New paradigm in IC-package interconnections by reworkable nano-interconnects

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 451-460

  Aggarwal, Ankur O ^a   Raj, P Markondeya ^a   Abothu, Isaac R ^a   Sacks, Michael D ^b   Tay, Andrew A O ^c   Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

^c NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

HERMETIC PACKAGING; INTERCONNECT MATERIALS; NANO-INTERCONNECTS; SOLDER BUMPS;

BONDING; INTERCONNECTION NETWORKS; MICROPROCESSOR CHIPS; PLASTIC FILMS; PRODUCT DESIGN; SOL-GELS;

ELECTRONICS PACKAGING;

EID: 10444287619     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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