Evaluation of damage on silicon wafers using the angle lapping method and a biaxial fracture strength test

Journal of Ceramic Processing Research

Volumn 5, Issue 2, 2004, Pages 171-174

  Jeong, Seong Min ^a   Park, Sung Eun ^a   Oh, Han Seog ^a   Lee, Hong Lim ^a  

^a Yonsei University   (South Korea)

Author keywords

Angle lapping method; Depth of damage; Fracture strength; Ring on ring test; Silicon wafer

Indexed keywords

SILICON;

ANALYSIS; ANALYTIC METHOD; ANGLE LAPPING METHOD; ARTICLE; BIAXIAL FRACTURE STRENGTH TEST; CORRELATION ANALYSIS; EVALUATION; EXPERIMENTAL TEST; MEASUREMENT; MECHANICS; STRENGTH;

EID: 4043062384     PISSN: 12299162     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

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