Conductivity improvement of thermoplastic isotropically conductive adhesive

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1140-1146

  Liong, S ^a   Wong, C P ^a   Burgoyne, W F ^b  

^a Georgia Institute of Technology   (United States)

^b Air Products and Chemicals Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; DRYING; ELASTIC MODULI; ELECTRIC CONDUCTIVITY; GLASS TRANSITION; PLASTICIZERS; PLASTICS FILLERS; THERMOPLASTICS; THERMOSETS;

ELECTRICALLY CONDUCTIVE ADHESIVES (ECA); ISOTROPICALLY CONDUCTIVE ADHESIVES (ICA);

PLASTIC ADHESIVES;

EID: 0036294952     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008247     Document Type: Article

References (12)

1. Eliminating lead in electronic assemblies
2. Introduction to conductive adhesive joining technology
3. Electrical, structural, and processing properties of electrically conductive adhesive
4. Conductivity mechanisms of isotropic conductive adhesives (ICA)
5. Electrical conduction models for isotropically conductive adhesive joint
6. Conductivity mechanisms of isotropic conductive adhesives (ICA)
7. Development of thermoplastic isotropically conductive adhesive
8. Plasticizers
9. Plasticizers
10. Electrically conductive adhesives for surface mount solder replacement