Reliability testing of polytronics components in the micro-nano region

Polytronic 2005: 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Proceedings

Volumn 2005, Issue , 2005, Pages 13-15

  Michel, Bernd ^a   Dudek, Rainer ^a   Walter, Hans ^a  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COMPUTER SIMULATION; CORRELATION THEORY; CRACKS; DEFORMATION; DELAMINATION; FATIGUE OF MATERIALS; IMAGE PROCESSING; INTERFACES (MATERIALS); MICROELECTRONICS; RELIABILITY THEORY; SCANNING ELECTRON MICROSCOPY;

DIGITAL IMAGE CORRELATION (DIC); POLYTRONICS COMPONENTS; RELIABILITY TESTING; STRESS FIELDS;

NANOSTRUCTURED MATERIALS;

EID: 33847179109     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2005.1596479     Document Type: Conference Paper

References (0)