A Sequential Tensile Method for Rapid Characterization of Extreme-value Behavior in Microfabricated Materials

Experimental Mechanics

Volumn 50, Issue 7, 2010, Pages 993-997

  Boyce, B L ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Fracture; MEMS; Silicon; Strength; Weibull

Indexed keywords

CONVENTIONAL MATERIALS; CUT-OFF; DATA SETS; FLAW SIZE DISTRIBUTION; FRACTURE STRENGTHS; HIGH-THROUGHPUT; MECHANICAL TESTS; MICRO TENSILE TESTS; MICROELECTROMECHANICAL SYSTEMS; MICROFABRICATED; POLY-CRYSTALLINE SILICON; SEQUENTIAL METHODS; STRENGTH; STRENGTH DISTRIBUTION; STRUCTURAL MATERIALS; TENSILE FAILURES; TENSILE METHOD; TENSILE TESTS; THREE-PARAMETER WEIBULL; THRESHOLD STRESS; WEIBULL;

BENDING STRENGTH; BENDING TESTS; COMPOSITE MICROMECHANICS; FRACTURE TOUGHNESS; MATERIALS; MEMS; MICROELECTROMECHANICAL DEVICES; MICROFABRICATION; POLYCRYSTALLINE MATERIALS; POLYMER BLENDS; POLYSILICON; STATISTICAL TESTS; TENSILE STRENGTH; TENSILE TESTING; WEIBULL DISTRIBUTION;

FRACTURE;

EID: 77955918430     PISSN: 00144851     EISSN: 17412765     Source Type: Journal    
DOI: 10.1007/s11340-009-9286-x     Document Type: Article

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