Fractographic analysis of very small theta specimens

Key Engineering Materials

Volumn 409, Issue , 2009, Pages 201-208

  Quinn, George D ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

Etch pits; Flaws; Silicon; Strength; Theta specimen

Indexed keywords

DEFECTS; SILICON; SINGLE CRYSTALS;

DEEP REACTIVE ION ETCHING; ETCH PITS; FRACTOGRAPHIC ANALYSIS; MINIATURE SPECIMENS; NANO-INDENTATION HARDNESS; SINGLE-CRYSTAL SILICON WAFERS; STRENGTH; THETA SPECIMEN;

SILICON WAFERS;

EID: 68549104203     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/KEM.409.201     Document Type: Conference Paper

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