-
3
-
-
0036287428
-
J-springs-Innovative compliant interconnects for next generation packaging
-
L.ma et.al., " J-springs-Innovative compliant interconnects for next generation packaging, in Proc. Electronic Components and Technology Conference, 2002, pp. 1359-1365.
-
(2002)
Proc. Electronic Components and Technology Conference
, pp. 1359-1365
-
-
Ma, L.1
-
4
-
-
0036457588
-
Design optimization of one turn helix-a novel compliant off-chip interconnect
-
Q.Zhu, L.Ma, and S.Sitaraman, Design optimization of one turn helix-a novel compliant off-chip interconnect, Proc. Conf. Thermomechanical Phenomena in Electronic Systems, 2002, pp.833-839.
-
(2002)
Proc. Conf. Thermomechanical Phenomena in Electronic Systems
, pp. 833-839
-
-
Zhu, Q.1
Ma, L.2
Sitaraman, S.3
-
5
-
-
0036297031
-
Sea of leads ultra-high density compliant wafer=level packaging technology
-
M.Bakir, H.Reed, P.Kohl, K.Martin, and J.Mendl, Sea of leads ultra-high density compliant wafer=level packaging technology, Proc. Electronic Components and technology. Conference, 2002, pp1087-1094.
-
(2002)
Proc. Electronic Components and Technology. Conference
, pp. 1087-1094
-
-
Bakir, M.1
Reed, H.2
Kohl, P.3
Martin, K.4
Mendl, J.5
-
6
-
-
33845567208
-
-
R. Doraiswami, S. Sankararaman, W. Kim, J. Li, Z. Zhang
-
R. Doraiswami, S. Sankararaman, W. Kim, J. Li, Z. Zhang
-
-
-
-
7
-
-
0038350607
-
Advances in fine pitch lead free assembly process
-
New Orleans, LA
-
P. Gupta, K. Nakanishi, M. Borkar, R. Madhavan, V. Govind, S. Choi, A.O. Aggarwal, Y. Sun, L. Fan, V. Sundaram, M. Swaminathan, C.P. Wong, R.R. Tummala, "Advances in Fine Pitch Lead Free Assembly Process", Proceedings of the 53rd Electronic Components and Technology Conference, pp. 834-839, New Orleans, LA, (2003).
-
(2003)
Proceedings of the 53rd Electronic Components and Technology Conference
, pp. 834-839
-
-
Gupta, P.1
Nakanishi, K.2
Borkar, M.3
Madhavan, R.4
Govind, V.5
Choi, S.6
Aggarwal, A.O.7
Sun, Y.8
Fan, L.9
Sundaram, V.10
Swaminathan, M.11
Wong, C.P.12
Tummala, R.R.13
-
8
-
-
2442619216
-
Material synthesis routes for thin film bonding interfaces in repairable and bumpless nanointerconnects
-
Ankur O.Aggarwal, P.Markondeya Raj, Isaac R. Abothu, Ravi Doraiswami, Michael D. Sacks, Andrew Tay, Rao Tummala, "Material Synthesis Routes for Thin film bonding interfaces in repairable and bumpless nanointerconnects", 9th International Symposium on Advanced Packaging Materials: Process, Properties and Interfaces, 2004, 69-74.
-
(2004)
9th International Symposium on Advanced Packaging Materials: Process, Properties and Interfaces
, pp. 69-74
-
-
Aggarwal, A.O.1
Raj, P.M.2
Abothu, I.R.3
Doraiswami, R.4
Sacks, M.D.5
Tay, A.6
Tummala, R.7
-
9
-
-
0032625408
-
Step and flash imprint lithography: A new approach to high-resolution patterning
-
Santa Clara, CA, March
-
th International Symposium on Microcrolithography: Emerging Lithographic Technologies III, Santa Clara, CA, Vol. 3776, part one, March 1999, pp379-389.
-
(1999)
th International Symposium on Microcrolithography: Emerging Lithographic Technologies III
, vol.3776
, Issue.PART ONE
, pp. 379-389
-
-
Colburn, M.1
Johnson2
-
10
-
-
24644506933
-
Analysis of critical dimension uniformity for step and flash imprint lithography
-
Feburary
-
David P. Mancini, et.al., "Analysis of critical dimension uniformity for step and flash imprint lithography", SPIE microlithography conference, Feburary 2003, pp 200-205.
-
(2003)
SPIE Microlithography Conference
, pp. 200-205
-
-
Mancini, D.P.1
-
12
-
-
33845574330
-
Development of imprint materials for the step and flash imprint lithography process
-
Feb
-
Frank, et.al., " Development of imprint materials for the step and flash imprint lithography process", SPIE Microlithography conference, Feb 2004, pp 112-117.
-
(2004)
SPIE Microlithography Conference
, pp. 112-117
-
-
Frank1
|