Integrated nanotube microcooler for microelectronics applications

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 51-54

  Mo, Zhimin ^a   Morjan, Raluca ^b   Anderson, Johan ^a   Campbell, Eleanor E B ^b   Liu, Johan ^a,c  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b UNIVERSITY OF GOTHENBURG   (Sweden)

^c SHANGHAI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; ELECTRONICS PACKAGING; HEAT TRANSFER; LITHOGRAPHY; MICROELECTRONICS; THERMAL CONDUCTIVITY;

ADHESIVE BONDING; HEAT TRANSFER COEFFICIENT; MICROCOOLERS; WAFER-LEVEL INTEGRATION;

NANOTUBES;

EID: 24644517684     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Liu J. & Mo. Z., "Aligned Nanotubes as Integrated Cooling Devices for Microsystems," Swedish patent office file no: 0300326-6, Feb 10,2003.
2. Tuckerman D.B. & Pease R.F.W., "High-performance Heat Sinking for VLSI," IEEE Electron Device Lett., Vol. EDL-2, (1981), pp. 126-129.
3. Zhang L. et al., "Measurement and Modeling of Two-phase Flow in Microchannels with Nearly Constant Heat Flux Boundary Conditions," J. Microelectromechanical System, Vol. 11, (2002), pp. 12-19.
4. Goodson K.E., Kurabayashi K. & Pease R.F.W., "Improved Heat Sink for Laser-Diode Arrays using Microchannels in CVD Diamond," IEEE Trans CPMT B, Vol. 20, (1997), pp. 104-109.
5. Iijima S., "Helical Microtubules of Graphitic Carbon," Nature, Vol. 354, (1991), pp. 56-58.
6. Baughman R.H., Zakhidov A.A. & de Heer W.A., "Carbon Nanotubes-the Route Toward Applications," Science, Vol. 297, (2002), pp. 787-792.
7. Mo Z., Anderson J. & Liu J., "Integrating Nanocarbontubes with Microchannel Cooler," Proc. HDP'04, Shanghai, China, June-July 2004, pp. 373-376.