Top-side chip contacts with low temperature joining technique (LTJT)

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn 6, Issue , 2004, Pages 4178-4182

  Mertens, C ^a   Rudzki, J ^a   Sittig, R ^a  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP TEMPERATURES; LOW TEMPERATURE JOINING TECHNIQUE (LTJT); SILVER POWDER APPLICATIONS; TOP-SIDE CHIP CONTACTS;

COOLING; ELECTRONIC EQUIPMENT; HIGH TEMPERATURE EFFECTS; STRENGTH OF MATERIALS; STRIP METAL; SUBSTRATES; THERMAL CONDUCTIVITY;

MICROPROCESSOR CHIPS;

EID: 8744250475     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PESC.2004.1354738     Document Type: Conference Paper

References (6)

1. M. Gerber and J. A. Ferreira, High temperature, high power density packaging for automotive applications, Power Electronics Specialist, PESC'03. IEEE 34th Annual Conference, pp 425-430, 2003.
2. R. Kuhnert and H. Schwarzbauer, A novel large area joining technique for improved power device performance, IEEE Trans. Ind. Appl., vol. 27. no. 1, pp. 93-95, Jan. 1991.
3. S. Klaka and R. Sittig, Reduction of Thermomechanical Stress by applying a Low Temperature Joining Technique, Proc. of the 6th International Symposium on Power Semiconductor Devices & ICs, ISPSD, Davos, Switzerland, May 31 - June 2, pp. 259-264, 1994.
4. C. Mertens and R. Sittig, Low Temperature Joining Technique for Improved Reliability, Proc. of the 2nd International Conference on Integreted Power Electronics Systems, CIPS 2002, Bremen, Germany, 2002.
5. R. Sittig and T. Steiner, Visions of power modules, Proc. of the 1st International Conference on Integrated Power Systems, CIPS 2000, Bremen, Germany, 2000.
6. M. Thoben, Zuverlässigkeit von grossflächigen Verbindungen in der Leistungselektronik, PhD-Thesis, Universität Bremen, Germany, 2002.