Nano-composite lead-free interconnect and reliability

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 871-873

  Doraiswami, Ravi ^a   Tummala, Rao ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP INTERCONNECTS; INTERMETALLIC DIFFUSION; METAL COMPOSITES; MICRONS;

COMPOSITION; ELECTROPLATING; FLIP CHIP DEVICES; INDUSTRIAL APPLICATIONS; MICROPROCESSOR CHIPS; OPTIMIZATION; PROBLEM SOLVING; RELIABILITY; RESEARCH AND DEVELOPMENT MANAGEMENT; SOLDERING;

NANOSTRUCTURED MATERIALS;

EID: 24644481546     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. R.R.Tummala, Fundamentals of Microsystems packaging, McGrraw Hill, New York, 2001.
2. W.D.Brown, Advanced Electronics Packaging, IEEE Press, New York, 1999.
3. L.Ma, Q.Zhu, T.Hantschel, D.Fork, and S.Sitaraman, Jsprings-Innovative compliant interconnects for next-generation packaging, in Proc. Electronic Components and Technology Conference, 2002, pp. 1359-1365.
4. Q.Zhu, L.Ma, and S.Sitaraman, Design optimization of one turn helix- a novel compliant off-chip interconnect, Proc. Conf. Thermomechanical Phenomena in Electronic Systems, 2002, pp.833-839.
5. M.Bakir, H.Reed, P.Kohl, K.Martin, and J.Mendl, Sea of leads ultra-high density compliant wafer=level packaging technology, Proc. Electronic Components and technology. Conference, 2002, pp 1087-1094.
6. R. Doraiswami, S. Sankararaman, W. Kim, J. Li, Z. Zhang, P. Gupta, K. Nakanishi, M. Borkar, R. Madhavan, V. Govind, S. Choi, A.O. Aggarwal, Y. Sun, L. Fan, V. Sundaram, M. Swaminathan, C.P. Wong, R.R. Tummala, "Advances in Fine Pitch Lead Free Assembly Process", Proceedings of the 53rd Electronic Components and Technology Conference, pp. 834-839, New Orleans, LA, (2003).
7. Ankur O.Aggarwal, P.Markondeya Raj, Isaac R. Abothu, Ravi Doraiswami, Michael D. Sacks, Andrew Tay, Rao Tummala, "Material Synthesis Routes for Thin film bonding interfaces in repairable and bumpless nano- interconnects", 9th International Symposium on Advanced Packaging Materials: Process, Properties and Interfaces, 2004, 69-74.