Novel room temperature wiring process of Ag nanoparticle paste

6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings

Volumn , Issue , 2007, Pages 110-113

  Wakuda, Daisuke ^a   Hatamura, Mariko ^a   Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Nanoparticle; Room temperature; Silver; Sintering

Indexed keywords

ADHESIVES; ELECTRONICS INDUSTRY; METHANOL; MICROELECTRONICS; NANOPARTICLES; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; PHOTONICS; POLYMERS; SINTERING;

AG NANO-PARTICLES; AIR-ATMOSPHERE; DISPERSANT; DODECYL AMINE; GLASS SUBSTRATES; LOW RESISTIVITY; NANOPARTICLE; ROOM TEMPERATURE; ROOM TEMPERATURES;

SILVER;

EID: 49949087949     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2007.4339149     Document Type: Conference Paper

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