Electrochemical metal deposition on silicon

Current Opinion in Solid State and Materials Science

Volumn 10, Issue 3-4, 2006, Pages 163-172

  Ogata, Yukio H ^a   Kobayashi, Katsutoshi ^a   Motoyama, Munekazu ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

Displacement deposition; Electrodeposition of metal; Micro and nano structure formation; Porous silicon; Silicon

Indexed keywords

MICROSTRUCTURE; MORPHOLOGY; NANOSTRUCTURES; SILICON;

CONTROLLING FACTORS; DISPLACEMENT DEPOSITION; ELECTROCHEMICAL METAL DEPOSITION; METAL PATTERNING;

ELECTRODEPOSITION;

EID: 34249944669     PISSN: 13590286     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cossms.2007.02.001     Document Type: Article

References (70)

1. Andrecacos P.C., Uzoh C., Dukovic J.O., Horkans J., and Deligianni H. Damascene copper electroplating for chip interconnections. IBM J Res Dev 42 (1998) 567-574
2. Hyde M.E., and Compton R.G. A review of the analysis of multiple nucleation with diffusion controlled growth. J Electroanal Chem 549 (2003) 1-12
3. Oskam J., Long J.G., Natarajan A., and Searson P.C. Electrochemical deposition of metals onto silicon. J Phys D 31 (1998) 1927-1949
4. Zhang X.G. Electrochemistry of silicon and its oxide (2001), Kluwer Academic/Plenum Publishers, New York [chapter 6]
5. Huang Q., Deligianni H., and Romankiw L.T. Electrodeposition of gold on silicon nucleation and growth phenomena. J Electrochem Soc 153 (2006) C332-C336
6. Budevski E., Staikov G., and Lorenz W.J. Electrochemical phase formation and growth (1996), VCH, Weinheim p. 294-7
7. Whitney T., Searson P.C., Jiang J.S., and Chien C.L. Fabrication and magnetic properties of arrays of metallic nanowires. Science 261 (1993) 1316-1319
8. Martin C.R. Nanomaterials: a membrane-based synthetic approach. Science 266 (1994) 1961-1966
9. Masuda H., and Fukuda K. Ordered metal nanoholes arrays made by a two-step replication of honeycomb structures of anodic alumina. Science 268 (1995) 1446-1468
10. Scheck C., Liu Y.K., Evans P., Schad R., Bowers A., Zangari G., et al. Photoinduced electrochemical deposition of Cu on p-type Si substrates. Phys Rev B 69 (2004) 035334
11. Sasano J., Schmuki P., Sakka T., and Ogata H.Y. Laser-assisted maskless Cu patterning on porous silicon. Electrochem Solid-State Lett 7 (2004) G98-G101
12. Ji R., Lee W., Scholz R., Gösele U., and Nielsch K. Templated fabrication of nanowire and nanoring arrays based on interference lithography and electrochemical deposition. Adv Mater 18 (2006) 2593-2596
13. Koynov S., Brandt M.S., and Stutzmann M. Metal-induced seeding of macropore arrays in silicon. Adv Mater 18 (2006) 633-636
14. Sasano J., Schmuki P., Sakka T., and Ogata Y.H. Maskless patterning of various kinds of metals onto porous silicon. Phys Status Solidi A 202 (2005) 1571-1575
15. Kurokawa A, Kawamura YL, Sakka T, Ogata YH. Different deposition behavior of copper on silicon and porous silicon surfaces during immersion plating. Phys Status Solidi C, in press.
16. Schmuki P., and Erickson L.E. Selective high-resolution electrodeposition on semiconductor defect patterns. Phys Rev Lett 85 (2000) 2985-2988
17. Santinacci L., Djenizian T., Hildebrand H., Ecoffey S., Mokdad H., Campanella T., et al. Selective palladium electrochemical deposition onto AFM-scratched silicon substrates. Electrochim Acta 48 (2003) 3123-3130
18. Homma T., Kubo N., and Osaka T. Maskless and electroless fabrication of patterned metal nanostructures on silicon wafers by controlling local surface activities. Electrochim Acta 48 (2003) 3115-3122
19. Kubo N., Homma T., Hondo Y., and Osaka T. Fabrication of patterned nanostructures with various metal species on Si wafer surfaces by maskless and electroless process. Electrochim Acta 51 (2005) 834-837
20. Trimmer A.L., Maurer J.J., Schuster R., Zangari G., and Hudson J.L. All-electrochemical synthesis of submicrometer Cu structures on electrochemically machined p-Si substrates. Chem Mater 17 (2005) 6755-6760
21. Allongue P., Kirchner J.V., Trimmer A.L., and Schuster R. Electrochemical micromachining of p-type silicon. J Phys Chem B 108 (2004) 14434-14439
22. Staemmler L., Suter T., and Böhni H. Nanolithography by means of an electrochemical scanning capillary microscope. J Electrochem Soc 151 (2004) G734-G739
23. Staemmler L., Suter T., and Böhni H. Glass capillaries as a tool in nanoelectrochemical deposition. Electrochem Solid-State Lett 5 (2002) C61-C63
24. Polk B.J., Bernard M., Kasianowicz J.J., Misakian M., and Gaitan M. Microelectroplating silver on sharp edges toward the fabrication of solid-state nanopores. J Electrochem Soc 151 (2004) C559-C566
25. Ono S., Oide A., and Asoh H. Nanopatterning of silicon with use of self-organized porous alumina and colloidal crystals as mask. Electrochim Acta 52 (2007) 2898-2904
26. Asoh H., Arai F., and Ono S. Site-selective chemical etching of silicon using patterned silver catalyst. Electrochem Commun 9 (2007) 535-539
27. Chou J., McFarland E.W., and Metiu H. Electrolithographic investigations of the hydrophilic channels in Nafion membranes. J Phys Chem B 109 (2005) 3252-3256
28. Lehmann V. Electrochemistry of silicon (2002), Wiley-VCH, Weinheim
29. Zhang X., Tu K.N., Xie Y.H., and Tung C.H. High aspect ratio nickel structures fabricated by electrochemical replication of hydrofluoric acid etched silicon. Electrochem Solid-State Lett 9 (2006) C150-C152
30. Zhang X., Tu K.-N., Xie Y.-H., Tung C.-H., and Xu S. Single-step fabrication of nickel films with arrayed macropores and nanostructured skeletons. Adv Mater 18 (2006) 1905-1909
31. Sato H., Homma T., Mori K., Osaka T., and Shoji S. Electrochemical formation process of Si macropore and metal filling for high aspect ratio metal microstructure using single electrolyte system. Electrochemistry 73 (2005) 275-278
32. Kobayashi K., Harraz F.A., Izuo S., Sakka T., and Ogata Y.H. Microrod and microtube formation by electrodeposition of metal into ordered macropores prepared in p-type silicon. J Electrochem Soc 153 (2006) C218-C222
33. Harraz F.A., Kamada K., Kobayashi K., Sakka T., and Ogata Y.H. Random macropore formation in p-type silicon in HF-containing organic solutions. J Electrochem Soc 152 (2005) C213-C220
34. Wu M.T., Leu I.C., Yen J.H., and Hon M.H. Preparation of Ni nanodot and nanowire arrays using porous alumina on silicon as a template without a conductive interlayer. Electrochem Solid-State Lett 7 (2004) C61-C63
35. Yesseri A.A., Sharma S., Jung G.Y., and Kamins T.I. Electroless deposition of Au nanocrystals on Si(1 1 1) surfaces as catalysts for epitaxial growth of Si nanowires. Electrochem Solid-State Lett 9 (2006) C185-C188
36. Yesseri A.A., Sharma S., Kamins T.I., Li Z., and Stanley Williams R. Growth and use of metal nanocrystal assemblies on high-density silicon nanowires formed by chemical vapor deposition. Appl Phys A 82 (2006) 659-664
37. Peng K., and Zhu J. Morphological selection of electroless metal deposits on silicon in aqueous fluoride solution. Electrochim Acta 49 (2004) 2563-2568
38. Peng K., Hu J., Yan Y., Wu Y., Fang H., Xu Y., et al. Fabrication of single-crystalline silicon nanowires by scratching a silicon surface with catalytic metal particles. Adv Funct Mater 16 (2006) 387-394
39. Peng K., Wu Y., Fang H., Zhang X., Xu Y., and Zhu J. Uniform, axial-orientation of one-dimensional single-crystal silicon nanostructure arrays. Angew Chem Int Ed 44 (2005) 2737-2742
40. Peng K., Xu Y., Wu Y., Yan Y., Lee S.-T., and Zhu J. Aligned single-crystalline Si nanowire arrays for photovoltaic application. Small 1 (2005) 1062-1067
41. Tsujino K., and Matsumura M. Boring deep cylindrical nanoholes in silicon using silver nanoparticles as a catalyst. Adv Mater 17 (2005) 1045-1047
42. Tsujino K., Matsumura M., and Nishimoto Y. Texturization of multicrystalline silicon wafers for solar cells by chemical treatment using metallic catalyst. Sol Energy Mater Sol Cells 90 (2006) 100-110
43. Tsujino K., and Matsumura M. Helical nanoholes bored in silicon by wet chemical etching using platinum nanoparticles as catalyst. Electrochem Solid-State Lett 8 (2005) C193-C195
44. Brito-Neto J.G.A., Shintaro Araki S., and Hayase M. Synthesis and characterization of porous platinum layers deposited on highly doped n-type porous silicon by immersion plating. J Electrochem Soc 153 (2006) C741-C746
45. Osaka T., Asahi T., Yokoshima T., and Kawaji J. Electroless-deposited soft magnetic underlayer on silicon disk substrate for double-layered perpendicular magnetic recording media. J Magn Magn Mater 287 (2005) 292-297
46. In: Bard A.J., Parsons R., and Jordan J. (Eds). Standard potentials in aqueous solution (1985), Marcel Dekker, New York
47. Harraz F.A., Tsuboi T., Sasano J., Sakka T., and Ogata Y.H. Metal deposition onto a porous silicon layer by immersion plating from aqueous and nonaqueous solutions. J Electrochem Soc 149 (2002) C456-C463
48. Sasano J., Murota R., Yamauchi Y., Sakka T., and Ogata Y.H. Re-dissolution of copper onto porous silicon in immersion plating. J Electroanal Chem 559 (2003) 125-130
49. Hamm D., Sakka T., and Ogata Y.H. Immersion plating of copper onto porous silicon with different thickness. Electrochim Acta 49 (2004) 4949-4955
50. Oh Y.-J., Cho S.M., and Chung C.-H. An in situ ATR-FTIR study on palladium displacement reaction on hydrogen-terminated silicon surface. J Electrochem Soc 152 (2005) C348-C355
51. Harraz F.A., Sasano J., Sakka T., and Ogata Y.H. Different behavior in immersion plating of nickel onto porous silicon from acidic and alkaline fluoride media. J Electrochem Soc 150 (2003) C277-C284
52. Niwa D., Homma T., and Osaka T. Deposition mechanism of Ni on Si(1 0 0) surfaces in aqueous alkaline solution. J Phys Chem B 108 (2004) 9900-9904
53. Niwa D., Homma T., Mori K., and Osaka T. Deposition behavior of Ni on Si(1 0 0) surfaces in an aqueous alkaline solution. J Electrochem Soc 152 (2005) C54-C59
54. Chang Y.L., Ye W.C., Ma C.L., and Wang C.M. The Thermodynamic model of open-circuit potential for electroless deposition of Ni on silicon. J Electrochem Soc 153 (2006) C677-C682
55. Tong H., and Wang C. Electroless deposition of Ag and Pd-activated TiN/p-Si(1 0 0) substrate. Appl Phys A 81 (2005) 137-142
56. Ogata Y.H., Sasano J., Itoh T., Sakka T., Rayón E., Pastor E., et al. Electrochemical oscillation of open circuit potential during immersion plating of copper on silicon. J Electrochem Soc 152 (2005) C537-C541
57. 4 + HF) solution, caused by electroless Cu deposition. Chaos 16 (2006) 037106
58. Scharifker B., and Hills G. Theoretical and experimental studies of multiple nucleation. Electrochim Acta 28 (1983) 879-889
59. Radisic A., Ross F.M., and Searson P.C. In situ study of the growth of individual island electrodeposition of copper. J Phys Chem B 110 (2006) 7862-7868
60. Radisic A., Vereecken P.M., Hannon J.B., Searson P.C., and Ross F.M. Quantifying electrochemical nucleation and growth of nanoscale clusters using real-time kinetic data. Nano Lett 6 (2006) 238-242
61. Williamson M.J., Tromp R.M., Vereecken P.M., Hull R., and Ross F.M. Dynamic microscopy of nanoscale cluster growth at the solid-liquid interface. Nat Mater 2 (2003) 532-536
62. Drews T.O., Radisic A., Erlebacher J., Braatz R.D., Searson P.C., and Alkire R.C. Stochastic simulation of the early stages of kinetically limited electrodeposition. J Electrochem Soc 153 (2006) C434-C441
63. Muñoz A.G., and Staikov G. Electrodeposition of Co on oxide modified p-Si surfaces. Electrochim Acta 51 (2006) 2836-2844
64. Kawamura Y.L., Sakka T., and Ogata Y.H. Photoassisted control of Pt electrodeposition on p-Type Si. J Electrochem Soc 152 (2005) C701-C705
65. Kawamura Y.L., Sakka T., and Ogata Y.H. Illumination-modulated electrodeposition of various kinds of noble metal on p-type silicon. Electrochemistry 74 (2006) 544-548
66. Gómez H., Henríquez R., Schrebler R., Córdova R., Ramírez D., Riveros G., et al. Electrodeposition of CdTe thin films onto n-Si(1 0 0): nucleation and growth mechanisms. Electrochim Acta 50 (2005) 1299-1305
67. 3 films on Si(1 0 0) and Ag substrates. Electrochem Solid-State Lett 9 (2006) C147-C149
68. Osaka T., and Sayama J. A challenge of new materials for next generation's magnetic recording. Electrochim Acta 52 (2007) 2884-2890
69. Zarpellon J., Jurca H.F., Klein J.J., Schreiner W.H., Mattoso N., and Mosca D.H. Iron silicide formation from Fe thin-film electrodeposition on hydrogen-terminated Si(1 1 1). J Electrochem Soc 152 (2005) C808-C812
70. Harraz F.A., Sakka T., and Ogata Y.H. A comparative electrochemical study of iron deposition onto n- and p-type porous silicon prepared from lightly doped substrates. Electrochim Acta 50 (2005) 5340-5348