-
1
-
-
33845564727
-
Thermal Properties of Oxide Free Nano Non Noble Metal for Low Temperature Interconnect Technology
-
San Diego CA, to be published
-
Hongjin Jiang, Kyoung-sik Moon, Hai Dong; and Fay Hua, "Thermal Properties of Oxide Free Nano Non Noble Metal for Low Temperature Interconnect Technology", Proc. 56th IEEE Electronic Component & technology conference, San Diego CA, (2006) to be published.
-
(2006)
Proc. 56th IEEE Electronic Component & technology conference
-
-
Jiang, H.1
Moon, K.-S.2
Dong, H.3
Hua, F.4
-
2
-
-
0001233757
-
An electron microscope study of evaporating gold particles: The Kelvin equation for liquid gold and the lowering of the melting point of solid gold particles
-
J. R. Sambles, "An electron microscope study of evaporating gold particles: the Kelvin equation for liquid gold and the lowering of the melting point of solid gold particles," Proc. Roy. Soc. Lond. A. 324, (1971), pp. 339-351.
-
(1971)
Proc. Roy. Soc. Lond. A
, vol.324
, pp. 339-351
-
-
Sambles, J.R.1
-
4
-
-
54049090554
-
Single-Electron Transistors
-
Richard C. Dorf editor, CRC/Taylor & Francis
-
James. E. Morris, "Single-Electron Transistors," in "The Electrical Engineering Handbook Third edition): Electronics, Power Electronics, Optoelectronics, Microwaves, Electromagnetics, and Radar," Richard C. Dorf (editor), CRC/Taylor & Francis, 2006, pp. 3.53-3.64.
-
(2006)
The Electrical Engineering Handbook Third edition): Electronics, Power Electronics, Optoelectronics, Microwaves, Electromagnetics, and Radar
-
-
James1
Morris, E.2
-
5
-
-
0003487115
-
Engineering Materials & their Applications (Second edition)
-
Houghton-Mifflin 1981, pp
-
Richard A. Flinn and Paul K. Trojan, "Engineering Materials & their Applications (Second edition)," Houghton-Mifflin (1981), pp. 75-77.
-
-
-
Flinn, R.A.1
Trojan, P.K.2
-
6
-
-
0141508708
-
Optical properties of well-defined granular metal systems
-
T. Yamaguchi, M. Sakai, and N. Saito, "Optical properties of well-defined granular metal systems," Phys. Rev. B, 32(4) 1985, pp. 2126-2130.
-
(1985)
Phys. Rev. B
, vol.32
, Issue.4
, pp. 2126-2130
-
-
Yamaguchi, T.1
Sakai, M.2
Saito, N.3
-
7
-
-
33847179109
-
Reliability testing of Polytronics Components in the Micro-Nano Region
-
Wroclaw, Poland
-
Bernd Michel, Rainer Dudek, and Hans Walter; "Reliability testing of Polytronics Components in the Micro-Nano Region", Proc. 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, (2005), pp. 13-15.
-
(2005)
Proc. 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics
, pp. 13-15
-
-
Michel, B.1
Dudek, R.2
Walter, H.3
-
8
-
-
24644483771
-
Material Characterization for Nano Wafer Level Packaging Application
-
Orlando FL
-
Sau Koh, Ranjan Rajoo, Rao Tummala, Ashok Saxena and Kuo Tsing Tsai, "Material Characterization for Nano Wafer Level Packaging Application", Proc. 55th IEEE Electronic Component & Technology Conference, Orlando FL, (2005), pp. 1670-1676.
-
(2005)
Proc. 55th IEEE Electronic Component & Technology Conference
, pp. 1670-1676
-
-
Koh, S.1
Rajoo, R.2
Tummala, R.3
Saxena, A.4
Kuo, T.5
-
9
-
-
24644436090
-
Nanoindentation of Single Crystal and Polycrystalline Copper Nanowires
-
Orlando FL
-
S.Bansal, E. Toimil-Molares, A. Saxena, and Rao R. Tummala, "Nanoindentation of Single Crystal and Polycrystalline Copper Nanowires", Proc. 55th IEEE Electronic Component & Technology Conference, Orlando FL, (2005), pp. 71-76.
-
(2005)
Proc. 55th IEEE Electronic Component & Technology Conference
, pp. 71-76
-
-
Bansal, S.1
Toimil-Molares, E.2
Saxena, A.3
Tummala, R.R.4
-
10
-
-
10444240063
-
-
Cell K Y Wong, Hongwei Gu, Bing Xu, and Matthew M Fyuen, A New Approach in Measuring Cu-EMC Adhesion Strength by AFM, Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas NV, (2004), pp 491-495.
-
Cell K Y Wong, Hongwei Gu, Bing Xu, and Matthew M Fyuen, "A New Approach in Measuring Cu-EMC Adhesion Strength by AFM", Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas NV, (2004), pp 491-495.
-
-
-
-
11
-
-
27844509132
-
-
Yamato Hayashi, Hirotsugu Takizawa, Masahiro Inoue, Koichi Niihara and Katsuaki Suganuma, Ecodesigns and Applications for Noble Metal Nanoparticles by Ultrasound Process, IEEE Transactions on Electronic Packaging Manufacturing, 28(4) October 2005, pp. 338 - 343. (Also Proc. Polytronic 2004.)
-
Yamato Hayashi, Hirotsugu Takizawa, Masahiro Inoue, Koichi Niihara and Katsuaki Suganuma, "Ecodesigns and Applications for Noble Metal Nanoparticles by Ultrasound Process", IEEE Transactions on Electronic Packaging Manufacturing, 28(4) October 2005, pp. 338 - 343. (Also Proc. Polytronic 2004.)
-
-
-
-
12
-
-
33746536094
-
Synthesis of Ag-Cu Alloy nanoparticles for lead-Free Interconnect Materials
-
Irvine, CA
-
Hongjin Jiang, Kyoung-sik Moon and C.P. Wong, "Synthesis of Ag-Cu Alloy nanoparticles for lead-Free Interconnect Materials", Proc. 10th IEEE/CPMT International Symposium on Advanced Packaging Materials, Irvine, CA, (2005).
-
(2005)
Proc. 10th IEEE/CPMT International Symposium on Advanced Packaging Materials
-
-
Jiang, H.1
Moon, K.-S.2
Wong, C.P.3
-
13
-
-
10444273187
-
Nano Metal Particles for Low Temperature Interconnect Technology
-
Las Vegas NV
-
Kyoung-sik Moon, Suresh Pothukuchi, Yi Li and C.P. Wong, "Nano Metal Particles for Low Temperature Interconnect Technology", Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas NV, (2004), pp. 1983-1988.
-
(2004)
Proc. 54th IEEE Electronic Component & Technology Conference
, pp. 1983-1988
-
-
Moon, K.-S.1
Pothukuchi, S.2
Li, Y.3
Wong, C.P.4
-
14
-
-
10444266678
-
Shape Controlled Synthesis of Nanoparticles and Their Incorporation into Polymers
-
Las Vegas NV
-
Suresh Pothukuchi, Yi Li and C.P. Wong, "Shape Controlled Synthesis of Nanoparticles and Their Incorporation into Polymers", Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas NV, (2004), pp. 1965-1967.
-
(2004)
Proc. 54th IEEE Electronic Component & Technology Conference
, pp. 1965-1967
-
-
Pothukuchi, S.1
Li, Y.2
Wong, C.P.3
-
15
-
-
33845588204
-
-
Jianwen Xu, Jianwen Xu, Swapan Bhattacharya, Kyoung-sik Moon, Jiongxin Lu, Brian Englert, and Pranabes Pramanik; Large-Area Processable High k Nanocomposite-Based Embedded Capacitors, Proc. 56th IEEE Electronic Component & Technology Conference, San Diego CA (2006) to be published.
-
Jianwen Xu, Jianwen Xu, Swapan Bhattacharya, Kyoung-sik Moon, Jiongxin Lu, Brian Englert, and Pranabes Pramanik; " Large-Area Processable High k Nanocomposite-Based Embedded Capacitors," Proc. 56th IEEE Electronic Component & Technology Conference, San Diego CA (2006) to be published.
-
-
-
-
16
-
-
33845563494
-
Printed Organic Electronics with a High K Nanocomposite Dielectric Gate Insulator
-
San Diego, CA , to be published
-
Amjad Rasul, Jie Zhang, and Dan Gamota, "Printed Organic Electronics with a High K Nanocomposite Dielectric Gate Insulator", Proc.56th IEEE Electronic Component & Technology Conference, San Diego, CA (2006), to be published.
-
(2006)
Proc.56th IEEE Electronic Component & Technology Conference
-
-
Rasul, A.1
Zhang, J.2
Gamota, D.3
-
17
-
-
33845579894
-
High Capacitance, Large Area, Thin Film, Nanocomposite Based Embedded Capacitors
-
San Diego CA () to be published
-
Rabindra Das, Mark Poliks, John Lauffer, and Voya Markovich; "High Capacitance, Large Area, Thin Film, Nanocomposite Based Embedded Capacitors", Proc. 56th IEEE Electronic Component & technology conference, San Diego CA (2006) to be published.
-
(2006)
Proc. 56th IEEE Electronic Component & technology conference
-
-
Das, R.1
Poliks, M.2
Lauffer, J.3
Markovich, V.4
-
18
-
-
33845592983
-
Molecularly Engineered Variable Nanocomposites to Embed Precision Capacitors onchip
-
San Diego, CA () to be published
-
Ronald Kubacki, "Molecularly Engineered Variable Nanocomposites to Embed Precision Capacitors onchip", Proc.56th IEEE Electronic Component & Technology Conference, San Diego, CA (2006) to be published.
-
(2006)
Proc.56th IEEE Electronic Component & Technology Conference
-
-
Kubacki, R.1
-
19
-
-
10444257181
-
Development of a Novel Polymer-Metal Nanocomposite Obtained through the Route of In Situ Reduction and it's Dielectric Properties
-
Las Vegas, NV
-
Yi Li, Suresh Pothukuchi and C.P. Wong; "Development of a Novel Polymer-Metal Nanocomposite Obtained through the Route of In Situ Reduction and it's Dielectric Properties",Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas, NV (2004) pp. 507-513.
-
(2004)
Proc. 54th IEEE Electronic Component & Technology Conference
, pp. 507-513
-
-
Li, Y.1
Pothukuchi, S.2
Wong, C.P.3
-
20
-
-
33746501964
-
Dielectric Loss Control of High-K Polymer Composites by Coulomb Blockade Effects of metal Nanoparticles for embedded Capacitor Applications
-
Irvine CA, to be published
-
Jiongxin Lu, Kyoung-Sik Moon, Jianwen Xu and C.P. Wong; "Dielectric Loss Control of High-K Polymer Composites by Coulomb Blockade Effects of metal Nanoparticles for embedded Capacitor Applications", Proc. 10th IEEE/CPMT International Symposium on Advanced Packaging Materials, Irvine CA, (2005) to be published.
-
(2005)
Proc. 10th IEEE/CPMT International Symposium on Advanced Packaging Materials
-
-
Lu, J.1
Moon, K.-S.2
Xu, J.3
Wong, C.P.4
-
21
-
-
24644443942
-
High-K Nanocomposites with Core-Shell Structured Nanoparticles for Decoupling Applications
-
Orlando FL
-
Jianwen Xu and C.P. Wong, "High-K Nanocomposites with Core-Shell Structured Nanoparticles for Decoupling Applications", Proc. 55th IEEE Electronic Component & Technology Conference, Orlando FL, (2005), pp.1234 - 1240.
-
(2005)
Proc. 55th IEEE Electronic Component & Technology Conference
, pp. 1234-1240
-
-
Xu, J.1
Wong, C.P.2
-
22
-
-
10644277154
-
Effects of the Low Loss Polymers on the Dielectric Behavior of Novel Aluminum-filled High-k Nano-composites
-
Las Vegas NV
-
Jianwen Xu and C.P. Wong, "Effects of the Low Loss Polymers on the Dielectric Behavior of Novel Aluminum-filled High-k Nano-composites," Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas NV, (2004), pp.496-506.
-
(2004)
Proc. 54th IEEE Electronic Component & Technology Conference
, pp. 496-506
-
-
Xu, J.1
Wong, C.P.2
-
23
-
-
34250846904
-
Development of Novel Silver Nanoparticles/Polymer Composites as High K Polymer Matrix by In-situ Photochemical Method for Embedded Passives Applications
-
San Diego CA, to be published
-
Jiongxin Lu, Kyoung-Sik Moon, and C.P. Wong; " Development of Novel Silver Nanoparticles/Polymer Composites as High K Polymer Matrix by In-situ Photochemical Method for Embedded Passives Applications", Proc. 56th IEEE Electronic Component & Technology Conference, San Diego CA, (2006) to be published.
-
(2006)
Proc. 56th IEEE Electronic Component & Technology Conference
-
-
Lu, J.1
Moon, K.-S.2
Wong, C.P.3
-
25
-
-
0032058166
-
Recent progress in discontinuous thin metal film devices
-
25, May/June
-
25.J. E. Morris, "Recent progress in discontinuous thin metal film devices," Vacuum 50(1-2), May/June 1998, pp. 107-113.
-
(1998)
Vacuum
, vol.50
, Issue.1-2
, pp. 107-113
-
-
Morris, J.E.1
-
26
-
-
21644431740
-
Single Electron Transistors: Modeling and Fabrication
-
Beijing, Oct
-
th Internat. Confer. Solid State & Integrated Circuit Technology (ICSICT), Beijing, Oct, 2004, pp. 634-639.
-
(2004)
th Internat. Confer. Solid State & Integrated Circuit Technology (ICSICT)
, pp. 634-639
-
-
Morris, J.E.1
Wu, F.2
Radehaus, C.3
Hietschold, M.4
Henning, A.5
Hofmann, K.6
Kiesow, A.7
-
27
-
-
10444256235
-
Electrical and Thermal Conductivities of Polymer Composites Containing Nano-Sized Particles
-
Las Vegas NV
-
Lianhua Fan, Bin Su, Jianmin. Qu, C.P. Wong; "Electrical and Thermal Conductivities of Polymer Composites Containing Nano-Sized Particles", Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas NV, (2004) pp. 148-154.
-
(2004)
Proc. 54th IEEE Electronic Component & Technology Conference
, pp. 148-154
-
-
Fan, L.1
Su, B.2
Jianmin3
Qu4
Wong, C.P.5
-
28
-
-
33746537215
-
The Role of Self-Assembled Monolayer (SAM) on Ag Nanoparticles for Conductive Nanocomposite
-
Irvine, CA, to be published
-
Hongjin Jiang, Kyoung-sik Moon, Lingbo Zhu, Jiongxin Lu and C.P. Wong; "The Role of Self-Assembled Monolayer (SAM) on Ag Nanoparticles for Conductive Nanocomposite", Proc. 10th IEEE/CPMT International Symposium on Advanced Packaging Materials, Irvine, CA. (2005) to be published.
-
(2005)
Proc. 10th IEEE/CPMT International Symposium on Advanced Packaging Materials
-
-
Jiang, H.1
Moon, K.-S.2
Zhu, L.3
Lu, J.4
Wong, C.P.5
-
29
-
-
33845564203
-
-
Rabindra das, John Lauffer, and Frank Egitto; Electrical Conductivity and Reliability of Nao- and Micro-Filled Conducting Adhesives for Z- axis interconnections, Proc. 56th IEEE Electronic Component & Technology Conference, San Diego CA, (2006) to be published.
-
Rabindra das, John Lauffer, and Frank Egitto; "Electrical Conductivity and Reliability of Nao- and Micro-Filled Conducting Adhesives for Z- axis interconnections," Proc. 56th IEEE Electronic Component & Technology Conference, San Diego CA, (2006) to be published.
-
-
-
-
31
-
-
10444231952
-
Electrical Property of Anisotropically Conductive Adhesive Joints Modified by Self-Assembled Monolayer (SAM)
-
Las Vegas NV
-
Yi Li, Kyoung-sik Moon and C.P. Wong, "Electrical Property of Anisotropically Conductive Adhesive Joints Modified by Self-Assembled Monolayer (SAM)", Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas NV, (2004), pp. 1968-1974.
-
(2004)
Proc. 54th IEEE Electronic Component & Technology Conference
, pp. 1968-1974
-
-
Li, Y.1
Moon, K.-S.2
Wong, C.P.3
-
32
-
-
34250831975
-
Novel lead Free Nano Scale Non-Conductive Adhesive (NCA) Interconnect Materials for Ultra-Fine Pitch Electronic Packaging Applications
-
San Diego CA, to be published
-
Yi Li and C.P. Wong; "Novel lead Free Nano Scale Non-Conductive Adhesive (NCA) Interconnect Materials for Ultra-Fine Pitch Electronic Packaging Applications", Proc. 56th IEEE Electronic Component & Technology Conference, San Diego CA, (2006) to be published.
-
(2006)
Proc. 56th IEEE Electronic Component & Technology Conference
-
-
Li, Y.1
Wong, C.P.2
-
33
-
-
24644496333
-
Demonstration for Rapid Prototyping of Micro-Systems Packaging by Data-Driven Chip-First Process Using Nano-Particles Metal Colloids
-
Orlando FL
-
Sungchul Joo, Daniel F. Baldwin, "Demonstration for Rapid Prototyping of Micro-Systems Packaging by Data-Driven Chip-First Process Using Nano-Particles Metal Colloids," Proc. 55th IEEE Electronic Component & Technology Conference, Orlando FL, (2005), pp. 1859-1863.
-
(2005)
Proc. 55th IEEE Electronic Component & Technology Conference
, pp. 1859-1863
-
-
Joo, S.1
Baldwin, D.F.2
-
34
-
-
33847232915
-
Electrically Conductive Formulations Filled Nano Size Silver Filler for Ink-Jet Technology
-
Wroclaw, Poland
-
Andrzej Moscicki, Jan Felba, Tadeusz Sobierajski, Jozef Kudzia, Andreas Arp, Wilhelm Meyer; "Electrically Conductive Formulations Filled Nano Size Silver Filler for Ink-Jet Technology", Proc. 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, (2005) pp. 40-44.
-
(2005)
Proc. 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics
, pp. 40-44
-
-
Moscicki, A.1
Felba, J.2
Sobierajski, T.3
Kudzia, J.4
Arp, A.5
Meyer, W.6
-
35
-
-
33847224866
-
Inkjettable conductive adhesive for use in microelectronics and Microsystems technology
-
Wroclaw, Poland
-
Jana Kolbe, Andreas Arp, Francesco Calderone, Edouard Marc Meyer, Wilhelm Meyer, Helmut Schaefer, Manuel Stuve, "Inkjettable conductive adhesive for use in microelectronics and Microsystems technology," Proc. 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, (2005) pp. 160-163.
-
(2005)
Proc. 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics
, pp. 160-163
-
-
Kolbe, J.1
Arp, A.2
Calderone, F.3
Marc Meyer, E.4
Meyer, W.5
Schaefer, H.6
Stuve, M.7
-
36
-
-
24644481135
-
Flexible Circuit Creation with Nano Metal Particles
-
Orlando FL
-
W. Peng, V. Hurskainen, K. Hashizume, S. Dunford, S. Quander and R.Vatanparast, "Flexible Circuit Creation with Nano Metal Particles", Proc. 55th IEEE Electronic Component & Technology Conference, Orlando FL, (2005), pp. 77-82.
-
(2005)
Proc. 55th IEEE Electronic Component & Technology Conference
, pp. 77-82
-
-
Peng, W.1
Hurskainen, V.2
Hashizume, K.3
Dunford, S.4
Quander, S.5
Vatanparast, R.6
-
37
-
-
33746562341
-
Magnetic nano-composites for organic compatible miniaturized antennas and inductors
-
Irvine, CA
-
P. Markondeya Raj, Prathap Muthana, T. Danny Xiao, Lixi Wan, Devarajan Balaraman, Isaac Robin Abothu, Swapan Bhattacharya, Madhavan Swaminathan and Rao Tummala; "Magnetic nano-composites for organic compatible miniaturized antennas and inductors", Proc. 10th IEEE/CPMT International Symposium on Advanced Packaging Materials, Irvine, CA. (2005).
-
(2005)
Proc. 10th IEEE/CPMT International Symposium on Advanced Packaging Materials
-
-
Markondeya Raj, P.1
Muthana, P.2
Danny Xiao, T.3
Wan, L.4
Balaraman, D.5
Robin Abothu, I.6
Bhattacharya, S.7
Swaminathan, M.8
Tummala, R.9
-
39
-
-
24644521166
-
Nano-Underfills for High-Reliability Applications in Extreme Environments
-
Orlando FL
-
Pradeep Lall, Saiful Islam, Jeff Suhling and Guoyun Tian, "Nano-Underfills for High-Reliability Applications in Extreme Environments", Proc. 55th IEEE Electronic Component & Technology Conference, Orlando FL, (2005), pp. 212-222.
-
(2005)
Proc. 55th IEEE Electronic Component & Technology Conference
, pp. 212-222
-
-
Lall, P.1
Islam, S.2
Suhling, J.3
Tian, G.4
-
40
-
-
24644488938
-
Photo-Definable Nanocomposite for Wafer Level Packaging
-
Orlando FL
-
Yangyang Sun, Zhuqing Zhang and C.P. Wong, "Photo-Definable Nanocomposite for Wafer Level Packaging", Proc. 55th IEEE Electronic Component & Technology Conference, Orlando FL, (2005), pp. 179-184.
-
(2005)
Proc. 55th IEEE Electronic Component & Technology Conference
, pp. 179-184
-
-
Sun, Y.1
Zhang, Z.2
Wong, C.P.3
-
41
-
-
10444256418
-
Study and Characterization on the Nanocomposite Underfill for Flip Chip Applications
-
Las Vegas NV
-
Yangyang Sun, C.P. Wong; "Study and Characterization on the Nanocomposite Underfill for Flip Chip Applications", Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas NV, (2004) pp. 477-483.
-
(2004)
Proc. 54th IEEE Electronic Component & Technology Conference
, pp. 477-483
-
-
Yangyang Sun, C.P.W.1
-
42
-
-
10444271697
-
Fundamental Research on Surface Modification of Nano-size Silica for Underfill Applications
-
Las Vegas NV
-
Yangyang Sun, Zhuqing Zhang and C.P. Wong, "Fundamental Research on Surface Modification of Nano-size Silica for Underfill Applications", Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas NV, (2004), pp. 754-760.
-
(2004)
Proc. 54th IEEE Electronic Component & Technology Conference
, pp. 754-760
-
-
Sun, Y.1
Zhang, Z.2
Wong, C.P.3
-
43
-
-
33845586688
-
A Study of Nano Particles in SnAg-Based Lead Free Solders for Intermetallic Compounds and Drop Test Performance
-
San Diego CA, to be published
-
Masazumi Amagai; "A Study of Nano Particles in SnAg-Based Lead Free Solders for Intermetallic Compounds and Drop Test Performance", Proc. 56th IEEE Electronic Component & Technology Conference, San Diego CA, (2006) to be published
-
(2006)
Proc. 56th IEEE Electronic Component & Technology Conference
-
-
Amagai, M.1
-
45
-
-
33746499058
-
Development of Nanocomposite Lead-Free Electronic Solders
-
Andre Lee, K.N. Subramanian, Jong-Gi Lee; "Development of Nanocomposite Lead-Free Electronic Solders", Proc. 10th IEEE/CPMT International Symposium on Advanced Packaging Materials, Irvine, CA, (2005).
-
(2005)
Proc. 10th IEEE/CPMT International Symposium on Advanced Packaging Materials, Irvine, CA
-
-
Andre Lee, K.N.S.1
Lee, J.-G.2
-
46
-
-
34250894836
-
Thermal Interface Material with Aligned CNT Growing Directly on the Heat Sink Surface and Its Application in HB-LED Packaging
-
San Diego CA, to be published
-
Kai Zhang Matthrew M.F. Yuen, Jian-Ying Miao, Ning Wang, David Guo-Wei Xiao, "Thermal Interface Material with Aligned CNT Growing Directly on the Heat Sink Surface and Its Application in HB-LED Packaging", Proc.56th IEEE Electronic Component & Technology Conference, San Diego CA, (2006), to be published.
-
(2006)
Proc.56th IEEE Electronic Component & Technology Conference
-
-
Zhang, K.1
Yuen, M.M.F.2
Miao, J.-Y.3
Wang, N.4
Guo-Wei Xiao, D.5
-
47
-
-
33746568408
-
-
H. Annita Zhong, Slawomir Rubinsztajn, Arun Gowda, david Esler, David Gibson, Don Bucklet, John Osaheni and Sandeep Tonapi; Utilization of Carbon Fibers in Thermal Management of Microelectronics, Proc. 10th IEEE/CPMT International Symposium on Advanced Packaging Materials, Irvine CA, (2005).
-
H. Annita Zhong, Slawomir Rubinsztajn, Arun Gowda, david Esler, David Gibson, Don Bucklet, John Osaheni and Sandeep Tonapi; "Utilization of Carbon Fibers in Thermal Management of Microelectronics", Proc. 10th IEEE/CPMT International Symposium on Advanced Packaging Materials, Irvine CA, (2005).
-
-
-
-
48
-
-
24644514510
-
-
Kai Zhang, Guo-Wei Xiao, Cell K Y Wong, HongWei Gu, Matthew M F Yuen, Philip C H Chan and Bing Xu, Study on Thermal Interface Material With Carbon Nanotubes And Carbon Black in High-Brightness LED Packaging with Flip-Chip Technology, Proc. 55th IEEE Electronic Component & Technology Conference, Orlando FL, (2005), pp. 60-65.
-
Kai Zhang, Guo-Wei Xiao, Cell K Y Wong, HongWei Gu, Matthew M F Yuen, Philip C H Chan and Bing Xu, "Study on Thermal Interface Material With Carbon Nanotubes And Carbon Black in High-Brightness LED Packaging with Flip-Chip Technology", Proc. 55th IEEE Electronic Component & Technology Conference, Orlando FL, (2005), pp. 60-65.
-
-
-
-
49
-
-
24644489298
-
High Thermal Efficiency Carbon Nanotube-Resin Matrix for Thermal Interface Materials
-
Orlando FL
-
Tzong-Ming Lee, Kuo-Chan Chiou, Feng-Po Tseng, Chia-Chi Huang, "High Thermal Efficiency Carbon Nanotube-Resin Matrix for Thermal Interface Materials", Proc. 55th IEEE Electronic Component & Technology Conference, Orlando FL, (2005), pp. 55-59.
-
(2005)
Proc. 55th IEEE Electronic Component & Technology Conference
, pp. 55-59
-
-
Lee, T.-M.1
Chiou, K.-C.2
Tseng, F.-P.3
Huang, C.-C.4
-
50
-
-
24644517684
-
Integrated Nanotube Microcooler for Microelectronics Applications
-
Orlando FL
-
Zhimin Mo, Raluca Morjan, Johan Anderson, Eleanor E.B. Campbell and Johan Liu, "Integrated Nanotube Microcooler for Microelectronics Applications", Proc. 55th IEEE Electronic Component & Technology Conference, Orlando FL, (2005), pp. 51-54.
-
(2005)
Proc. 55th IEEE Electronic Component & Technology Conference
, pp. 51-54
-
-
Mo, Z.1
Morjan, R.2
Anderson, J.3
Campbell, E.E.B.4
Liu, J.5
-
51
-
-
33847237615
-
Modelling of Carbon Nanotubes as heat Sink Fins in Microchannels for Microelectronics Cooling
-
Wroclaw, Poland
-
Lisa Ekstrand, Zhimin Mo, Yan Zhang and Johan Liu; "Modelling of Carbon Nanotubes as heat Sink Fins in Microchannels for Microelectronics Cooling", Proc. 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, (2005) pp. 185-187.
-
(2005)
Proc. 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics
, pp. 185-187
-
-
Ekstrand, L.1
Mo, Z.2
Zhang, Y.3
Liu, J.4
-
52
-
-
33845598595
-
In-situ Opening Aligned Carbon Nanotube Films/Arrays for Multichannel Ballistic Transport in Electrical Interconnect
-
San Diego, CA () to be published
-
Lingbo Zhu, Yonghao Xiu, Dennis Hess and CP Wong, "In-situ Opening Aligned Carbon Nanotube Films/Arrays for Multichannel Ballistic Transport in Electrical Interconnect", Proc.56th IEEE Electronic Component & Technology Conference, San Diego, CA (2006) to be published.
-
(2006)
Proc.56th IEEE Electronic Component & Technology Conference
-
-
Zhu, L.1
Xiu, Y.2
Hess, D.3
Wong, C.P.4
-
53
-
-
10444276511
-
Metallic Fullerene and MWCNT Composite Solutions for Microelectronics Subsystem Electrical Interconnection Enhancement
-
Las Vegas NV
-
R.T.Pike, R.Dellmo, J.Wade, S.Newland, G.Hyland and C.M.Newton, "Metallic Fullerene and MWCNT Composite Solutions for Microelectronics Subsystem Electrical Interconnection Enhancement", Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas NV, (2004), pp 461-465.
-
(2004)
Proc. 54th IEEE Electronic Component & Technology Conference
, pp. 461-465
-
-
Pike, R.T.1
Dellmo, R.2
Wade, J.3
Newland, S.4
Hyland, G.5
Newton, C.M.6
-
54
-
-
33845571760
-
High-Performance Electromagnetic Susceptibility for a 2.5Gb/s Plastic Transceiver Module Using Mutli-Wall Carbon Nanotubes
-
San Diego CA, to be published
-
Jin-Chen Chiu, Chia-Ming Chang and Wood-Hi Cheng, Wern-Shiang Jou, " High-Performance Electromagnetic Susceptibility for a 2.5Gb/s Plastic Transceiver Module Using Mutli-Wall Carbon Nanotubes", Proc. 56th IEEE Electronic Component & Technology Conference, San Diego CA, (2006), to be published.
-
(2006)
Proc. 56th IEEE Electronic Component & Technology Conference
-
-
Chiu, J.-C.1
Chang, C.-M.2
Cheng, W.-H.3
Jou, W.-S.4
-
55
-
-
33847208836
-
Carbon Mesophase/Carbon Nanotubes nanocomposite -Functional Filler for Conductive Pastes
-
Wroclaw, Poland
-
A.M. Bondar, A.Bara, D.Patroi, P.M. Svasta; "Carbon Mesophase/Carbon Nanotubes nanocomposite -Functional Filler for Conductive Pastes", Proc. 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, (2005) pp. 215-218.
-
(2005)
Proc. 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics
, pp. 215-218
-
-
Bondar, A.M.1
Bara, A.2
Patroi, D.3
Svasta, P.M.4
-
56
-
-
24644433994
-
Fabrication of Nanowire Anisotropic Conductive Film for Ultra-fine Pitch Flip Chip Interconnection
-
Orlando FL
-
Ren-Jen Lin, Yung-Yu Hsu, Yu-Chih Chen, Syh-Yuh Cheng and Ruoh-Huey Uang, "Fabrication of Nanowire Anisotropic Conductive Film for Ultra-fine Pitch Flip Chip Interconnection", Proc. 55th IEEE Electronic Component & Technology Conference, Orlando FL, (2005), pp. 66 - 70.
-
(2005)
Proc. 55th IEEE Electronic Component & Technology Conference
, pp. 66-70
-
-
Lin, R.-J.1
Hsu, Y.-Y.2
Chen, Y.-C.3
Cheng, S.-Y.4
Uang, R.-H.5
-
57
-
-
24644501823
-
Aligned Carbon Nanotubes for Electrical Interconnect an Thermal Management
-
Orlando FL
-
Lingbo Zhu, Yangyang Sun, Jianwen Xu, Zhuqing Zhang, Dennis W. Hess and C.P. Wong, "Aligned Carbon Nanotubes for Electrical Interconnect an Thermal Management", Proc. 55th IEEE Electronic Component & Technology Conference, Orlando FL, (2005), pp.44 - 50.
-
(2005)
Proc. 55th IEEE Electronic Component & Technology Conference
, pp. 44-50
-
-
Zhu, L.1
Sun, Y.2
Xu, J.3
Zhang, Z.4
Hess, D.W.5
Wong, C.P.6
-
58
-
-
10444236407
-
Power and Reliability Improvement of an Electro-Thermal Microactuator Using Ni-Diamond Nanocomposite
-
Las Vegas, NV
-
Li-Nuan Tsai, Guang-Ren Shen, Y-T Cheng, Wensyang Hsu; " Power and Reliability Improvement of an Electro-Thermal Microactuator Using Ni-Diamond Nanocomposite", Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas, NV (2004) pp. 472-476.
-
(2004)
Proc. 54th IEEE Electronic Component & Technology Conference
, pp. 472-476
-
-
Tsai, L.-N.1
Guang-Ren Shen, Y.-T.C.2
Hsu, W.3
-
59
-
-
24644474221
-
Array of Nano-Cantilevers as a Bio-Assay for Cancer Diagnosis
-
Orlando FL
-
Kevin M. Klein, Jiantao Zheng, Andrew Gewirtz, Dittakavi S. Sarma, S.Rajalakshmi and Suresh K. Sitaraman, "Array of Nano-Cantilevers as a Bio-Assay for Cancer Diagnosis", Proc. 55th IEEE Electronic Component & Technology Conference, Orlando FL, (2005), pp. 583-587.
-
(2005)
Proc. 55th IEEE Electronic Component & Technology Conference
, pp. 583-587
-
-
Klein, K.M.1
Zheng, J.2
Gewirtz, A.3
Sarma, D.S.4
Rajalakshmi, S.5
Sitaraman, S.K.6
-
60
-
-
42549167298
-
-
Bryan Lee, Ramana Pamidigantham, and Premachandran C S; Development of Polymer waveguide using Nano-Imprint method for chip to chip Optical communication and study the suitability on organic substrates, Proc. 56th IEEE Electronic Component & Technology Conference, San Diego CA (2006) to be published.
-
Bryan Lee, Ramana Pamidigantham, and Premachandran C S; "Development of Polymer waveguide using Nano-Imprint method for chip to chip Optical communication and study the suitability on organic substrates", Proc. 56th IEEE Electronic Component & Technology Conference, San Diego CA (2006) to be published.
-
-
-
-
61
-
-
33845567960
-
Fabrication of High Aspect Ratio 35 Micron Pitch Nano-interconnects For next Generation 3-D Wafer Level Packaging by Through-wafer Copper Electroplating
-
San Diego CA () to be published
-
Pradeep Dixit and Jianmin Miao; "Fabrication of High Aspect Ratio 35 Micron Pitch Nano-interconnects For next Generation 3-D Wafer Level Packaging by Through-wafer Copper Electroplating", Proc. 56th IEEE Electronic Component & Technology Conference, San Diego CA (2006) to be published.
-
(2006)
Proc. 56th IEEE Electronic Component & Technology Conference
-
-
Dixit, P.1
Miao, J.2
-
62
-
-
10444258953
-
Z-Axis Interconnects using fine pitch, Nanoscale Through-Silicon Vias: Process Development
-
Las Vegas, NV
-
Silke Spiesshoefer, Leonard Schaper, Susan Burkett, Gowtham Vangara, Ziaur Rahman, Parthiban Arunasalam; " Z-Axis Interconnects using fine pitch, Nanoscale Through-Silicon Vias: Process Development", Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas, NV (2004) pp. 466-471.
-
(2004)
Proc. 54th IEEE Electronic Component & Technology Conference
, pp. 466-471
-
-
Spiesshoefer, S.1
Schaper, L.2
Burkett, S.3
Vangara, G.4
Rahman, Z.5
Arunasalam, P.6
-
63
-
-
24644437399
-
50 Micron Pitch Wafer Level Packaging Testbed with Reworkable IC-Package Nano Interconnects
-
Orlando FL
-
Ankur O. Aggarwal, P. Makondeya Raj, Venky Sundaram, D. Ravi, Sauwee Koh and Rao R. Tummala, "50 Micron Pitch Wafer Level Packaging Testbed with Reworkable IC-Package Nano Interconnects", Proc. 55th IEEE Electronic Component & Technology Conference, Orlando FL, (2005), pp.1139- 1146.
-
(2005)
Proc. 55th IEEE Electronic Component & Technology Conference
, pp. 1139-1146
-
-
Aggarwal, A.O.1
Makondeya Raj, P.2
Sundaram, V.3
Ravi, D.4
Koh, S.5
Tummala, R.R.6
-
64
-
-
10444270955
-
Nanocrystalline Copper and Nickel as Ultra High-Density Chip-to-Package Interconnections
-
Las Vegas NV
-
S. Bansal, A. Saxena and Rao R. Tummala, "Nanocrystalline Copper and Nickel as Ultra High-Density Chip-to-Package Interconnections", Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas NV, (2004), pp. 1647-1651.
-
(2004)
Proc. 54th IEEE Electronic Component & Technology Conference
, pp. 1647-1651
-
-
Bansal, S.1
Saxena, A.2
Tummala, R.R.3
-
65
-
-
10444264482
-
MEMS Composite Structures for Tunable Capacitors and IC-Package Nano Interconnects
-
Las Vegas NV
-
Ankur O. Aggarwal, Kianoush Naeli, P. Makondeya Raj, Farrokh Ayazi, Swapan Bhattacharya and Rao R. Tummala, "MEMS Composite Structures for Tunable Capacitors and IC-Package Nano Interconnects", Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas NV, (2004), pp. 835-842.
-
(2004)
Proc. 54th IEEE Electronic Component & Technology Conference
, pp. 835-842
-
-
Aggarwal, A.O.1
Naeli, K.2
Makondeya Raj, P.3
Ayazi, F.4
Bhattacharya, S.5
Tummala, R.R.6
-
66
-
-
10444287619
-
-
Ankur O. Aggarwal, P. Markondeya Raj, Issac R. Abothu, Michael D. Sacks, Andrew A.O Tay, Rao R. Tummala; New Paradigm in IC-Package Interconnections by Reworkable Nano-Interconnects, Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas, NV (2004) pp. 451-460.
-
Ankur O. Aggarwal, P. Markondeya Raj, Issac R. Abothu, Michael D. Sacks, Andrew A.O Tay, Rao R. Tummala; "New Paradigm in IC-Package Interconnections by Reworkable Nano-Interconnects", Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas, NV (2004) pp. 451-460.
-
-
-
-
67
-
-
34250818556
-
Nano Bio Embedded Fluidic Substrates: System Level Integration using Nano Electrodes for Food Safety
-
San Diego, CA () to be published
-
Ravi Doraiswami and Manoharan Muthuswamy,"Nano Bio Embedded Fluidic Substrates: System Level Integration using Nano Electrodes for Food Safety", Proc.56th IEEE Electronic Component & Technology Conference, San Diego, CA (2006) to be published.
-
(2006)
Proc.56th IEEE Electronic Component & Technology Conference
-
-
Doraiswami, R.1
Muthuswamy, M.2
-
68
-
-
33845586854
-
Embedded nano nickel interconnects and electrodes for next generation 15 micron pitch embedded bio fluidic sensors in FR4 substrates
-
San Diego CA, to be published
-
Ravi Doraiswami,"Embedded nano nickel interconnects and electrodes for next generation 15 micron pitch embedded bio fluidic sensors in FR4 substrates", Proc. 56th IEEE Electronic Component & Technology Conference, San Diego CA, (2006) to be published.
-
(2006)
Proc. 56th IEEE Electronic Component & Technology Conference
-
-
Doraiswami, R.1
-
69
-
-
33845586301
-
-
G.Q.(Kouchi) Zhang, Mart Graef and Fred Van Roosmalen, The Rationale and Paradigm of More than Moore, Proc.56th IEEE Electronic Component & Technology Conference, San Diego, CA (2006), to be published.
-
G.Q.(Kouchi) Zhang, Mart Graef and Fred Van Roosmalen, "The Rationale and Paradigm of "More than Moore"", Proc.56th IEEE Electronic Component & Technology Conference, San Diego, CA (2006), to be published.
-
-
-
-
70
-
-
10444268868
-
Development of a Curriculum in Nano and MEMS Packaging and Manufacturing for Integrated Systems to Prepare Next Generation Workforce
-
Las Vegas NV
-
Ajay P. Malshe, "Development of a Curriculum in Nano and MEMS Packaging and Manufacturing for Integrated Systems to Prepare Next Generation Workforce", Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas NV, (2004), pp. 1706-1711.
-
(2004)
Proc. 54th IEEE Electronic Component & Technology Conference
, pp. 1706-1711
-
-
Malshe, A.P.1
-
72
-
-
10444231142
-
-
Development of Organic Flip Chip Packaging Technology for Nanometer Silicon Incorporating Copper Metallization and Low-k Dielectric, Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas NV, 2004 pp. 347-351
-
Development of Organic Flip Chip Packaging Technology for Nanometer Silicon Incorporating Copper Metallization and Low-k Dielectric", Proc. 54th IEEE Electronic Component & Technology Conference, Las Vegas NV, (2004) pp. 347-351.
-
-
-
|