Improved strength of boron-doped Sn-1.0Ag-0.5Cu solder joints under aging conditions

Intermetallics

Volumn 20, Issue 1, 2012, Pages 155-159

  Choi, Hyelim ^a   Lee, Tae Kyu ^b   Kim, Yunsung ^a   Kwon, Hoon ^a   Tseng, Chien Fu ^c   Duh, Jenq Gong ^c   Choe, Heeman ^a  

^a Kookmin University   (South Korea)

^b CISCO SYSTEMS   (United States)

^c NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

A. Ternary alloy systems; B. Alloy design; B. Grain growth; B. Microalloying; F. Trace element analysis

Indexed keywords

B. ALLOY DESIGN; B. GRAIN GROWTH; B. MICROALLOYING; F. TRACE ELEMENT ANALYSIS; TERNARY ALLOY SYSTEMS;

BORON; COPPER ALLOYS; GRAIN GROWTH; GRAIN SIZE AND SHAPE; INTERMETALLICS; MECHANICAL PROPERTIES; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TERNARY ALLOYS; TIN ALLOYS; TRACE ANALYSIS; TRACE ELEMENTS;

TIN;

EID: 80053644257     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2011.09.008     Document Type: Article

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