Electrical conductivity and reliability of nano- and micro-filled conducting adhesives for Z-axis interconnections

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 112-118

  Das, Rabindra N ^a   Lauffer, John M ^a   Egitto, Frank D ^a  

^a Endicott Interconnect Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE ADHESIVES; DIE PAD PITCH; PRESSURE LAMINATION;

CHIP SCALE PACKAGES; EPOXY RESINS; LAMINATES; LAMINATING; MELTING; THERMAL EFFECTS;

ADHESIVES;

EID: 33845564203     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645633     Document Type: Conference Paper

References (8)

1. Liu, J., 1999, Conductive Adhesives for Electronics Packaging, (British Isles: Electrochemical Publications Ltd, 1999), pp. 317-320.
2. Liu, J., Rorgren, R., and Ljungkrona, L., 1995, "High Volume Electronics Manufacturing Using Conductive Adhesives for Surface Mounting," J. Surf. Mount Technol., Vol. 8, No2 (1995), pp. 30-41.
3. Ye, L., Lai, Z., Liu, J., and Tholen, A., 1999, "Effect of Ag Particle Size on Electrical Conductivity of Isotropically Conductive Adhesives," IEEE Trans. Electron, Packag., Manuf., Vol. 22,(1999), pp. 299-302.
4. Yasuda, K., Kim, J. M., Rito, M., and Fujimoto, K., "Joining Mechanism and Joint Property by Polymer Adhesive with Low Melting Alloy Filler," Int. Conf. on Electron. Packag., (2003),pp. 149-154.
5. Yasuda, K., Kim, J. M., Yasuda, M., and Fujimoto, K., "New Process of Self-Organized Interconnection in Packaging by Conductive Adhesive with Low Melting Point Filler," Int. Conf. on Solid State Devices and Materials,(2003),pp. 390-391.
6. Yasuda, K., Kim, J. M., and Fujimoto, K., "Adhesive Joining Process and Joint Property with Low Melting Point Filler," 3rd Int. IEEE Conf. on Polymer and Adhesives in Microelec. and Photon., (2003), pp. 5-10.
7. Yao, Q., and Qu, J., 2002, "Interfacial versus Cohesive Failure on Polymer- Metal Interfaces in Electronic Packaging - Effects of Interface Roughness," ASME J. Electron. Packag., Vol.124 (2002), pp. 127-134.
8. Egitto, F.D., Krasniak, S.R., Blackwell, K.J., and Rosser, S.G., 2005, "Z-Axis Interconnection for Enhanced Wiring in Organic Laminate Electronic Packages," Proceedings Fifty-Fifth Electronic Components and Technology Conference, May 31 to June 3, 2005, Lake Buena Vista, FL (IEEE, Piscataway, NJ, USA),(2005), pp. 1132-1138.