The interfacial reactions and reliability of SnAgCu solder joints under thermal shock cycles

Journal of Korean Institute of Metals and Materials

Volumn 47, Issue 8, 2009, Pages 500-507

  Oh, Chulmin ^a   Park, Nochang ^a   Han, Changwoon ^a   Bang, Mansoo ^b   Hong, Wonsik ^a  

^a Korea Electronic Technology Institute (KETI)   (South Korea)

^b Engineering Division   (South Korea)

Author keywords

Failure mode; Low ag solder; Pb free solder joint; Reliability; Thermal shock

Indexed keywords

EID: 77949422444     PISSN: 17388228     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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