Development of conductive adhesives filled with low-melting-point alloy fillers

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 7-13

  Lu, Daoqiang ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; CONDUCTIVE PLASTICS; CURING; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; FRACTURE TOUGHNESS; NICKEL; PARTICLES (PARTICULATE MATTER); PLASTIC ADHESIVES; PLASTICS FILLERS; SILVER; THERMAL EFFECTS;

CONTACT RESISTANCE; ISOTROPIC CONDUCTIVE ADHESIVES (ICA);

ELECTRONICS PACKAGING;

EID: 0033725505     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)