Utilization of carbon fibers in thermal management of microelectronics

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2005, Issue , 2005, Pages 259-265

  Zhong, H Annita ^a   Rubinsztajn, Slawomir ^a   Gowda, Arun ^a   Esler, David ^a   Gibson, David ^a   Buckley, Don ^a   Osaheni, John ^a   Tonapi, Sandeep ^a  

^a GE GLOBAL RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EPOXY MATRICES; INTERFACIAL THERMAL RESISTANCES; THERMAL MANAGEMENT;

ENERGY DISSIPATION; GRAPHITE FIBERS; HEAT LOSSES; HEAT RESISTANCE; MICROELECTRONICS; SURFACE TREATMENT; THERMAL CONDUCTIVITY;

CARBON FIBERS;

EID: 33746568408     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432086     Document Type: Conference Paper

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