Effects of load and thermal conditions on Pb-free solder joint reliability

Journal of Electronic Materials

Volumn 33, Issue 12, 2004, Pages 1507-1515

  Liang, J ^a   Downes, S ^a   Dariavach, N ^a   Shangguan, D ^b   Heinrich, S M ^c  

^a India Center of Excellence   (United States)

^b FLEXTRONICS INTERNATIONAL   (United States)

^c MARQUETTE UNIVERSITY   (United States)

Author keywords

Creep; Fatigue; Lead free; Solder joint reliability

Indexed keywords

CREEP; DATA REDUCTION; RELIABILITY; SOLDERED JOINTS; STRAIN; STRESS ANALYSIS; THERMOANALYSIS; TIN;

COEFFICIENT OF THERMAL EXPANSION (CTE); FATIGUE; LEAD FREE; SOLDER JOINT RELIABILITY;

LEAD;

EID: 11344254583     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0092-z     Document Type: Conference Paper

References (23)

1. National Center for Manufacturing Sciences, Lead-Free Solder Project, Final Report, NCMS Report 0401RE96 (Ann Arbor, MI: National Center for Manufacturing Sciences, 1997).
2. J. Hwang, Surf. Mount Technol. 15, 70 (2001).
3. J. Liang, N. Gollhardt, P.S. Lee, and S. Heinrich, Proc. Advances in Electronic Packaging (New York: ASME, 1997), pp. 1583-1592.
4. D.S. Stone and M.M. Rashid, in The Mechanics of Solder Alloy Interconnects, eds. D.R. Frear, S.N. Burchett, H.S. Morgan, and J.H. Lau (New York: Van Nostrand Reinhold, 1994), pp. 87-157.
5. D. Shangguan, Study of Compatibility for Lead-free Solder PCB Assembly. Proc. IPC and Soldertec First International Conference on Lead-Free Electronics, June 2003, Brussels, Belgium, pp. 298-306.
6. J. Clech, Proc. IPC/SMEMA APEX 2004 Conf., Anaheim, CA, 21-26 February 2004.
7. J. Lau, N. Hoo, R. Horsley, J. Smetana, D. Shangguan, W. Dauksher, D. Love, I. Menis, and Sullivan, Reliability Testing and Data Analysis of High-Density Packages' Lead-Free Solder Joints. Proceedings of APEX 2003, March 2003, Anaheim, CA, pp. S42-3-1/24.
8. J. Liang, N. Dariavach, and S. Downs, IPC/Soldertec Global 2nd Int. Conf. on Lead Free Electronics, Towards Implementation of the RoHS Directive, Amsterdam, 21-23 June, 2004.
9. W. Ren, M. Lu, S. Liu, and D. Shangguan, Soldering Surf. Mount Technol. 9, 37 (1997).
10. T.A. Woodrow, Proc. Int. Conf. on Lead-Free Components and Assemblies (Northbrook, IL: IPC, 2002), pp. 117-129.
11. S. Heinrich, J. Liang, and P.S. Lee, Proc. Adv. Electron. Packaging (New York: ASME, 1999) pp. 43-53.
12. S.M. Heinrich, P.S. Lee, and J. Liang, Proc. 2002 ASME Int. Mechanical Engineering Congress Expo. (New York: ASME, 2002), pp. 485-498.
13. W. Engelmaier, in Solder Joint Reliability - Theory and Applications, ed. J.H. Lau (New York: Van Nostrand Reinhold, 1991), pp. 545-587.
14. M. Kitano and M. Honda, Proc. Advances in Electronic Packaging (New York: ASME, 1997), pp. 1407-1412.
15. R. Satoh, K. Arakawa, M. Harada, and K. Matsui, IEEE Trans. CHMT 14, 224 (1991).
16. H.D. Solomon, in Low Cycle Fatigue, ASTM STP 942, eds. H.D. Solomon, G.R. Halford, L.R. Kaisand, and B.N. Leis (Philadelphia, PA: ASTM, 1988), pp. 342-370.
17. J. Liang, Int. J. Fatigue Fract. Eng. Mater. Struct. 19, 1401 (1996).
18. J. Liang, N. Gollhardt, P.S. Lee, S.A. Schroeder, and W.L. Morris, Proc. Applications of Experimental Mechanics to Electronic Packaging (New York: ASME, 1995), pp. 1-9.
19. M. Mukai, T. Kawakami, Y. Hiruta, K. Takahashi, K. Kishimoto, and T. Shibuya, J. Electron. Packaging 120, 207 (1998).
20. Q. Zhang, P. Friesen, and A. Dasgupta, CALCE Project C0305, 2003 (private communication).
21. J. Liang and R.M. Pelloux, Chin J. Met. Sci. Technol. 5, 1 (1989).
22. J.D. Morrow, Cyclic Plastic Strain Energy and Fatigue of Metals, ASTM STP 378 (West Conshohocken, PA: ASTM International, 1964), pp. 45-87.
23. D. Xie, M. Arra, H. Phan, D. Shangguan, D. Geiger, and S. Yi, Proc. Telecomm Hardware Solutions Conf. Exhibit. (Edina, MN: SMTA; Washington, DC: IMAPS, 2002), pp. 83-88.