Nano metal particles for low temperature interconnect technology

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1983-1988

  Moon, Kyoung Sik ^a   Dong, Hai ^a   Pothukuchi, Suresh ^a   Li, Yi ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

METAL FILLERS; POLYMER-METAL COMPOSITES; THERMAL BEHAVIOR; THERMOMECHANICAL ANALYZER (TMA);

CRYSTAL STRUCTURE; DIFFERENTIAL THERMAL ANALYSIS; ELECTRIC CONDUCTANCE; FILLERS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; INTERFACES (MATERIALS); NANOSTRUCTURED MATERIALS; SCANNING ELECTRON MICROSCOPY; SINTERING; THERMOGRAVIMETRIC ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 10444273187     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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2. D. Lu, Q. K. Tong, C. P. Wong, "Conductivity Mechanisms of Isotropic Conductive Adhesives," IEEE Trans, on CPMT, Part C. Vol. 22, No.3, 223 (1999).
3. K. S. Moon, C. Rockett, C. Kretz and W. F. Burgoyne and C.P. Wong, "Improvement of Adhesion and Electrical Properties of Reworkable Thermoplastic Conductive Adhesives", Journal of Adhesion Science & Technology, Vol. 17, No. 13, 1785 (2003).
4. L. Allen, R.A. Bayles, W.W. Gile and W.A. Jesser, "Small Particle Melting of Pure Metals", Thin Solid Film, Vol. 144, 297 (1986).
5. M.S. Daw and M.I. Baskes, "Embedded-atom Method: Derivation and Application to Impurities, Surfaces, and other Defects in Metals", Phys. Rev. B, Vol. 29, 6443 (1984).
6. M.S. Daw and M.I. Baskes, "Semiempirical, Quantum Mechanical Calculation of Hydrogen Embrittlement in Metals", Phys. Rev. Lett. Vol. 50, 1285(1983).
7. M. Oda, T. Abe, T. Suzuki, N. Saito, H. Iwashige and G. Kutluk, "Application of Dispersed Nano Particles", Materials Research Society Symposium Proceedings, Vol. 704, 3 (2002).
8. C.P. Wong, K.S. Moon and Y.Li, "Synthesis of Nano Metal Alloys and Application of Their Melting Point Depression in Low Temperature Electronic Packaging Process", Georgia Tech. Corp. Invention Disclosure 2003, US patent pending.
9. H. Dong, K. S. Moon, C. P. Wong, "Molecular Dynamics Study on Coalescence of Cu Nanoparticles and Their Deposition on Cu Substrate", Journal of Electronic Materials, Nov. 2003 (submitted).