-
1
-
-
13744251076
-
Embedded components in printed circuit boards: A processing technology review
-
Jillek W. and Yung W. K. C., "Embedded components in printed circuit boards: a processing technology review" International Journal of Advanced Manufacturing Technology Vol. 25 No.(3-4), (2005), pp. 350-360.
-
(2005)
International Journal of Advanced Manufacturing Technology
, vol.25
, Issue.3-4
, pp. 350-360
-
-
Jillek, W.1
Yung, W.K.C.2
-
3
-
-
25144498784
-
Microwave performance of MCM-D embedded capacitors with interconnects
-
. Post J. E., "Microwave performance of MCM-D embedded capacitors with interconnects" Microwave and Optical Technology Letters Vol. 46, No5, (2005), pp. 487-492.
-
(2005)
Microwave and Optical Technology Letters
, vol.46
, Issue.5
, pp. 487-492
-
-
Post, J.E.1
-
4
-
-
0037203632
-
Novel polymer-ceramic nanocomposite based on high dielectric constant epoxy formula for embedded capacitor application
-
Rao Y., Ogitani S., Kohl P., Wong C. P., "Novel polymer-ceramic nanocomposite based on high dielectric constant epoxy formula for embedded capacitor application" Journal of Applied Polymer Science Vol. 83, No. 5, (2002), pp. 1084-1090.
-
(2002)
Journal of Applied Polymer Science
, vol.83
, Issue.5
, pp. 1084-1090
-
-
Rao, Y.1
Ogitani, S.2
Kohl, P.3
Wong, C.P.4
-
5
-
-
1842763692
-
Material characterization of a high-dielectric-constant polymer-ceramic composite for embedded capacitor for RF applications
-
Rao Y., Wong C. P., " Material characterization of a high-dielectric-constant polymer-ceramic composite for embedded capacitor for RF applications" Journal of Applied Polymer Science Vol. 92, No. 4, (2004), pp. 2228-2231.
-
(2004)
Journal of Applied Polymer Science
, vol.92
, Issue.4
, pp. 2228-2231
-
-
Rao, Y.1
Wong, C.P.2
-
6
-
-
0035008266
-
Colloidal processing of polymer-ceramic nanocomposites for integral capacitors
-
Braselton
-
Windlass H., Raj P. M., Balaraman D., Bhattacharya S. K., and Tummala R. R., " Colloidal processing of polymer-ceramic nanocomposites for integral capacitors" IMAPS International Symposium on Advanced Packaging Materials, Braselton, 2001, pp. 393-398
-
(2001)
IMAPS International Symposium on Advanced Packaging Materials
, pp. 393-398
-
-
Windlass, H.1
Raj, P.M.2
Balaraman, D.3
Bhattacharya, S.K.4
Tummala, R.R.5
-
7
-
-
0038618711
-
Dielectric nanocomposites for integral thin film capacitors: Materials design, fabrication, and integration issues
-
Ramesh S., Shuteberg B. A., Haung C., Gao J., Giannelis E. P., "Dielectric nanocomposites for integral thin film capacitors: Materials design, fabrication, and integration issues" IEEE Transactions on Advanced Packaging Vol. 26, No. 1, (2003), pp. 17-24.
-
(2003)
IEEE Transactions on Advanced Packaging
, vol.26
, Issue.1
, pp. 17-24
-
-
Ramesh, S.1
Shuteberg, B.A.2
Haung, C.3
Gao, J.4
Giannelis, E.P.5
-
8
-
-
0034539522
-
Low temperature chemical synthesis of Nano size ceramics
-
Das R. N., Pramanik P., "Low temperature chemical synthesis of Nano size ceramics" British Ceramic Transactions Vol. 99, No. 4, (2000), pp. 153-158.
-
(2000)
British Ceramic Transactions
, vol.99
, Issue.4
, pp. 153-158
-
-
Das, R.N.1
Pramanik, P.2
-
10
-
-
0001904072
-
3 ferroelectric thin films
-
3 ferroelectric thin films" Appl. Phys. Lett. Vol. 69, No1, (1996), pp.25-27.
-
(1996)
Appl. Phys. Lett.
, vol.69
, Issue.1
, pp. 25-27
-
-
Knauss, L.A.1
Pond, J.M.2
Horwitz, J.S.3
Chrisey, D.B.4
-
11
-
-
10444231103
-
Development of high-k inorganic/organic composite material for embedded capacitors
-
Kawasaki M., hara Y., Yamashiki Y., Asahi N., Nagase R., Ueoka. T, Yoshioka M. and Nonaka T., "Development of High-k Inorganic/Organic Composite Material for Embedded Capacitors" 2004 Electronic Components and Technology Conference, (2004), pp. 525-530.
-
(2004)
2004 Electronic Components and Technology Conference
, pp. 525-530
-
-
Kawasaki, M.1
Hara, Y.2
Yamashiki, Y.3
Asahi, N.4
Nagase, R.5
Ueoka, T.6
Yoshioka, M.7
Nonaka, T.8
|