Fracture strength of ultrananocrystalline diamond thin films - Identification of Weibull parameters

Journal of Applied Physics

Volumn 94, Issue 9, 2003, Pages 6076-6084

  Espinosa, H D ^a   Peng, B ^a   Prorok, B C ^a   Moldovan, N ^a   Auciello, O ^b   Carlisle, J A ^b   Gruen, D M ^b   Mancini, D C ^b  

^a Northwestern University   (United States)

^b ARGONNE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIAMONDS; FILM GROWTH; FRACTURE TOUGHNESS; MICROELECTROMECHANICAL DEVICES; NANOSTRUCTURED MATERIALS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PROBABILITY; STRESS ANALYSIS; TENSILE TESTING; ULTRASONICS; WEIBULL DISTRIBUTION;

SUBMICRON FILMS; ULTRASONIC AGITATION;

THIN FILMS;

EID: 0242664700     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1613372     Document Type: Article

References (31)

1. D. M. Gruen, Annu. Rev. Mater. Sci. 29, 211 (1999).
2. D. M. Gruen, S. Liu, A. R. Krauss, J. Luo, and X. Pan, Appl. Phys. Lett. 64, 1502 (1994).
3. D. M. Gruen, S. Liu, A. R. Krauss, and X. Pan J. Appl. Phys. 75, 1758 (1994).
4. B. Bhattacharyya et al., Appl. Phys. Lett. 79, 1441 (2001).
5. K. E. Peterson, Proc. IEEE 70, 5 (1982).
6. S. Christiansen, M. Albrecht, and H. P. Strunk, J. Mater. Res. 11, 8 (1996).
7. G. F. Cardinale and C. J. Robinson, J. Mater. Res. 7, 6 (1992).
8. K. M. Jackson, R. L. Edwards, G. F. Dirras, and W. N. Sharpe, Mater. Res. Soc. Symp. Proc. 687, 631 (2002).
9. W. N. Sharpe, Jr., K. M. Jackson, K. J. Hemker, and Z. Xie, J. Microelectromech. Syst. 10, 3 (2001).
10. W. N. Sharpe, Jr., K. Jackson, G. Coles, and D. A. LaVan, Mater. Res. Soc. Symp. Proc. 657, 51 (2001).
11. J. E. Field, The Properties of Diamond (London, 1979).
12. B. C. Prorok, H. D. Espinosa, B. Peng, N. Moldovan, D. M. Gruen, O. Auciello, J. A. Carlisle, and D. C. Mancini, J. Exp. Mech. (in press).
13. H. D. Espinosa, B. C. Prorok, K.-H. Kim, B. Peng, O. Auciello, J. A. Carlisle, D. M. Gruen, N. Moldovan, and D. C. Mancini, Mater. Res. Soc. Symp. Proc. 741, 42 (2002).
14. G. Coles, W. N. Sharpe, Jr., and R. L. Edwards, Soc. Exp. Mech. 1-4, 176 (2001).
15. O. Auciello et al., Mater. Res. Soc. Symp. Proc. 605, 78 (2000).
16. A. R. Krauss et al., Diamond Relat. Mater. 10, 1952 (2001).
17. N. Moldovan et al., Proc. SPIE 4557, 288 (2001).
18. H. D. Espinosa, B. C. Prorok, and M. Fischer, J. Mech. Phys. Solids 51, 67 (2003).
19. W. N. Sharpe, Jr., K. T. Turner, and R. L. Edwards, J. Exp. Mech. 39, 3 (1999).
20. W. N. Sharpe, Jr., K. M. Jackson, K. J. Hemker, and Zielang Xie, J. Microelectromech. Syst. 10, 3 (2001).
21. I. Chasiotis and W. G. Knauss, Proc. SPIE 4175, 2 (2000).
22. I. Chasiotis and W. G. Knauss, Mater. Res. Soc. Symp. Proc. 657, 221 (2001).
23. J. Bagdahn and W. N. Sharpe, Jr., Mater. Res. Soc. Symp. Proc. 687, 971 (2002).
24. D. A. LaVan, T. Tsuchiya, G. Coles, W. G. Knauss, I. Chasiotis, and D. Read, ASTM Spec. Tech. Publ. 1413, 10 (2001).
25. T. T. Shih, Eng. Fract. Mech. 13, 257 (1980).
26. J. Birrell, J. A. Carlisle, O. Auciello, D. M. Gruen, and J. M. Gibson, Appl. Phys. Lett. 81, 2235 (2002).
27. D. M. Gruen et al., Appl. Phys. Lett. 68, 1640 (1996).
28. B. R. Lawn, Fracture of Brittle Solids, 2nd ed. (Cambridge University Press, Cambridge, 1993).
29. J. D. Sullivan and P. H. Lauzon, J. Mater. Sci. Lett. 5, 1245 (1986).
30. N. N. Nemeth, O. Jadaan, J. P. Palko, J. Mitchell, and C. A. Zorman, Proceedings of the MEMS: Mechanical and Measurement Symposium 2001, p. 46.
31. A. J. Hallinan, Jr., J. Quality Technol. 25, 2 (1993).