A methodology for accurately measuring mechanical properties on the micro-scale

Strain

Volumn 47, Issue 3, 2011, Pages 288-300

  Banks Sills, L ^a   Shklovsky, J ^a   Krylov, S ^a   Bruck, H A ^b   Fourman, V ^a   Eliasi, R ^a   Ashkenazi, D ^a  

^a TEL AVIV UNIVERSITY   (Israel)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

digital image correlation; failure stress; microelectromechanical system; single crystal silicon; tensile testing; Young's modulus

Indexed keywords

DIGITAL IMAGE CORRELATIONS; FAILURE STRESS; MICRO ELECTRO MECHANICAL SYSTEM; SINGLE CRYSTAL SILICON; YOUNG'S MODULUS;

COMPOSITE MICROMECHANICS; ELASTIC MODULI; ELASTICITY; FRACTURE; IMAGE ANALYSIS; MATERIALS PROPERTIES; MATERIALS TESTING APPARATUS; MECHANICAL PROPERTIES; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; MONOCRYSTALLINE SILICON; OPTICAL CORRELATION; OPTICAL MICROSCOPY; PHOTOLITHOGRAPHY; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; STRAIN; STRAIN MEASUREMENT; STRESS-STRAIN CURVES; TENSILE STRENGTH; TENSILE TESTING;

SINGLE CRYSTALS;

EID: 79955734886     PISSN: 00392103     EISSN: 14751305     Source Type: Journal    
DOI: 10.1111/j.1475-1305.2009.00692.x     Document Type: Article

References (60)

1. Petersen, K. E., and, Guarnieri, C. R., (1979) Young's modulus measurements on thin films using micromechanics. J. Appl. Phys. 50, 6761-6766. (Pubitemid 11420579)
2. Zhang, L. M., Uttamchandani, D., and, Culshaw, B., (1991) Measurement of the mechanical properties of silicon microresonators. Sens. Actuators A 29, 79-84.
3. Reddy, A., Kahn, H., and, Heuer, A. H., (2007) A MEMS-based evaluation of the mechanical properties of metallic thin films. J. MEMS. 16, 650-658. (Pubitemid 47241364)
4. Shojaei, O. R., and, Karimi, A., (1998) Comparison of mechanical properties on TiN thin films using nanoindentation and the bulge test. Thin Solid Films 332, 202-208. (Pubitemid 128423190)
5. Kunert, M., (2000) Mechanical Properties on Nanometer Scale and Their Relations to Composition and Microstructure. A Nanoindentation Study on Carbon Implanted Ti-6Al-4V. PhD Thesis. Faculty of Chemistry, University of Stuttgart, Germany.
6. Pruessner, M. W., King, T. T., Kelly, D. P., Grover, R., Calhoun, L. C., and, Ghodssi, R., (2003) Mechanical property measurement of InP-based MEMS for optical communications. Sens. Actuators A 105, 190-200.
7. Schneider, D., and, Tucker, M. D., (1996) Non-destructive characterization and evaluation of thin films by laser induced ultrasonic surface waves. Thin Solid Films 290/291, 305-311. (Pubitemid 126391108)
8. Schoedel, K., (2004) Ultrasonic thin-film testing: a laser ultrasonic testing method rapidly determines many physical properties of thin films nondestructively. Adv. Mater. Process 162, 35-37.
9. Henein, G. E., and, Hilliard, J. E., (1983) Elastic modulus in composition-modulated silver-palladium and copper-gold foils. J. Appl. Phys. 54, 728-733. (Pubitemid 13525442)
10. Allen, M. G., Mehregany, M., Howe, R. T., and, Senturia, S. D., (1987) Microfabricated structures for the in situ measurements of residual stress, Young's modulus and ultimate strain of thin films. Appl. Phys. Lett. 51, 241-243.
11. Kalkman, A. J., and, Verbruggen, A. H., (2003) High-temperature bulge-test setup for mechanical testing of free-standing thin films. Rev. Sci. Instrum. 74, 1383-1385.
12. Edwards, R. L., Coles, G., and, Sharpe, W. N., (2004) Comparison of tensile and bulge tests for thin-film silicon nitride. Exp. Mech. 44, 49-54. (Pubitemid 38261610)
13. Johansson, S., Schweitz, J., Tenerz, L., and, Tirén, J., (1988) Fracture testing of silicon microelements in situ in a scanning electron microscope. J. Appl. Phys. 63, 4799-4803.
14. Osterberg, P. M., and, Senturia, S. D., (1997) M-TEST: a test chip for MEMS material property measurement using electrostatically actuated test structures. J. MEMS. 6, 107-118. (Pubitemid 127607041)
15. Serre, C., Pérez-Rodríguez, A., Romano-Rodríguez, A., Morante, J. R., Esteve, J., and, Acero, M. C., (1999) Test microstructures for measurement of SiC thin film mechanical properties. J. Micromech. Microeng. 9, 190-193.
16. Namazu, T., Isono, Y., and, Tanaka, T., (2000) Evaluation of size effect on mechanical properties of single crystal silicon by nanoscale bending test using AFM. J. MEMS. 9, 450-459. (Pubitemid 32169006)
17. Liu, Y., Hata, S., Wada, K., and, Shimokohbe, A., (2001) Thermal, mechanical and electrical properties of Pd-based thin-film metallic glass. Jpn. J. Appl. Phys. 40, 5382-5388. (Pubitemid 33141876)
18. Jensen, B. D., de Boer, M. P., Masters, N. D., Bitsie, F., and, La Van, D. A., (2001) Interferometry of actuated microcantilevers to determine material properties and test structure nonidealities in MEMS. J. MEMS. 10, 336-346. (Pubitemid 32988351)
19. Sundararajan, S., Bhushan, B., Namazu, T., and, Isono, Y., (2002) Mechanical property measurements of nanoscale structures using an atomic force microscope. Ultramicroscopy 91, 111-118. (Pubitemid 34831625)
20. Espinosa, H. D., Prorok, B. C., Peng, B., Kim, K. H., Moldovan, N., Auciello, O., Carlisle, J. A., Gruen, D. M., and, Mancini, D. C., (2003) Mechanical properties of ultrananocrystalline diamond thin films relevant to MEMS/NEMS devices. Exp. Mech. 43, 256-268. (Pubitemid 37245266)
21. Ando, T., Sato, K., Shikida, M., Yoshioka, T., Yoshikawa, Y., and, Kawabata, T., (1997) Orientation-dependent fracture strain in single-crystal silicon beams under uniaxial tensile conditions. International Symposium on Micromechanics and Human Science, Nagoya, Japan, 55-60.
22. Sato, K., Yoshioka, T., Ando, T., Shikida, M., and, Kawabata, T., (1998) Tensile testing of silicon film having different crystallographic orientations carried out on a silicon chip. Sens. Actuators A 70, 148-152. (Pubitemid 128399827)
23. Prorok, B. C., and, Espinosa, H. D., (2002) Effects of nanometer-thick passivation layers on the mechanical response of thin gold films. J. Nanosci. Nanotechnol. 2, 1-7.
24. Espinosa, H. D., and, Prorok, B. C., (2003) Size effects on the mechanical behavior of gold thin films. J. Mater. Sci. 38, 4125-4128.
25. Espinosa, H. D., Prorok, B. C., and, Fischer, M., (2003) A methodology for determining mechanical properties of freestanding thin films and MEMS materials. J. Mech. Phys. Solids 51, 47-67. (Pubitemid 35282039)
26. Espinosa, H. D., Peng, B., Prorok, B. C., Moldovan, N., Auciello, O., Carlisle, J. A., Gruen, D. M., and, Mancini, D. C., (2003) Fracture strength of ultrananocrystalline diamond thin films-identification of Weibull parameters. J.Appl. Phys. 94, 6076-6084.
27. Espinosa, H. D., Prorok, B. C., and, Peng, B., (2004) Plasticity size effects in free-standing submicron polycrystalline FCC films subjected to pure tension. J. Mech. Phys. Solids 52, 667-689.
28. Auciello, O., Birrell, J., Carlisle, J. A., Gerbi, J. E., Xiao, X., Peng, B., and, Espinosa, H. D., (2004) Materials science and fabrication processes for a new MEMS technology based on ultrananocrystalline diamond thin films. J. Phys: Condens. Matter 16, R539-R552.
29. Nakao, S., Ando, T., Shikida, M., and, Sato, K., (2006) Mechanical properties of a micron-sized SCS film in a high-temperature environment. J. Micromech. Microeng. 16, 715-720.
30. Mazza, E., Abel, S., and, Dual, J., (1996) Experimental determination of mechanical properties of Ni and Ni-Fe microbars. Microsyst. Technol. 2, 197-202. (Pubitemid 126479315)
31. Sharpe, W. N. Jr, Yuan, B., Vaidyanathan, R., and, Edwards, R. L., (1997) Measurements of Young's modulus, Poisson's ratio, and tensile strength of polysilicon. Proceedings of the IEEE Tenth International Workshop on MEMS, Nagoya, Japan, 424-429.
32. Ogawa, H., Suzuki, K., Kaneko, S., Nakano, Y., Ishikawa, Y., and, Kitahara, T., (1997) Tensile testing of microfabricated thin films. Microsyst. Technol. 3, 117-122.
33. Chasiotis, I., and, Knauss, W. G., (1998) Mechanical evaluation of polysilicon properties by means of probe microscopy. Proceedings of the SPIE Conference on Materials and Device Characterization in Micromachining, Santa Clara, CA, Vol. 3512, 66-75.
34. Tsuchiya, T., Tabata, O., Sakata, J., and, Taga, Y., (1998) Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin films. J. MEMS. 7, 106-113. (Pubitemid 128604770)
35. Read, D., (1998) Young's modulus of thin films by speckle interferometry. Meas. Sci. Technol. 9, 676-685. (Pubitemid 128559922)
36. Suwito, W., Dunn, M. L., Cunningham, S. J., and, Read, D. T., (1999) Elastic moduli, strength, and fracture initiation at sharp notches in etched single crystal silicon microstructures. J. Appl. Phys. 85, 3519-3534. (Pubitemid 129310673)
37. LaVan, D. A., and, Sharpe, W. N., Jr, (1999) Tensile testing of microsamples. Exp. Mech. 39, 210-216. (Pubitemid 29524572)
38. Sharpe, W. N., Jr, Turner, K. T., and, Edwards, R. L., (1999) Tensile testing of polysilicon. Exp. Mech. 39, 161-170.
39. Greek, S., Ericson, F., Johansson, S., Fürtsch, M., and, Rump, A., (1999) Mechanical characterization of thick polysilicon films: Young's modulus and fracture strength evaluated with microstructures. J. Micromech. Microeng. 9, 245-251. (Pubitemid 129655785)
40. Chasiotis, I., and, Knauss, W. G., (2000) Microtensile tests with the aid of probe microscopy for the study of MEMS materials. Proceedings of the SPIE Conference on Materials and Device Characterization in Micromachining III, Santa Clara, CA, Vol. 4175, 96-103. (Pubitemid 32023902)
41. Yi, T., Li, L., and, Kim, C. J., (2000) Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength. Sens. Actuators A 83, 172-178.
42. Sharpe, W. N., Jr, Jackson, K. M., Hemker, K. J., and, Xie, Z., (2001) Effect of specimen size on Young's modulus and fracture strength of polysilicon. J. MEMS. 10, 317-326. (Pubitemid 32981785)
43. Haque, M. A., and, Saif, M. T. A., (2002) In-situ tensile testing of nano-scale specimens in SEM and TEM. Exp. Mech. 42, 123-128. (Pubitemid 34412427)
44. Sharpe, W. N., Jr, (2003) Tensile testing at the micrometer scale: opportunities in experimental mechanics. Exp. Mech. 43, 228-237. (Pubitemid 37240923)
45. Zhu, Y., Barthelat, F., Labossiere, P. E., Moldovan, N., and, Espinosa, H. D., (2003) Nanoscale displacement and strain measurement. SEM Annual Conference and Exposition on Experimental and Applied Mechanics, paper 155.
46. Tsuchiya, T., Hirata, M., Chiba, N., et al., (2003) Cross comparison of thin film tensile-testing methods examined using single-crystal silicon, polysilicon, nickel and titanium films. J. MEMS. 14, 1178-1186. (Pubitemid 41555306)
47. Namazu, T., Inoue, S., Ano, D., and, Koterazawa, K., (2004) Direct measurement technique of strain in XRD tensile test for evaluating Poisson's ratio of micron-thick TiN films. Proceedings of the Seventeenth International Conference on Micro Electro Mechanical Systems, Maastricht, The Netherlands, 157-160.
48. Namazu, T., and, Inoue, S., (2007) Characterization of single crystal silicon and electroplated nickel films by uniaxial tensile test with in situ X-ray diffraction measurement. Fatigue Fract. Eng. Mater. Struct. 30, 13-20. (Pubitemid 46111636)
49. Cho, S. W., and, Chasiotis, I., (2007) Elastic properties and representative volume element of polycrystalline silicon for MEMS. Exp. Mech. 47, 37-49. (Pubitemid 46454760)
50. Sharpe, W. N., Jr, Pulskamp, J., Gianola, D. S., Eberl, C., Polcawich, R. G., and, Thompson, R. J., (2007) Strain measurements of silicon dioxide microspecimens by digital imaging processing. Exp. Mech. 47, 649-658. (Pubitemid 47470713)
51. Kraft, O., (2001) Thin films: mechanical testing. Encyclopedia of Materials: Science and Technology. Elsevier Science Ltd, Oxford.
52. LaVan, D. A., Tsuchiya, T., Coles, G., Knauss, W. G., Chasiotis, I., and, Read, D., (2001) Cross comparison of direct tensile testing techniques on polysilicon films. Mechanical Properties of Structural Films, ASTM STP 1413. American Society for Testing and Materials, PA.
53. ASTM standard (2006) Standard test method for tension testing of metallic materials [metric], E 8M-04. Annual Book of ASTM Standards, Vol. 03.01. American Society for Testing and Materials, West Conshohocken, PA.
54. Correlated Solutions, Inc. (2008) VIC-2D Digital Image Correlation, version 4.4.2. Correlated Solutions, Inc., Columbia, SC.
55. Soft Imaging Systems (2002) ANALYSIS version 3.2. Soft Imaging Systems, Münster, Germany.
56. Bevington, P. R., (1969) Data Reduction and Error Analysis for the Physical Sciences. McGraw-Hill, Inc., New York.
57. Bruck, H. A., McNeil, S. R., Sutton, M. A., and, Petters III, W. H., (1989) Digital image correlation using Newton-Raphson method of partial differential correction. Exp. Mech. 29, 261-267. (Pubitemid 20612785)
58. McSkimin, H. J., (1953) Measurement of elastic constants at low temperatures by means of ultrasonic waves-data for silicon and germanium single crystals, and for fused silica. J. Appl. Phys. 24, 988-997.
59. Wortman, J. J., and, Evans, R. A., (1965) Young's modulus, shear modulus, and Poisson's ratio in silicon and germanium. J. Appl. Phys. 36, 153-156.
60. Ting, T. C. T., (1996) Anisotropic Elasticity-Theory and Applications. Oxford University Press, Oxford.