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Volumn 559, Issue , 2003, Pages 125-130

Re-dissolution of copper deposited onto porous silicon in immersion plating

Author keywords

Copper; Dissolved oxygen; Immersion plating; Porous silicon

Indexed keywords

MICROMACHINING; OXIDATION; PLATING; POROUS SILICON; REDOX REACTIONS;

EID: 0242573435     PISSN: 15726657     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-0728(03)00383-8     Document Type: Conference Paper
Times cited : (29)

References (29)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.