Dynamic microscopy of nanoscale cluster growth at the solid-liquid interface

Nature Materials

Volumn 2, Issue 8, 2003, Pages 532-536

  Williamson, M J ^a   Tromp, R M ^b   Vereecken, P M ^b   Hull, R ^a   Ross, F M ^b  

^a University of Virginia   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; COMPUTER SIMULATION; COPPER; CRYSTAL GROWTH; ELECTRODEPOSITION; ELECTROPLATING; INTERFACES (MATERIALS); NUCLEATION; PROBES; SURFACE MEASUREMENT; TRANSMISSION ELECTRON MICROSCOPY;

DYNAMIC MICROSCOPY; NANOSCALE CLUSTER GROWTH; SCANNING PROBE TECHNIQUES; SOLID-LIQUID INTERFACE;

NANOSTRUCTURED MATERIALS;

ALUMINUM; COPPER; MICROSPHERE;

ADSORPTION; ARTICLE; CHEMICAL MODEL; CHEMICAL STRUCTURE; CHEMISTRY; COMPARATIVE STUDY; COMPUTER SIMULATION; CRYSTALLIZATION; CRYSTALLOGRAPHY; ELECTRIC CONDUCTIVITY; ELECTRON MICROSCOPY; ELECTROPLATING INDUSTRY; EQUIPMENT; EVALUATION; INSTRUMENTATION; ISOLATION AND PURIFICATION; MATERIALS TESTING; METHODOLOGY; MICROSCOPY; MOTION; NANOTECHNOLOGY; PARTICLE SIZE; SOLUTION AND SOLUBILITY; SURFACE PROPERTY; VALIDATION STUDY;

ADSORPTION; ALUMINUM; COMPUTER SIMULATION; COPPER; CRYSTALLIZATION; CRYSTALLOGRAPHY; ELECTRIC CONDUCTIVITY; ELECTROPLATING; EQUIPMENT FAILURE ANALYSIS; MATERIALS TESTING; MICROSCOPY, ELECTRON; MICROSCOPY, VIDEO; MICROSPHERES; MODELS, CHEMICAL; MODELS, MOLECULAR; MOTION; NANOTECHNOLOGY; PARTICLE SIZE; SOLUTIONS; SURFACE PROPERTIES;

EID: 0041784064     PISSN: 14761122     EISSN: None     Source Type: Journal    
DOI: 10.1038/nmat944     Document Type: Letter

References (29)

1. Volmer, M. & Weber, A. Nuclei formation in supersaturated states. Z. Physik. Chem. 119, 277-301 (1926).
2. Burton, W. K., Cabrera, N. & Frank, F. C. The growth of crystals and the equilibrium structure of their surfaces. Phil. Trans. R. Soc. Lond. A 243, 299-358 (1951).
3. Zhang, Z. Y. & Lagally, M. G. Atomistic processes in the early stages of thin-film growth. Science 276, 377-383 (1997).
4. Rosenberg, R., Edelstein, D. C., Hu, C.-K. & Rodbell, K. P. Copper metallization for high performance silicon technology. Annu. Rev. Mater. Sci. 30, 229-262 (2000).
5. Magnussen, O. M., Hotlos, J., Nickols, R. J., Kolb, D. M. & Behm, R. J. Atomic structure of Cu adlayers on Au(100) and Au(111) electrodes observed by in situ scanning tunnelling microscopy. Phys. Rev. Lett. 64, 2929-2932 (1990).
6. Manne, S., Hansma, P. K., Massie. J., Elings, V. B. & Gewirth, A. A. Atomic-resolution electrochemistry with the atomic force microscope: copper deposition on gold. Science 251, 183-186 (1991).
7. Bard, A. J. & Fan, F.-R. Studies of the liquid/solid interface by scanning tunneling microscopy and scanning electrochemical microscopy. Faraday Discuss. 94, 1-22 (1992).
8. Schmidt, W. U., Alkire, R. C. & Gewirth, A. A. Mechanic study of copper deposition onto gold surfaces by scaling and spectral analysis of in situ atomic force microscopic images. J. Electrochem. Soc. 143, 3122-3132 (1996).
9. Schneeweiss, M. A. & Kolb, D. M. Initial stages of copper deposition on Au electrodes. Phys. Status Solidi 173, 51-71 (1999).
10. Hölzle, M. H., Zwing, V. & Kolb, D. M. The influence of steps on the deposition of Cu onto Au(111). Electrochim. Acta 40, 1237-1247 (1995).
11. Randler, R. J., Kolb, D. M., Ocko, B. M. & Robinson, I. K. Electrochemical copper deposition on Au(100): a combined in situ STM and in situ surface x-ray diffraction study. Surf. Sci. 447, 187-200 (2000).
12. Budevski, E., Staikov, G. & Lorenz, W. J. Electrochemical Phase Formation and Growth (VCH, Weinheim/New York, 1996).
13. Gunawardena, G., Hills, G., Montenegro, I. & Scharifker, B. Electrochemical nucleation. Part I. General considerations. J. Electroanal. Chem. 138, 225-239 (1982).
14. Vereecken, P. M., Strubbe, K. & Gomes, W. P. An improved procedure for the processing of chronoamperometric data: application to the electrodeposition of Cu upon (100) n-GaAs. J. Electroanal. Chem. 433, 19-31 (1997).
15. Radisic, A., Long, J. G., Hoffmann, P. M. & Searson, P. C. Nucleation and growth of copper on TiN from pyrophosphate solution. J. Electrochem. Soc. 148, C41-C46 (2001).
16. Sugi, H. et al. Dynamic electron microscopy of ATP-induced myosin head movement in living muscle thick filaments. Proc. Natl. Acad. Sci. USA 94, 4378-4382 (1997).
17. Gai, P. L. Development of wet-environmental TEM for in situ studies of liquid-catalyst reactions on the nanoscale. Microsc. Microanal. 8, 21-28 (2002).
18. Donnelly, S. E. et al. Ordering in a fluid inert gas confined by flat surfaces. Science 296, 507-510 (2002).
19. Teng, H. H., Dove, P. M., Orme, C. A. & De Yoreo, J. J. Thermodynamics of calcite growth: baseline for understanding biomineral formation. Science 282, 724-727 (1998).
20. Sonnenfeld, R. & Hansma, P. K. Atomic-resolution microscopy in water. Science 232, 211-213 (1986).
21. LaGraff, J. R. & Gewirth, A. A. Nanometer-scale mechanism for the constructive modification of Cu single crystals and alkanethiol passivated Au(111) with an atomic force microscope. J. Phys. Chem. 99, 10009-10018 (1995).
22. Keller, T. H., Rayment, T., Klenerman, D. & Stephenson, R. J. Scanning near-field optical microscopy in reflection mode imaging in liquid. Rev. Sci. Instrum. 68, 1448-1454 (1997).
23. Paloczi, G. T., Smith, B. L., Hansma, P. K., Walters, D. A. & Wendman, M. A. Rapid imaging of calcite crystal growth using atomic force microscopy. Appl. Phys. Lett. 73, 1658-1660 (1998).
24. Magnussen, O. M., Polewska, W., Zitzler, L. & Behm, R. J. In-situ video-STM studies of dynamic processes at electrochemical interfaces. Faraday Discuss. 121, 43-52 (2002).
25. De Vries, S. A. et al. Surface atomic structure of KDP crystals in aqueous solution: an explanation of the growth shape. Phys. Rev. Lett. 80, 2229-2232 (1998).
26. Krieger, U. K. et al. Rutherford backscattering to study the near-surface region of volatile liquids and solids. Science 295, 1048-1050 (2002).
27. Hölzle, M. H., Apsle, C. W., Will, T. & Kolb, D. M. Copper deposition onto Au(111) in the presence of thiourea. J. Electrochem. Soc. 142, 3741-3749 (1995).
28. Georgiadou, M., Veyret, D., Sani, R. L. & Alkire, R. C. Simulation of shape evolution during electrodeposition of copper in the presence of additive. J. Electrochem. Soc. 148, C54-C58 (2001).
29. Reimer, L. & Gentsch, P. Superposition of chromatic error and beam broadening in transmission electron microscopy of thick carbon and organic samples. Ultramicroscopy 1, 1-5 (1975).