Low temperature flip-chip process using ICA and NCA (isotropically and non-conductive adhesive) for flexible displays application

Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002

Volumn , Issue , 2002, Pages 139-143

  Vanfleteren, J ^a   Vandecasteele, B ^a   Podprocky T ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; FLEXIBLE DISPLAYS; SMART CARDS; TEMPERATURE;

DRIVER CHIPS; FLIP CHIP; LOW TEMPERATURES; NON-CONDUCTIVE ADHESIVES; POLYETHERSULPHONES; SUBSTRATE MATERIAL;

FLIP CHIP DEVICES;

EID: 84964670699     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2002.1185656     Document Type: Conference Paper

References (8)

1. http://www.nemoptic.com/carbine/index.htm, official CARBINE website.
2. Terashima, K. et al, "Study on Chip Mounting Technology for Plastic Film Liquid Crystal Displays", 2002 ICEP Proceedings, pp. 290-294.
3. Park S.K. et al, "Development of a Chip Bonding Technology for Plastic Film LCDs", SID 2000 Digest, pp. 270-273.
4. Pennanen V. et al, "Reliability testing on flip chip joining with isotropically conductive adhesives", Proc. 11th European Microelectronics Conference, 1997, pp. 618-623
5. Journal of Electronics Manufacturing 7: (4) (1997), pp. 287-292.
6. Wong C.P. et al, "High-Performance No-Flow Underfills for Low-Cost Flip-Chip Applications : Material Characterisation", IEEE Trans-CPMT-A, Vol. 21, No. 3 (1998), pp. 450-458.
7. Vanfleteren J. et al, "Mixed Assembly on PCB using a Novel Flip-Chip Technology", Advancing Microelectronics, Vol.27, No.5 (2000), pp.28-30.
8. Vanfleteren J. et al, "Low Temperature Flip-Chip Assembly for Biomedical Applications", Proc. 15th European Microelectronics Conference, 2001, Strasbourg (France), pp.213-216.