Thermal properties of oxide free nano non noble metal for low temperature interconnect technology

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1969-1973

  Jiang, Hongjin ^a   Moon, Kyoung Sik ^a   Hua, Fay ^b   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL REDUCTION; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY (HRTEM); MELTING POINTS; NANOPARTICLES;

DIFFERENTIAL SCANNING CALORIMETRY; HIGH RESOLUTION ELECTRON MICROSCOPY; NANOTECHNOLOGY; REDUCTION; THERMODYNAMIC PROPERTIES;

PRECIOUS METALS;

EID: 33845564727     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645930     Document Type: Conference Paper

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