Electrically conductive formulations filled nano size silver filler for ink-jet technology

Polytronic 2005: 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Proceedings

Volumn 2005, Issue , 2005, Pages 40-44

  Mościcki, Andrzej ^a   Felba, Jan ^b   Sobierajski, Tadeusz ^a   Kudzia, Józef ^b   Arp, Andreas ^c   Meyer, Wilhelm ^c  

^a AMEPOX Microelectronics Ltd   (Poland)

^b WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

^c Microdrop Technologies   (Germany)

Author keywords

Electrically conductive adhesive; Electrically conductive ink; Electronic packaging; Ink jet printing; Nano size silver; Nanotechnology

Indexed keywords

ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; PRINTING;

ELECTRICALLY CONDUCTIVE ADHESIVES; ELECTRICALLY CONDUCTIVE INKS; NANO SIZE SILVER;

FILLERS;

FILLERS; INK JET PRINTING;

EID: 33847232915     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2005.1596484     Document Type: Conference Paper

References (4)

1. Manesis, D., Patzelt R., Nieland S., Ostmann A, Aschenbrenner R, Reichl H., " Technical Challenges of Stencil Printing Technology for Ultra Fine Pitch Flip Chip Bumping" IMAPS 2002, Colorado, USA, pp. 727-732
2. th European Microelectronis and Packaging Conf., Friedrichshafen, Germany 2003, pp. 51-56
3. Creagh L.T., , "DigitallyPrinting Electronics with Piezo Ink Jet", IMAPS 2004, Long Beach, USA
4. Quinones H., Babiarz A., Fang L., Fiske E., "Jet Dispense for Electronic and Optoelectronic Packaging", European Microelectronis and Packaging Symposium, Prague, Czech Republic, 2004, pp. 348-390