Development of nanocomposite lead-free electronic solders

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2005, Issue , 2005, Pages 276-281

  Lee, Andre ^a   Subramanian, K N ^a   Lee, Jong Gi ^a  

^a Michigan State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC SOLDERS; MELTING METALLIC MATERIALS; METALLIC MATRIX; POLYHEDRAL OLIGOMERIC SILSESQUIOXANES (POSS);

ELECTRONIC EQUIPMENT; LEAD; MELTING; SCANNING ELECTRON MICROSCOPY; SILANES; SOLDERING; THERMAL EFFECTS;

NANOSTRUCTURED MATERIALS;

EID: 33746499058     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432089     Document Type: Conference Paper

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