Fundamental research on surface modification of nano-size silica for underfill applications

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 754-760

  Sun, Yangyang ^a   Zhang, Zhuqing ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Nanocomposite; Particle dispersion; Rheology; Surface modification; Underfill

Indexed keywords

DISPERSIONS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; NANOSTRUCTURED MATERIALS; RHEOLOGY; SILICA; SOLUTIONS; TRANSMISSION ELECTRON MICROSCOPY;

PARTICLE DISPERSION; SOLDER REFLOW; UNDERFILL; UNDERFILL DISPENSING;

SURFACE TREATMENT;

EID: 10444271697     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Gross, K., et.al., "New Materials for High Performance No-Flow Underfill," Proc International Symposium on Microelectronics, Denver, CO, Septembe 2002, pp. 234-238.
2. Shenoy, A.V., Rheology of Filled Polymer Systems, Kluwer Academic, (Dordrecht, 1999), pp 272
3. Iler, R.K., The Chemistry of Silica, John Willey&Sons, (New York, 1979), pp 588
4. Petrie, E.M., Handbook of Adhesives and Sealants, McGraw-Hill, (New York, 1999), pp 267,