An ontology for isotropic conductive adhesive interconnect technology in electronics packaging applications

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05

Volumn , Issue , 2005, Pages

  Morris, James E ^a   Lee, Jeahuck ^a   Liu, Johan ^b,c  

^a Department of Electrical and Computer Engineering   (United States)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SHANGHAI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ELECTRONICS PACKAGING; ONTOLOGY; SOLDERING;

ISOTROPIC CONDUCTIVE ADHESIVE (ICA);

OPTICAL INTERCONNECTS;

EID: 37649032908     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HDP.2005.251386     Document Type: Conference Paper

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