메뉴 건너뛰기




Volumn 2006, Issue , 2006, Pages 1323-1325

Nano nickel-tin interconnects and electrodes for next generation 15 micron pitch embedded bio fluidic sensors in FR4 substrates

Author keywords

[No Author keywords available]

Indexed keywords

FLUIDIC SENSORS; INTERCONNECT RELIABILITY; INTERCONNECT TECHNOLOGY; NANO-COMPOSITE INTERCONNECTS;

EID: 33845586854     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645826     Document Type: Conference Paper
Times cited : (3)

References (12)
  • 3
    • 0036287428 scopus 로고    scopus 로고
    • J-springs-Innovative compliant interconnects for next generation packaging
    • L.ma et.al., " J-springs-Innovative compliant interconnects for next generation packaging, in Proc. Electronic Components and Technology Conference, 2002, pp. 1359-1365.
    • (2002) Proc. Electronic Components and Technology Conference , pp. 1359-1365
    • Ma, L.1
  • 6
    • 33845567208 scopus 로고    scopus 로고
    • R. Doraiswami, S. Sankararaman, W. Kim, J. Li, Z. Zhang
    • R. Doraiswami, S. Sankararaman, W. Kim, J. Li, Z. Zhang
  • 10
    • 24644506933 scopus 로고    scopus 로고
    • Analysis of critical dimension uniformity for step and flash imprint lithography
    • Feburary
    • David P. Mancini, et.al., "Analysis of critical dimension uniformity for step and flash imprint lithography", SPIE microlithography conference, Feburary 2003, pp 200-205.
    • (2003) SPIE Microlithography Conference , pp. 200-205
    • Mancini, D.P.1
  • 12
    • 33845574330 scopus 로고    scopus 로고
    • Development of imprint materials for the step and flash imprint lithography process
    • Feb
    • Frank, et.al., " Development of imprint materials for the step and flash imprint lithography process", SPIE Microlithography conference, Feb 2004, pp 112-117.
    • (2004) SPIE Microlithography Conference , pp. 112-117
    • Frank1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.