The role of Self-Assembled Monolayer (SAM) on Ag nanoparticles for conductive nanocomposite

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2005, Issue , 2005, Pages 266-271

  Jiang, Hongjin ^a   Moon, Kyoung Sik ^a   Zhu, Lingbo ^a   Lu, Jiongxin ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE FILLERS; CONDUCTIVE NANOCOMPOSITES; SELF-ASSEMBLED MONOLAYER (SAM);

ADHESIVES; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY; EPOXY RESINS; SCANNING ELECTRON MICROSCOPY; SELF ASSEMBLY; THERMOGRAVIMETRIC ANALYSIS;

NANOSTRUCTURED MATERIALS;

EID: 33746537215     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432087     Document Type: Conference Paper

References (10)

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4. S. K. Kang and A. Sarkel, "Lead (Pb)-free solders for electronic packaging," Journal of Electronic Materials, Vol. 23, 1994, p. 701.
5. C. P. Wong, K. S. Moon and Y. Rao, "Fundamental understandings of anisotropic conductive adhesives for flip-chip application," 2003, NSF Design, Service and Manufacturing Grantees and Research Conference, Jan 2003.
6. th Int'l Symposium on Advanced Packaging Materials, 2004. p. 139-144.
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9. H. Dong, K. S. Moon, C. P. Wong, "Molecular dynamics study on coalescence of Cu nanoparticles and their deposition on Cu substrate", J. Elec. Mater. 2005, 34, 40.
10. H. Dong, K. S. Moon, C. P. Wong, "Molecular dynamics study of nano silver particles for low temperature lead free interconnect applications", J. Elec. Mater. 2004, 33, 1326.