Z., Ma Q., Fujimoto H. Thin film cracking and ratcheting caused by temperature cycling. J. Mater. Res. 2000, 15:1239-1242.
-
(2000)
J. Mater. Res.
, vol.15
, pp. 1239-1242
-
-
Huang, M.1
Suo, Z.2
Ma, Q.3
Fujimoto, H.4
-
59
-
-
84903416028
-
Channel-cracking of thin films with the extended finite element method
-
submitted, Preprint is online at, Publication 138.
-
R. Huang, J. H. Prévost, Z. Y. Huang and Z. Suo, 2003, Channel-cracking of thin films with the extended finite element method, submitted, Preprint is online at, Publication 138. http://www.princeton.edu/~SUO.
-
(2003)
-
-
Huang, R.1
Prévost, J.H.2
Huang, Z.Y.3
Suo, Z.4
-
61
-
-
0033875372
-
Mechanics of materials: top-down approaches to fracture
-
Hutchinson J.W., Evans A.G. Mechanics of materials: top-down approaches to fracture. Acta Mater. 2000, 48:125-135.
-
(2000)
Acta Mater.
, vol.48
, pp. 125-135
-
-
Hutchinson, J.W.1
Evans, A.G.2
-
62
-
-
71149121504
-
Mixed-mode cracking in layered materials
-
Hutchinson J.W., Suo Z. Mixed-mode cracking in layered materials. Adv. Appl. Mech. 1991, 29:63-191.
-
(1991)
Adv. Appl. Mech.
, vol.29
, pp. 63-191
-
-
Hutchinson, J.W.1
Suo, Z.2
-
63
-
-
0019279689
-
Deformation of Al metallization in plastic encapsulated semiconductor devices caused by thermal shock
-
IEEE
-
Isagawa M., Iwasaki Y., Sutoh T. Deformation of Al metallization in plastic encapsulated semiconductor devices caused by thermal shock. Proc. Int. Reliability Phys. Symp. 1980, 171-177. IEEE.
-
(1980)
Proc. Int. Reliability Phys. Symp.
, pp. 171-177
-
-
Isagawa, M.1
Iwasaki, Y.2
Sutoh, T.3
-
64
-
-
0000176750
-
Mechanical-behavior of a continuous fiber-reinforced aluminum matrix composite subjected to transverse and thermal loading
-
Jansson S., Leckie F.A. Mechanical-behavior of a continuous fiber-reinforced aluminum matrix composite subjected to transverse and thermal loading. J. Mech. Phys. Solids 1992, 40:593-612.
-
(1992)
J. Mech. Phys. Solids
, vol.40
, pp. 593-612
-
-
Jansson, S.1
Leckie, F.A.2
-
65
-
-
0001008867
-
Stress analysis of encapsulated fine-line aluminum interconnect
-
Jones R.E., Basehore M.L. Stress analysis of encapsulated fine-line aluminum interconnect. Appl. Phys. Lett. 1987, 50:725-727.
-
(1987)
Appl. Phys. Lett.
, vol.50
, pp. 725-727
-
-
Jones, R.E.1
Basehore, M.L.2
-
66
-
-
0035854080
-
A numerical model for the cyclic instability of thermally grown oxides in thermal barrier systems
-
Karlsson A.M., Evans A.G. A numerical model for the cyclic instability of thermally grown oxides in thermal barrier systems. Acta Mater. 2001, 49:1793-1804.
-
(2001)
Acta Mater.
, vol.49
, pp. 1793-1804
-
-
Karlsson, A.M.1
Evans, A.G.2
-
67
-
-
0001491168
-
Local textures and grain boundaries in voided copper interconnects
-
Keller R.R., Nucci J.A., Field D.P. Local textures and grain boundaries in voided copper interconnects. J. Electron. Mater. 1997, 26:996-1001.
-
(1997)
J. Electron. Mater.
, vol.26
, pp. 996-1001
-
-
Keller, R.R.1
Nucci, J.A.2
Field, D.P.3
-
68
-
-
0036470469
-
Moisture-assisted subcritical debonding of a polymer/metal interface
-
Kook S.-Y., Dauskardt R.H. Moisture-assisted subcritical debonding of a polymer/metal interface. J. Appl. Phys. 2002, 91:1293-1303.
-
(2002)
J. Appl. Phys.
, vol.91
, pp. 1293-1303
-
-
Kook, S.-Y.1
Dauskardt, R.H.2
-
69
-
-
36449009582
-
Stress relaxation of passivated aluminum line metalizations on silicon substrate
-
Korhonen M.A., Black R.D., Li C.-Y. Stress relaxation of passivated aluminum line metalizations on silicon substrate. J. Appl. Phys. 1991, 69:1748-1755.
-
(1991)
J. Appl. Phys.
, vol.69
, pp. 1748-1755
-
-
Korhonen, M.A.1
Black, R.D.2
Li, C.-Y.3
-
70
-
-
0038035318
-
Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses
-
Korhonen M.A., Borgesen P., Tu K.N., Li C.-Y. Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses. J. Appl. Phys. 1993, 73:3790-5004.
-
(1993)
J. Appl. Phys.
, vol.73
, pp. 3790-5004
-
-
Korhonen, M.A.1
Borgesen, P.2
Tu, K.N.3
Li, C.-Y.4
-
71
-
-
0031117638
-
Electromigration mechanisms in conductor lines: void shape changes and slit-like failure
-
Kraft O., Arzt E. Electromigration mechanisms in conductor lines: void shape changes and slit-like failure. Acta Mater. 1997, 45:1599-1611.
-
(1997)
Acta Mater.
, vol.45
, pp. 1599-1611
-
-
Kraft, O.1
Arzt, E.2
-
72
-
-
0033990021
-
Adhesion and reliability of copper interconnects with Ta and TaN barrier layers
-
Lane M., Dauskardt R.H., Krishna N., Hashim I. Adhesion and reliability of copper interconnects with Ta and TaN barrier layers. J. Mater. Res. 2000, 15:203-211.
-
(2000)
J. Mater. Res.
, vol.15
, pp. 203-211
-
-
Lane, M.1
Dauskardt, R.H.2
Krishna, N.3
Hashim, I.4
-
73
-
-
0034582833
-
Plasticity contributions to interface adhesion in thin film interconnect structures
-
Lane M., Dauskardt R.H., Vainchtein A., Gao H. Plasticity contributions to interface adhesion in thin film interconnect structures. J. Mater. Res. 2000, 15:2758-2769.
-
(2000)
J. Mater. Res.
, vol.15
, pp. 2758-2769
-
-
Lane, M.1
Dauskardt, R.H.2
Vainchtein, A.3
Gao, H.4
-
74
-
-
0004034857
-
-
McGraw-Hill, New York
-
Lau J., Wong C.P., Prince J.L., Nakayama W. Electronic Packaging, Design, Materials, Process, and Reliability 1998, McGraw-Hill, New York.
-
(1998)
Electronic Packaging, Design, Materials, Process, and Reliability
-
-
Lau, J.1
Wong, C.P.2
Prince, J.L.3
Nakayama, W.4
-
76
-
-
84949187927
-
Electromigration study of Cu/low k dual-damascene interconnects
-
IEEE
-
Lee K.-D., Lu X., Ogawa E.T., Matsuhashi H., Ho P.S. Electromigration study of Cu/low k dual-damascene interconnects. 40th Ann. Proc. IEEE Int. Reliability Phys. Symp. 2002, 322-326. IEEE.
-
(2002)
40th Ann. Proc. IEEE Int. Reliability Phys. Symp.
, pp. 322-326
-
-
Lee, K.-D.1
Lu, X.2
Ogawa, E.T.3
Matsuhashi, H.4
Ho, P.S.5
-
77
-
-
36449008541
-
In situ scanning electron microscope comparison studies on electromigration of Cu and Cu(Sn) alloys for advanced chip interconnects
-
Lee K.L., Hu C.-K., Tu K.N. In situ scanning electron microscope comparison studies on electromigration of Cu and Cu(Sn) alloys for advanced chip interconnects. J. Appl. Phys. 1995, 78:4428-4437.
-
(1995)
J. Appl. Phys.
, vol.78
, pp. 4428-4437
-
-
Lee, K.L.1
Hu, C.-K.2
Tu, K.N.3
-
78
-
-
0021786489
-
A comparison of methods for calculating energy release rates
-
Li F.Z., Shih C.F., Needleman A. A comparison of methods for calculating energy release rates. Eng. Fract. Mech. 1985, 21:405-421.
-
(1985)
Eng. Fract. Mech.
, vol.21
, pp. 405-421
-
-
Li, F.Z.1
Shih, C.F.2
Needleman, A.3
-
79
-
-
84903399480
-
-
Concomitant thin film cracking and underlayer creep, Exp. Mech., in press.
-
J. Liang, R. Huang, J. H. Prévost and Z. Suo, 2002a, Concomitant thin film cracking and underlayer creep, Exp. Mech., in press.
-
(2002)
-
-
Liang, J.1
Huang, R.2
Prévost, J.H.3
Suo, Z.4
-
80
-
-
84903399468
-
-
Evolving crack patterns in thin films with the extended finite element method, Int. J. Solids Struct., in press.
-
J. Liang, R. Huang, J. H. Prévost and Z. Suo, 2002b, Evolving crack patterns in thin films with the extended finite element method, Int. J. Solids Struct., in press.
-
(2002)
-
-
Liang, J.1
Huang, R.2
Prévost, J.H.3
Suo, Z.4
-
81
-
-
0026219801
-
Biaxial loading experiments for determining interfacial fracture-toughness
-
Liechti K.M., Chai Y.S. Biaxial loading experiments for determining interfacial fracture-toughness. J. Appl. Mech. 1991, 58:680-687.
-
(1991)
J. Appl. Mech.
, vol.58
, pp. 680-687
-
-
Liechti, K.M.1
Chai, Y.S.2
-
82
-
-
0037103690
-
In situ study of void growth kinetics in electroplated Cu lines
-
Liniger E., Gignac L., Hu C.-K., Kaldor S. In situ study of void growth kinetics in electroplated Cu lines. J. Appl. Phys. 2002, 92:1803-1810.
-
(2002)
J. Appl. Phys.
, vol.92
, pp. 1803-1810
-
-
Liniger, E.1
Gignac, L.2
Hu, C.-K.3
Kaldor, S.4
-
83
-
-
0033937363
-
Cracking and debonding in integrated circuit structures
-
Liu X.H., Suo Z., Ma Q., Fujimoto H. Cracking and debonding in integrated circuit structures. Eng. Fract. Mech. 2000, 66:387-402.
-
(2000)
Eng. Fract. Mech.
, vol.66
, pp. 387-402
-
-
Liu, X.H.1
Suo, Z.2
Ma, Q.3
Fujimoto, H.4
-
84
-
-
0026204409
-
Matrix cracking in intermetallic composites caused by thermal expansion mismatch
-
Lu T.C., Yang J., Suo Z., Evans A.G., Hecht R., Mehrabian R. Matrix cracking in intermetallic composites caused by thermal expansion mismatch. Acta Metall. Mater. 1991, 39:1883-1890.
-
(1991)
Acta Metall. Mater.
, vol.39
, pp. 1883-1890
-
-
Lu, T.C.1
Yang, J.2
Suo, Z.3
Evans, A.G.4
Hecht, R.5
Mehrabian, R.6
-
85
-
-
0000704120
-
High resolution determination of the stress in individual interconnect lines and the variation due to electromigration
-
Ma Q., Chiras S., Clarke D.R., Suo Z. High resolution determination of the stress in individual interconnect lines and the variation due to electromigration. J. Appl. Phys. 1995, 78:1614-1622.
-
(1995)
J. Appl. Phys.
, vol.78
, pp. 1614-1622
-
-
Ma, Q.1
Chiras, S.2
Clarke, D.R.3
Suo, Z.4
-
86
-
-
0032318497
-
Channel cracking technique for toughness measurement of brittle dielectric thin films on silicon substrates
-
Ma Q., Xie J., Chao S., El-Mansy S., McFadden R., Fujimoto H. Channel cracking technique for toughness measurement of brittle dielectric thin films on silicon substrates. Mater. Res. Soc. Symp. Proc. 1998, 516:331-336.
-
(1998)
Mater. Res. Soc. Symp. Proc.
, vol.516
, pp. 331-336
-
-
Ma, Q.1
Xie, J.2
Chao, S.3
El-Mansy, S.4
McFadden, R.5
Fujimoto, H.6
-
87
-
-
0031257926
-
The influence of blunting on crack growth at oxide/metal interfaces
-
Mao S.X., Evans A.G. The influence of blunting on crack growth at oxide/metal interfaces. Acta Mater. 1997, 45:4263-4270.
-
(1997)
Acta Mater.
, vol.45
, pp. 4263-4270
-
-
Mao, S.X.1
Evans, A.G.2
-
88
-
-
0000951860
-
Observations of electromigration induced void nucleation and growth in polycrystalline and near-bamboo passivated Al lines
-
Marieb T., Flinn P., Bravman J.C., Gardner D., Madden M. Observations of electromigration induced void nucleation and growth in polycrystalline and near-bamboo passivated Al lines. J. Appl. Phys. 1995, 78:1026-1032.
-
(1995)
J. Appl. Phys.
, vol.78
, pp. 1026-1032
-
-
Marieb, T.1
Flinn, P.2
Bravman, J.C.3
Gardner, D.4
Madden, M.5
-
89
-
-
0034498614
-
Development of a low-dielectric-constant polymer for the fabrication of integrated circuit interconnect
-
Martin S.J., Godschalx J.P., Mills M.E., Shaffer E.O., Townsend P.H. Development of a low-dielectric-constant polymer for the fabrication of integrated circuit interconnect. Adv. Mater. 2000, 12:1769-1778.
-
(2000)
Adv. Mater.
, vol.12
, pp. 1769-1778
-
-
Martin, S.J.1
Godschalx, J.P.2
Mills, M.E.3
Shaffer, E.O.4
Townsend, P.H.5
-
90
-
-
0024718571
-
A method for calculating stress intensities in bimaterial fracture
-
Matos P.P.L., McMeeking R.M., Charalambides P.G., Drory M.D. A method for calculating stress intensities in bimaterial fracture. Int. J. Fract. 1989, 40:235-254.
-
(1989)
Int. J. Fract.
, vol.40
, pp. 235-254
-
-
Matos, P.P.L.1
McMeeking, R.M.2
Charalambides, P.G.3
Drory, M.D.4
-
91
-
-
0001163312
-
A model for stress-induced notching and voiding in very large-scale integrated Al-Si (1%) metalization
-
McPherson J.W., Dunn C.F. A model for stress-induced notching and voiding in very large-scale integrated Al-Si (1%) metalization. J. Vac. Sci. Technol. 1987, B5:1321-1325.
-
(1987)
J. Vac. Sci. Technol.
, vol.B5
, pp. 1321-1325
-
-
McPherson, J.W.1
Dunn, C.F.2
-
92
-
-
0033326202
-
Die cracking and reliable die design for flip-chip assemblies
-
Michaelides S., Sitaraman S.K. Die cracking and reliable die design for flip-chip assemblies. IEEE Trans. Adv. Packag. 1999, 22(4):602-613.
-
(1999)
IEEE Trans. Adv. Packag.
, vol.22
, Issue.4
, pp. 602-613
-
-
Michaelides, S.1
Sitaraman, S.K.2
-
93
-
-
0033349534
-
A finite element method for crack growth without remeshing
-
Moes N., Dolbow J., Belytschko T. A finite element method for crack growth without remeshing. Int. J. Num. Methods Eng. 1999, 46:131-150.
-
(1999)
Int. J. Num. Methods Eng.
, vol.46
, pp. 131-150
-
-
Moes, N.1
Dolbow, J.2
Belytschko, T.3
-
94
-
-
0033312723
-
Low dielectric constant materials for advanced interconnects
-
JOM, September Issue
-
M. Morgen, E. T. Ryan, J.-H. Zhao, C. Hu, T. Cho and P. S. Ho, 1999, Low dielectric constant materials for advanced interconnects. JOM, September Issue, 37-40.
-
(1999)
, pp. 37-40
-
-
Morgen, M.1
Ryan, E.T.2
Zhao, J.-H.3
Hu, C.4
Cho, T.5
Ho, P.S.6
-
95
-
-
0035879717
-
Discrete dislocation and continuum descriptions of plastic flow
-
Needleman A., Van der Giessen E. Discrete dislocation and continuum descriptions of plastic flow. Mater. Sci. Eng. 2001, A309:1-13.
-
(2001)
Mater. Sci. Eng.
, vol.A309
, pp. 1-13
-
-
Needleman, A.1
Van der Giessen, E.2
-
96
-
-
0024766321
-
Mechanical-properties of thin-films
-
Nix W.D. Mechanical-properties of thin-films. Metall. Trans. 1989, 20A:2217-2245.
-
(1989)
Metall. Trans.
, vol.20 A
, pp. 2217-2245
-
-
Nix, W.D.1
-
97
-
-
78751524110
-
Stress-induced voiding under vias connected to wide Cu metal leads
-
IEEE
-
Ogawa E.T., McPherson J.W., Rosal J.A., Dickerson K.J., Chiu T.-C., Tsung L.Y., Jain M.K., Bonifield T.D., Ondrusek J.C., McKee W.R. Stress-induced voiding under vias connected to wide Cu metal leads. Proceedings of 2002 IEEE International Reliability Physics Symposium 2002, 312-321. IEEE.
-
(2002)
Proceedings of 2002 IEEE International Reliability Physics Symposium
, pp. 312-321
-
-
Ogawa, E.T.1
McPherson, J.W.2
Rosal, J.A.3
Dickerson, K.J.4
Chiu, T.-C.5
Tsung, L.Y.6
Jain, M.K.7
Bonifield, T.D.8
Ondrusek, J.C.9
McKee, W.R.10
-
98
-
-
0023602637
-
Subcritical crack-growth along ceramic-metal interfaces
-
Oh T.S., Cannon R.M., Ritchie R.O. Subcritical crack-growth along ceramic-metal interfaces. J. Am. Ceram. Soc. 1987, 70:C352-C355.
-
(1987)
J. Am. Ceram. Soc.
, vol.70
-
-
Oh, T.S.1
Cannon, R.M.2
Ritchie, R.O.3
-
99
-
-
0027887532
-
Stress-induced void formation in metallization for integrated circuits
-
Okabayashi H. Stress-induced void formation in metallization for integrated circuits. Mater. Sci. Eng. 1993, R11:191-241.
-
(1993)
Mater. Sci. Eng.
, vol.R11
, pp. 191-241
-
-
Okabayashi, H.1
-
100
-
-
0009209195
-
-
Simon and Shuster, New York
-
Reid T.R. The Chip 2001, Simon and Shuster, New York.
-
(2001)
The Chip
-
-
Reid, T.R.1
-
102
-
-
0023979063
-
Elastic fracture mechanics concepts for interfacial cracks
-
Rice J.R. Elastic fracture mechanics concepts for interfacial cracks. J. Appl. Mech. 1988, 55:98-103.
-
(1988)
J. Appl. Mech.
, vol.55
, pp. 98-103
-
-
Rice, J.R.1
-
103
-
-
84903399470
-
Adhesion and debonding of low-k carbon-doped oxide films in multi-layer thin film structures
-
submitted.
-
J. E. Rim, F. Shi, D.-I. Lee, F. Ohta and R. H. Dauskardt, 2002, Adhesion and debonding of low- k carbon-doped oxide films in multi-layer thin film structures. J. Mater. Res., submitted.
-
(2002)
J. Mater. Res.
-
-
Rim, J.E.1
Shi, F.2
Lee, D.-I.3
Ohta, F.4
Dauskardt, R.H.5
-
104
-
-
36449001427
-
Fatal electromigration voids in narrow aluminum-copper interconnect
-
Rose J.H. Fatal electromigration voids in narrow aluminum-copper interconnect. Appl. Phys. Lett. 1992, 61:2170-2172.
-
(1992)
Appl. Phys. Lett.
, vol.61
, pp. 2170-2172
-
-
Rose, J.H.1
-
105
-
-
0033709195
-
Copper metallization for high performance silicon technology
-
Rosenberg R., Edelstein D.C., Hu C.-K., Rodbell K.P. Copper metallization for high performance silicon technology. Ann. Rev. Mater. 2000, 30:229-262.
-
(2000)
Ann. Rev. Mater.
, vol.30
, pp. 229-262
-
-
Rosenberg, R.1
Edelstein, D.C.2
Hu, C.-K.3
Rodbell, K.P.4
-
106
-
-
0004852018
-
Slit morphology of electromigration induced open circuit failures in fine line conductors
-
Sanchez J.E., McKnelly L.T., Morris J.W. Slit morphology of electromigration induced open circuit failures in fine line conductors. J. Appl. Phys. 1992, 72:3201-3203.
-
(1992)
J. Appl. Phys.
, vol.72
, pp. 3201-3203
-
-
Sanchez, J.E.1
McKnelly, L.T.2
Morris, J.W.3
-
107
-
-
0026868335
-
A study of stress-driven diffusive growth of voids in encapsulated interconnect lines
-
Sauter A.I., Nix W.D. A study of stress-driven diffusive growth of voids in encapsulated interconnect lines. J. Mater. Res. 1992, 7:1133-1143.
-
(1992)
J. Mater. Res.
, vol.7
, pp. 1133-1143
-
-
Sauter, A.I.1
Nix, W.D.2
-
108
-
-
0038974363
-
Void formation by thermal stress concentration at twin interfaces in Cu thin films
-
Sekiguchi A., Koike J., Kamiya S., Saka M., Maruyama K. Void formation by thermal stress concentration at twin interfaces in Cu thin films. Appl. Phys. Lett. 2001, 79:1264-1266.
-
(2001)
Appl. Phys. Lett.
, vol.79
, pp. 1264-1266
-
-
Sekiguchi, A.1
Koike, J.2
Kamiya, S.3
Saka, M.4
Maruyama, K.5
-
110
-
-
5744220241
-
Stress voiding in wide copper lines
-
Am. Inst. Phys, Melville, NY, S.P. Baker, M.A. Korhonen, E. Arzt, P.S. Ho (Eds.)
-
Shaw T.M., Gignac L., Liu X.-H., Rosenberg R.R., Levine E., Mclaughlin P., Wang P.-C., Greco S., Biery G. Stress voiding in wide copper lines. 6th International Workshop on Stress-induced Phenomena in Metallization 2001, 177-183. Am. Inst. Phys, Melville, NY. S.P. Baker, M.A. Korhonen, E. Arzt, P.S. Ho (Eds.).
-
(2001)
6th International Workshop on Stress-induced Phenomena in Metallization
, pp. 177-183
-
-
Shaw, T.M.1
Gignac, L.2
Liu, X.-H.3
Rosenberg, R.R.4
Levine, E.5
Mclaughlin, P.6
Wang, P.-C.7
Greco, S.8
Biery, G.9
-
111
-
-
0032124053
-
Stress evolution in passivated thin films of Cu on silica substrates
-
Shen Y.L., Suresh S., He M.Y., Bagchi A., Kienzle O., Ruhle M., Evans A.G. Stress evolution in passivated thin films of Cu on silica substrates. J. Mater. Res. 1998, 13:1928-1937.
-
(1998)
J. Mater. Res.
, vol.13
, pp. 1928-1937
-
-
Shen, Y.L.1
Suresh, S.2
He, M.Y.3
Bagchi, A.4
Kienzle, O.5
Ruhle, M.6
Evans, A.G.7
-
112
-
-
0026173613
-
Elastic-plastic analysis of cracks on bimaterial interfaces: 3. Large-scale yielding
-
Shih C.F., Asaro R.J., O'Dowd N.P. Elastic-plastic analysis of cracks on bimaterial interfaces: 3. Large-scale yielding. J. Appl. Mech. 1991, 58:450-463.
-
(1991)
J. Appl. Mech.
, vol.58
, pp. 450-463
-
-
Shih, C.F.1
Asaro, R.J.2
O'Dowd, N.P.3
-
113
-
-
0037165921
-
Subcritical debonding of polymer/silica interfaces under monotonic and cyclic fatigue loading
-
Snodgrass J.M., Pantelidis D., Jenkins M.L., Bravman J.C., Dauskardt R.H. Subcritical debonding of polymer/silica interfaces under monotonic and cyclic fatigue loading. Acta Mater. 2002, 50:2395-2411.
-
(2002)
Acta Mater.
, vol.50
, pp. 2395-2411
-
-
Snodgrass, J.M.1
Pantelidis, D.2
Jenkins, M.L.3
Bravman, J.C.4
Dauskardt, R.H.5
-
114
-
-
0041870366
-
Accelerated life testing (ALT) in microelectronics and photonics: its role, attributes, challenges, pitfalls, and interaction with qualification tests
-
Suhir E. Accelerated life testing (ALT) in microelectronics and photonics: its role, attributes, challenges, pitfalls, and interaction with qualification tests. J. Electron. Packag. 2002, 124:281-291.
-
(2002)
J. Electron. Packag.
, vol.124
, pp. 281-291
-
-
Suhir, E.1
-
115
-
-
0029697286
-
Stress-induced voiding in microelectron metallization: void growth models and refinements
-
Sullivan T.D. Stress-induced voiding in microelectron metallization: void growth models and refinements. Ann. Rev. Mater. Sci. 1996, 26:333-364.
-
(1996)
Ann. Rev. Mater. Sci.
, vol.26
, pp. 333-364
-
-
Sullivan, T.D.1
-
116
-
-
0004274342
-
-
Cambridge University Press, Cambridge, 2nd edn.
-
Suresh S. Fatigue of Materials 1998, Cambridge University Press, Cambridge. 2nd edn.
-
(1998)
Fatigue of Materials
-
-
Suresh, S.1
-
117
-
-
0028546607
-
Emergence of crack by mass transport in elastic crystals stressed at high temperatures
-
Sun B., Suo Z., Evans A.G. Emergence of crack by mass transport in elastic crystals stressed at high temperatures. J. Mech. Phys. Solids 1994, 42:1653-1677.
-
(1994)
J. Mech. Phys. Solids
, vol.42
, pp. 1653-1677
-
-
Sun, B.1
Suo, Z.2
Evans, A.G.3
-
118
-
-
0000594331
-
Stable state of interconnect under temperature change and electric current
-
Suo Z. Stable state of interconnect under temperature change and electric current. Acta Mater. 1998, 46:3725-3732.
-
(1998)
Acta Mater.
, vol.46
, pp. 3725-3732
-
-
Suo, Z.1
-
119
-
-
84903399472
-
-
Unpublished research.
-
Z. Suo and J. He, 2002, Unpublished research.
-
(2002)
-
-
Suo, Z.1
He, J.2
-
120
-
-
0024301167
-
Sandwich specimens for measuring interface crack toughness
-
Suo Z., Hutchinson J.W. Sandwich specimens for measuring interface crack toughness. Mater. Sci. Eng. 1989, A107:135-143.
-
(1989)
Mater. Sci. Eng.
, vol.A107
, pp. 135-143
-
-
Suo, Z.1
Hutchinson, J.W.2
-
121
-
-
0025421834
-
Interface crack between two elastic layers
-
Suo Z., Hutchinson J.W. Interface crack between two elastic layers. Int. J. Fract. 1990, 43:1-18.
-
(1990)
Int. J. Fract.
, vol.43
, pp. 1-18
-
-
Suo, Z.1
Hutchinson, J.W.2
-
122
-
-
0344981301
-
Kinetics of crack initiation and growth in organic-containing integrated structures
-
submitted.
-
Z. Suo, J. H. Prévost and J. Liang, 2003, Kinetics of crack initiation and growth in organic-containing integrated structures. J. Mech. Phys. Solids, submitted.
-
(2003)
J. Mech. Phys. Solids
-
-
Suo, Z.1
Prévost, J.H.2
Liang, J.3
-
123
-
-
0027588623
-
A theory for cleavage cracking in the presence of plastic flow
-
Suo Z., Shih C.F., Varias A.G. A theory for cleavage cracking in the presence of plastic flow. Acta Metall. Mater. 1993, 41:1551-1557.
-
(1993)
Acta Metall. Mater.
, vol.41
, pp. 1551-1557
-
-
Suo, Z.1
Shih, C.F.2
Varias, A.G.3
-
124
-
-
0004019913
-
-
Del Research, St. Louis, MO
-
Tada H., Paris P.C., Irwin G.R. The Stress Analysis of Cracks Handbook 1985, Del Research, St. Louis, MO.
-
(1985)
The Stress Analysis of Cracks Handbook
-
-
Tada, H.1
Paris, P.C.2
Irwin, G.R.3
-
125
-
-
0022313453
-
Stress-induced deformation of aluminum metallization in plastic molded semiconductor-devices
-
Thomas R.E. Stress-induced deformation of aluminum metallization in plastic molded semiconductor-devices. IEEE Trans. Compon. Hybrids Manuf. Technol. 1985, 8:427-434.
-
(1985)
IEEE Trans. Compon. Hybrids Manuf. Technol.
, vol.8
, pp. 427-434
-
-
Thomas, R.E.1
-
126
-
-
84953680759
-
Cracking and delamination of coatings
-
Thouless M.D. Cracking and delamination of coatings. J. Vac. Sci. Technol. 1991, A9:2510-2515.
-
(1991)
J. Vac. Sci. Technol.
, vol.A9
, pp. 2510-2515
-
-
Thouless, M.D.1
-
127
-
-
0023362448
-
The edge cracking and spalling of brittle plates
-
Thouless M.D., Evans A.G., Ashby M.F., Hutchinson J.W. The edge cracking and spalling of brittle plates. Acta Metall. 1987, 35:1333-1341.
-
(1987)
Acta Metall.
, vol.35
, pp. 1333-1341
-
-
Thouless, M.D.1
Evans, A.G.2
Ashby, M.F.3
Hutchinson, J.W.4
-
128
-
-
0012726108
-
Damage nucleation during electromigration along an isolated interface in an elastic medium
-
Thouless M.D., Yu H.H., Zhao Z.J., Yang W. Damage nucleation during electromigration along an isolated interface in an elastic medium. J. Mech. Phys. Solids 1996, 44:371-387.
-
(1996)
J. Mech. Phys. Solids
, vol.44
, pp. 371-387
-
-
Thouless, M.D.1
Yu, H.H.2
Zhao, Z.J.3
Yang, W.4
-
131
-
-
0000323896
-
Linewidth dependence of electromigration in evaporated Al-0.5%Cu
-
Vaidya S., Sheng T.T., Sinha A.K. Linewidth dependence of electromigration in evaporated Al-0.5%Cu. Appl. Phys. Lett. 1980, 36:464-466.
-
(1980)
Appl. Phys. Lett.
, vol.36
, pp. 464-466
-
-
Vaidya, S.1
Sheng, T.T.2
Sinha, A.K.3
-
133
-
-
0036146193
-
Mechanical Properties in Small Dimensions
-
MRS Bull., 27
-
R. P. Vinci and S. P. Baker (eds.), 2002, Mechanical Properties in Small Dimensions. MRS Bull., 27, 12-53.
-
(2002)
, pp. 12-53
-
-
Vinci, R.P.1
Baker, S.P.2
-
134
-
-
0037039675
-
Interfacial toughness measurements for thin films on substrates
-
Volinsky A.A., Moody N.R., Gerberich W.W. Interfacial toughness measurements for thin films on substrates. Acta Mater. 2002, 50:441-466.
-
(2002)
Acta Mater.
, vol.50
, pp. 441-466
-
-
Volinsky, A.A.1
Moody, N.R.2
Gerberich, W.W.3
-
135
-
-
0025461953
-
Experimental determination of interfacial toughness curves using Brazil-nut-sandwiches
-
Wang J.S., Suo Z. Experimental determination of interfacial toughness curves using Brazil-nut-sandwiches. Acta Metall. 1990, 38:1279-1290.
-
(1990)
Acta Metall.
, vol.38
, pp. 1279-1290
-
-
Wang, J.S.1
Suo, Z.2
-
136
-
-
0001127312
-
Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction
-
Wang P.-C., Cargill G.S., Noyan I.C., Hu C.-K. Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction. Appl. Phys. Lett. 1998, 72:1296-1298.
-
(1998)
Appl. Phys. Lett.
, vol.72
, pp. 1296-1298
-
-
Wang, P.-C.1
Cargill, G.S.2
Noyan, I.C.3
Hu, C.-K.4
-
137
-
-
0035806047
-
Electromigration threshold in copper interconnects
-
Wang P.-C., Filippi R.G. Electromigration threshold in copper interconnects. Appl. Phys. Lett. 2001, 78:3598-3600.
-
(2001)
Appl. Phys. Lett.
, vol.78
, pp. 3598-3600
-
-
Wang, P.-C.1
Filippi, R.G.2
-
138
-
-
0000362877
-
A simulation of electromigration-induced transgranular slits
-
Wang W., Suo Z., Hao T.-H. A simulation of electromigration-induced transgranular slits. J. Appl. Phys. 1996, 79:2394-2403.
-
(1996)
J. Appl. Phys.
, vol.79
, pp. 2394-2403
-
-
Wang, W.1
Suo, Z.2
Hao, T.-H.3
-
139
-
-
0001036992
-
The stress around a fault or crack in dissimilar media
-
Williams M.L. The stress around a fault or crack in dissimilar media. Bull. Seismological Soc. Am. 1959, 49:199-204.
-
(1959)
Bull. Seismological Soc. Am.
, vol.49
, pp. 199-204
-
-
Williams, M.L.1
-
140
-
-
0032094788
-
Two test specimens for determining the interfacial fracture toughness in flip-chip assemblies
-
Yan X., Agarwal R.K. Two test specimens for determining the interfacial fracture toughness in flip-chip assemblies. ASME Trans. J. Electron. Packag. 1998, 120:150-155.
-
(1998)
ASME Trans. J. Electron. Packag.
, vol.120
, pp. 150-155
-
-
Yan, X.1
Agarwal, R.K.2
-
141
-
-
0027045651
-
Thin film cracking and the roles of substrate and interface
-
Ye T., Suo Z., Evans A.G. Thin film cracking and the roles of substrate and interface. Int. J. Solids Struct. 1992, 29:2639-2648.
-
(1992)
Int. J. Solids Struct.
, vol.29
, pp. 2639-2648
-
-
Ye, T.1
Suo, Z.2
Evans, A.G.3
-
142
-
-
0035151265
-
Edge effects in thin film delamination
-
Yu H.H., He M.Y., Hutchinson J.W. Edge effects in thin film delamination. Acta Mater. 2001, 49:93-107.
-
(2001)
Acta Mater.
, vol.49
, pp. 93-107
-
-
Yu, H.H.1
He, M.Y.2
Hutchinson, J.W.3
-
145
-
-
0032715263
-
Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
-
Zhang Y.W., Bower A.F., Xia L., Shih C.F. Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion. J. Mech. Phys. Solids 1999, 47:173-199.
-
(1999)
J. Mech. Phys. Solids
, vol.47
, pp. 173-199
-
-
Zhang, Y.W.1
Bower, A.F.2
Xia, L.3
Shih, C.F.4
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