Effect of surface finish on mechanical and electrical properties of Sn-3.5Ag ball grid array (BGA) solder joint with multiple reflow

Journal of Korean Institute of Metals and Materials

Volumn 47, Issue 4, 2009, Pages 261-266

  Sung, Ji Yoon ^a   Pyo, Sung Eun ^a   Koo, Ja Myeong ^b   Yoon, Jeong Won ^a   Shin, Young Eui ^c   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

^c Chung Ang University   (South Korea)

Author keywords

BGA; ENIG; OSP; Pb free solder; Solder joint

Indexed keywords

EID: 67650179210     PISSN: 17388228     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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