Improvement of electrical performance of anisotropically conductive adhesives

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2005, Issue , 2005, Pages 221-226

  Li, Yi ^a   Moon, Kyoung Sik ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE ADHESIVES; ELECTRICAL PERFORMANCE; THERMOGRAVIMETRIC ANALYZER (TGA);

ANISOTROPY; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY; ELECTRIC PROPERTIES; FILLER METALS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; SELF ASSEMBLY; THERMOGRAVIMETRIC ANALYSIS;

ADHESIVES;

EID: 33746577397     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432079     Document Type: Conference Paper

References (17)

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15. Y. Li, K. Moon and C. P. Wong, "Electrical Property of Anisotropically Conductive Adhesievs Joint Modified by Self-Assembled Monolayer", Proceedings of 54th IEEE Electronic Components and Technology Conference, Las Vegas, Ne-vada, June 1-4, 2004, p.1968.
16. Y. Li, Z. Zhang, K. Moon, C.P. Wong, "Ultra-Fine Pitch Wafer Level ACF (Anisotropic Conductive Film) Interconnect by in-situ formation of nano fillers with High Current Carrying Capability" U.S. Patent pending, GTRC Invention No. 3330. (2005)
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