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Volumn 559, Issue , 2003, Pages 125-130
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Re-dissolution of copper deposited onto porous silicon in immersion plating
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Author keywords
Copper; Dissolved oxygen; Immersion plating; Porous silicon
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Indexed keywords
MICROMACHINING;
OXIDATION;
PLATING;
POROUS SILICON;
REDOX REACTIONS;
IMMERSION PLATING;
COPPER;
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EID: 0242573435
PISSN: 15726657
EISSN: None
Source Type: Journal
DOI: 10.1016/S0022-0728(03)00383-8 Document Type: Conference Paper |
Times cited : (29)
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References (29)
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