MEMS composite structures for tunable capacitors and IC-package nano interconnects

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 835-842

  Aggarwal, Ankur O ^a   Naeli, Kianoush ^a   Raj, P Makondeya ^a   Ayazi, Farrokh ^a   Bhattacharya, Swapan ^a   Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MEMS; NANO INTERCONNECTS; POLYMER STRUCTURES; WAFER-LEVEL PACKAGING;

ADHESION; CAPACITORS; DRY ETCHING; ELECTRIC POTENTIAL; ELECTROLESS PLATING; ELECTRONICS PACKAGING; INTEGRATED CIRCUITS; LOW TEMPERATURE EFFECTS; MECHANICAL PROPERTIES; MICROELECTROMECHANICAL DEVICES; NANOSTRUCTURED MATERIALS; PLASMA ETCHING; POLYMERS;

OPTICAL INTERCONNECTS;

EID: 10444264482     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. Despont et al, "High-aspect-ratio, ultra thick, negativetone near-uv photoresist for MEMS applications", MEMS97, pp: 518-522
2. R.K. Vestergaard and S. Bouwstra, "Electroplated compliant metal microactuators with small features using a removable SU8 mold", Microsystems technologies, Vol. 6, No. 6, pp. 214-217.
3. Muhannid Bakir, James Meindl et al., "Sea-of-lead ultrahigh density compliant wafer-level-packaging technology", Proceedings, Electronic Components and Technology Conference, IEEE Piscataway, pp. 1087-1094.
4. Lunyu Ma, Qi Zhu and Suresh Sitaramanm "J -Springs - Innovative Compliant Interconnects for Next-Generation Packaging", Proceedings, Electronic Components and Technology Conference, IEEE Piscataway, pp. 1359-1365.
5. Ryong-Kyu Yoon, Jin Woo Park and Mark Allen, "RF-MEMS based on epoxy core conductors", Solid State Sensors, Actuators and Microsystems Workshop, Hilton Head Island, South Carolina, June 2-6, 2002, pp. 374-375.
6. J. Jason Yao, "RF MEMS from a device perspective", J. Micromech. Eng., 10, R9-R38, 2000.
7. H. Jiang et al., "Fabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper plating", 2000 IEEE MTT-S Digest, pp. 279-290
8. Shoichi Furukawa and Mehran Mehregany, "Electroless plating of nickel on silicon for fabrication of high-aspectratio microstructures", Sensors and Actuators, A:, Physical, v. 56, 3, 1996, pp. 261-266.
9. Lara J. Martin, "Study on metal adhesion mechanisms in high density interconnect Printed Circuit Boards", Proceedings - Electronic Components and Technology Conference, IEEE Piscataway, NJ, USA, p. 549-557.
10. J. Ge, R. Tuominen and J. K. Kivilahti, Adhesion between photosensitive epoxy and electroless copper, IEEE
11. G. Sarkar and B. H. Kong, "Adhesion of sputtered copper to photosensitive epoxies", J. Mater. Sci., V. 18, 12, 1999
12. Fuhan Liu, Venky Sundaram, Ankur O. Aggarwal, George White, Dean Sutter, Rao Tummala, "Micro-Board Technology Development at the Packaging Research Center", Proc. of International Conference of Electronic Packaging, 187-192, April 16-18, 2003, Tokyo, Japan.
13. Vandevelde, B., Christians, F., Beyne, E., Roggen, J. Peeters, J., Allaert, K., Vandepitte, D., Bergmans, J., "Thermomechanical models for leadless solder interconnections" IEEE Transactions on Flip chip assemblies components, Packaging, and Manufacturing Technology, Part A, Volume: 21, Issue: 1, March 1998
14. Yiming Li and Dennis Hess, "Plasma etching of thick polynorbomene layers for electronic packaging applications", Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, v 20, n 5, 2002, p 2007-2012.
15. Ankur O. Aggarwal, I R Abothu, P. Markondeya Raj, M. D. Sacks, Rao R. Tummala, "New paradigm in IC-package interconnections by reworkable nanointerconnects", Proceedings - Electronic Components and Technology Conference, 2004, to be published.