Ball grid array reliability assessment for aerospace applications

Microelectronics Reliability

Volumn 39, Issue 1, 1999, Pages 107-112

  Ghaffarian, R ^a   Kim, N P ^b  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^b BOEING COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AEROSPACE APPLICATIONS; ELECTRONICS PACKAGING; FAILURE ANALYSIS; SCANNING ELECTRON MICROSCOPY; THERMAL CYCLING; WEIBULL DISTRIBUTION;

BALL GRID ARRAYS (BGA);

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0032623481     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(98)00185-1     Document Type: Article

References (2)

1. Ghaffarian R. Area array technology evaluation for space and military applications. In: The 1996 International Flip Chip Gall Grid Array, TAB and Advanced Packaging Symposium Proceedings, San Jose, February 13-16. Neffs (PA, USA): Semitech, 1996.
2. Ghaffarian R. CBGA/PBGA package planarity and assembly reliability. In: The 1997 International Flip Chip Ball Grid Array, TAB and Advanced Packaging Symposium Proceedings, San Jose, February 17-19. Neffs (PA, USA): Semitech, 1997.