Metal deposition onto a porous silicon layer by immersion plating from aqueous and nonaqueous solutions

Journal of the Electrochemical Society

Volumn 149, Issue 9, 2002, Pages

  Harraz, F A ^a   Tsuboi, T ^a   Sasano, J ^a   Sakka, T ^a   Ogata, Y H ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DEPOSITION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; MICROSTRUCTURE; NICKEL; NUCLEATION; POROUS SILICON; SCANNING ELECTRON MICROSCOPY; SILVER; SOLUTIONS; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

IMMERSION PLATING; NONAQUEOUS ORGANIC SOLUTION; RESIDUAL WATER EFFECTS;

ELECTROPLATING;

EID: 0036747455     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1498841     Document Type: Article

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