Adhesion improvement of thermoplastic isotropically conductive adhesive

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1631-1639

  Liong, S ^a   Wong, C P ^a   Burgoyne, W F ^b  

^a Georgia Institute of Technology   (United States)

^b AIR PRODUCTS AND CHEMICALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; ADHESIVES; CONDUCTIVE MATERIALS; ELECTRIC RESISTANCE; EPOXY RESINS; MOISTURE;

CONDUCTIVE ADHESIVES;

THERMOPLASTICS;

EID: 0036290952     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ISAPM.2002.990397     Document Type: Article

References (9)

1. Introduction to conductive adhesive joining technology
2. Conduction mechanisms and microstructure development in isotropic electrically conductive adhesives
3. Mechanisms underlying the unstable contact resistance of conductive adhesives
4. Development of thermoplastic isotropically conductive adhesive
5. Electrically conductive adhesives for surface mount solder replacement
6. Conductivity mechanisms of isotropic conductive adhesives