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Volumn 73, Issue 4, 2005, Pages 275-278

Electrochemical formation process of Si macropore and metal filling for high aspect ratio metal microstructure using single electrolyte system

Author keywords

Electrochemical Nanofabrication; Electrodeposition; Microneedle Array; Silicon Anodization; Single batch Process

Indexed keywords

ANODIC OXIDATION; ARRAYS; ASPECT RATIO; ELECTROCHEMISTRY; ELECTRODEPOSITION; ELECTROLYTES; ETCHING; FILLING; MICROSTRUCTURE; NANOTECHNOLOGY; NICKEL;

EID: 18944378955     PISSN: 13443542     EISSN: None     Source Type: Journal    
DOI: 10.5796/electrochemistry.73.275     Document Type: Article
Times cited : (20)

References (22)
  • 13
    • 18944385904 scopus 로고    scopus 로고
    • U. S. Patent, 5501893
    • F. Laermer and A Schilp, U. S. Patent, 5501893 (1996).
    • (1996)
    • Laermer, F.1    Schilp, A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.