Deformation and fracture of single-crystal silicon theta-like specimens

Journal of Materials Research

Volumn 26, Issue 20, 2011, Pages 2575-2589

  Gaither, Michael S ^a   Delrio, Frank W ^a   Gates, Richard S ^a   Cook, Robert F ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEEP REACTIVE ION ETCHING; DEFORMATION AND FRACTURE; DESIGN PARAMETERS; DRIE PROCESS; FAILURE LOCATIONS; FRACTOGRAPHIC OBSERVATIONS; GREEK LETTERS; INSTRUMENTED INDENTATION; MICROSCALE DEFORMATION; PROCESSING-STRUCTURE-PROPERTY RELATIONSHIPS; SINGLE CRYSTAL SILICON; SPECIMEN GEOMETRY; STRENGTH DISTRIBUTION; TEST SPECIMENS; TESTING PROTOCOLS; ULTRA-SMALL;

DEFORMATION; MECHANICAL PROPERTIES; MEMS; MICROELECTROMECHANICAL DEVICES; REACTIVE ION ETCHING; SURFACE ROUGHNESS;

FRACTURE;

EID: 80054915903     PISSN: 08842914     EISSN: 20445326     Source Type: Journal    
DOI: 10.1557/jmr.2011.319     Document Type: Article

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