Impact of isothermal aging on long-term reliability of fine-pitch ball grid array packages with Sn-Ag-Cu solder interconnects: Surface finish effects

Journal of Electronic Materials

Volumn 39, Issue 12, 2010, Pages 2564-2573

  Lee, Tae Kyu ^a   Ma, Hongtao ^a   Liu, Kuo Chuan ^a   Xue, Jie ^a  

^a CISCO SYSTEMS   (United States)

Author keywords

isothermal aging; microstructure; Ni Au surface finish; OSP surface finish; Pb free solder

Indexed keywords

AGING CONDITIONS; BALL GRID ARRAY PACKAGES; DIFFERENT MECHANISMS; DWELL TIME; FATIGUE LIFETIME; FINE-PITCH BALL GRID ARRAY PACKAGES; ISOTHERMAL AGING; MICROSTRUCTURE EVOLUTIONS; MICROSTRUCTURE TRANSFORMATIONS; NI/AU SURFACE FINISH; ORGANIC SOLDERABILITY PRESERVATIVE; OSP SURFACE FINISH; PACKAGE SUBSTRATES; PB FREE SOLDERS; SN-3.0AG-0.5CU; SNAGCU SOLDER; SOLDER BALLS; SOLDER COMPOSITION; SOLDER JOINTS; SURFACE FINISHES; THERMAL PERFORMANCE; WEIBULL PLOTS;

BALL GRID ARRAYS; FINISHING; LEAD; MICROSTRUCTURE; PACKAGING; PHASE INTERFACES; RELIABILITY; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; SPHERES; THERMAL AGING; THERMAL CYCLING; TIN; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 78049528019     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1352-8     Document Type: Conference Paper

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