Developing a course about nano-packaging

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1925-1929

  Zerna, Thomas ^a   Wolter, Klaus Jürgen ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; NANOSTRUCTURED MATERIALS; STUDENTS;

GRADUATE STUDENTS; NANO-PACKAGING; SKILLS;

CURRICULA;

EID: 24644436509     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. International Technology Roadmap for Semiconductors 2003, Update 2004, http://public.itrs.net
2. Curriculum documents of the Department of Electrical Engineering and Information Technology of Dresden University of Technology, Germany
3. IEEE Transactions on Advanced Packaging, Vol. 27, Number 2, May 2004, ISSN 1521-3323